A projector includes a first cooling device configured to cool a first cooling target based on transformation of a refrigerant into gas, a second cooling device configured to cool a second cooling target, and a heat conduction member. A refrigerant generator of the first cooling device includes a moisture absorbing and desorbing member, a first blower, a heat exchanger, and a second blower configured to send the air to the heat exchanger. The second cooling device includes a third blower and a circulation path through which the air circulates between the third blower and the second cooling target. The heat conduction member includes a heat absorber configured to absorb heat radiated from the second cooling target and a heat dissipator disposed on the inside of the first cooling device. The heat radiated from the heat dissipator is transferred to the moisture absorbing and desorbing member.

An electronic device includes proximity sensor, a memory and a processor. The proximity sensor is positioned within an enclosure of the electronic proximate to one or more air vents. The proximity sensor generates a sensing signal to detect blockage of the one or more air vents. Based on a response to the sensing signal, the proximity sensor generates an output signal indicating that one or more air vents is blocked. The processor is configured to execute computer-readable instructions stored in memory to receive the output signal from the proximity sensor indicating blockage of the one or more air vents is detected, and, in response to receiving the output signal from the proximity sensor indicating blockage of the one or more air vents is detected, forward, to one of a network device, a user device, and a service provider, a notification of the blockage of the one or more air vents.

A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is slidably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

In some embodiments, a computer system chassis comprises a chassis side having an antenna portion and a fan portion. The antenna portion is located closer to an antenna located on an external surface of the chassis side than the fan portion. The antenna and fan portions comprise ventilation holes that provide for the venting of heated air from the chassis interior to the surrounding environment. In some embodiments, the ventilation holes in the antenna portion are thicker than the ventilation holes in the fan portion. The thicker ventilation holes provide an adequate level of EMI shielding for the antenna from platform noise generated by components (CPUs, GPUs, memories, etc.) located in the chassis interior. In other embodiments, the antenna portion comprises alternating positive and negative cross pattern ventilation holes and provides an adequate level of EMI shielding with the antenna portion ventilation holes having the same thickness as the fan portion ventilation holes.

A home appliance is provided that may include a first air flow path included in a heat sink, and a second air flow path defined at a lower side of the heat sink, such that air flows to inside and outside of the heat sink efficiently. A plurality of heat dissipation fins may protrude downward from a wall of the second air flow path, increasing a contact surface between the heat sink and air. A projection may be formed on at least one of the walls of the first air flow path, the walls of the second air flow path, an outer surface of the plurality of heat dissipation fins, or an upper surface of the heat sink.

A portable electronic device with a movable door cover including a host, at least one door cover pivoted to the host to be opened or closed relative to the host, at least one linking member connected to the door cover, a shape-memory alloy (SMA) spring connected between the linking member and the host, and a heat source disposed in the host is provided. The SMA spring is affected by heat generated from the heat source to form at least two stretching states, and drives the door cover through the linking member to form at least two states including said being opened or closed.

A notebook cooler with a pressurizing function comprises a cooler body and one or more soft sealing elements detachably disposed on the cooler body. A notebook is placed on the soft sealing element, an airtight space is defined by the bottom of the notebook, the soft selling element and the cooler body, and a cooling fan is disposed in the airtight space. The circular soft sealing element is laid on the notebook cooler, so that an airtight space is defined by the bottom of the notebook, the soft sealing element and the cooler body; a turbofan sucks air from the bottom of the cooler and presses the air into the airtight space; and the cooler can press air into the notebook via cooling holes in the bottom of the notebook to effectively accelerate air circulation in the notebook, so that elements in the notebook can be rapidly cooled.

A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with phase change liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the two phase liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. An air mover generates pressure differential within the containment passageway to direct the vapor towards the condenser.

A computing device includes a cooling device and a cooling activity monitor configured to assess a cooling activity of the cooling device. A cooling activity reporter is configured to, based at least in part on the cooling activity of the cooling device crossing a predefined cooling activity threshold, communicate a cooling activity indication to a resource manager of the computing device.

A modular enclosure for housing various computing devices is provided. The modular enclosure includes a platform and a housing module mounted on the base module. The housing module has lateral sides, a front side, a rear side and a roof defining an interior volume for receiving the various computing devices and fan cassettes. Each fan cassette is provided with its own controller which is configured to adjust the rotational speed of the fan based on the power consumption of the one or more computing devices. When connected in a cluster, the fan cassettes provide a N+1 redundancy, wherein each cassette as an adjacent fan cassette configured as an active backup. The fan cassettes of a cluster communicate via a communication bus. The fan cassettes may include dampers to redirect air drawn from the computing devices back toward them in cold whether conditions, or toward the outdoors, in hot weather conditions.