Disclosed is an integrated data center that provides for efficient cooling as well as efficient wire routing. The data center houses electronic equipment stored in clusters of cabinets. The space inside the data center is shared, such as on a leased basis, between multiple different entities who operate their own electronic equipment. To achieve privacy, security, and cooling air flow, one or more layers of a security paneling surround one or more clusters of cabinets to create a secure interior space. This allows access to only authorized personal, prevents people from viewing into the secure interior space, and allows cooling air flow to pass into the secure interior space to cool the electronic equipment. The security paneling comprises sheets of metal with small apertures. Two or more security panels may be arranged with offset apertures to further prevent viewing of the electronic equipment in the secure interior space.

A modular data center (MDC) has an air handling system that air cools a volumetric container and heat-generating equipment contained in externally attached equipment panels. Heat-generating information technology (IT) component(s) are positioned within the volumetric container with a cold aisle defined on one side and a hot aisle defined on another side of the IT component(s). The IT component(s) has air-cooling air passages that fluidly communicate between the cold and the hot aisles. A cooling unit pressurizes the cold aisle with supply air and draws return air from the hot aisle. The equipment panel(s) are externally attached to an exterior wall of the volumetric container. A supply air conduit directs supply air from the cold aisle into the equipment panel(s). A return air conduit directs air warmed by the heat-generating equipment inside the equipment panel into the hot aisle from the equipment panel(s) that receives the supply air.

A heat dissipation structure capable of improving heat dissipation efficiency and regulating temperature distribution of a surface of a housing is provided. A heat dissipation structure 300 is provided in a housing 200 that accommodates a heat generating source 102 therein, the heat dissipation structure 300 including: top surface parts 213 and 223 opposed to each other, in which the top surface part 213 includes a plurality of concave-shaped parts 213B-F that are aligned, the top surface part 223 includes a plurality of concave-shaped parts 223B-F that are aligned, the concave-shaped parts 213B-F of the top surface part 213 are opposed to the concave-shaped parts 223B-F of the top surface part 223, outlets 213A are formed in the concave-shaped parts 213D, 213E, and 213F, and outlets 223A are formed in the concave-shaped parts 223C, 223D, 223E, and 223F.

A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.

This connector is provided with: an apparatus-side connector (70) attached to an apparatus having a case (90); and a wire-side connector (20) to which a protective pipe (11) that protects a wire (10) is attached. A through hole (27) is formed inside the wire-side connector (20). A through hole (78) is formed inside the apparatus-side connector (70). When the wire-side connector (20) and the apparatus-side connector (70) are normally fitted, an air passage (60) communicating the inner space (S2) of the case (90) of the apparatus and the inner space (S1) of the protective pipe (11) through the through hole (27) and the through hole (78) is formed inside the wire-side connector (20) and the apparatus-side connector (70).

A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.

An electronic device and method are disclosed herein. The electronic device includes a processor, a temperature sensor, a main board on which the processor and the temperature sensor are mounted, a main body including a first surface and a second surface, an input device disposed on the first surface and the main board disposed on the second surface, wherein the first surface and second surface define a hollow in which the main board is disposed, a display, height adjuster disposed between the first and second surfaces and including a connection terminal connected to the processor, an extendable bar connected to the connection terminal, and a spacer connected to the extension bar. The processor implements the method, including in response to receiving a detection signal from the temperature sensor, control actuation of the height adjuster to cause expansion or contraction of the hollow by movement of the first and second surfaces.

A cooling system for a high voltage electromagnetic induction device, includes: at least one duct filled with a first coolant and surrounded by a second coolant, each being routed along a direction of natural convection; at least one group of fans, each fan of the group being mounted along a respective duct of the at least one duct along the direction of natural convection and being configured to blow for the-second-coolant-forced cooling; at least one group of electric motors, each electric motor being configured to operate a respective fan of the at least one group of fans; at least one group of switches, each switch being configured to control a respective electric motor of the at least one group of electric motors. A method of cooling a high voltage electromagnetic induction device is also provided. By using the option of operating fans with higher cooling rate, because of the less fans are operating, the predetermined cooling capacity can be reached with lower power consumption.

Techniques arrange a disk, a storage device, and a disk array. Such techniques involve: a bracket configured to be detachably coupled to a rack; and a button arranged in the bracket and configured to be movable under the action of an external force to decouple the bracket from the rack, wherein a first end of the button is configured to be operated by a user, and the end surface of the first end includes a first surface and a second surface, the second surface extending from the first surface towards a second end, opposite to the first end, of the button. Accordingly, such techniques not only can avoid accidental touch, improve heat dissipation efficiency, and provide a mark area, but also can help prevent loss of user data in a storage device and a disk array.

Various implementations disclosed herein include a thermal management system suitable electronic devices. In some implementations, a thermal management system includes an air guide and a cage wall, which together provide: an air intake having a first airflow area to produce a first air pressure; an airflow constriction, following the air intake, having a second airflow area smaller than the first airflow area to produce a second air pressure, and defining a first region; and an outlet following the airflow constriction having a third airflow area greater than the second airflow area to produce a third air pressure. The device cage has at least one aperture in the first region. The second air pressure is less than the first air pressure and the third air pressure and is sufficiently low to draw heated air from within the device cage through the at least one aperture to be expelled through the outlet.