An electronic apparatus includes: a board accommodating portion that accommodates a board in a horizontally placed state, the board accommodating portion provided inside a housing; an intake opening provided in a right side plate of the housing and communicating with the board accommodating portion; an exhaust opening provided in a rear plate of the housing; a cooling fan provided in such a way as to face the exhaust opening; and a backboard that is a partition between the board accommodating portion and a fan accommodating portion that accommodates the cooling fan, in which a left side portion and a right side portion of the backboard have a left side vent and a right side vent through which the board accommodating portion and the fan accommodating portion communicate with each other.

A method for cooling a device such as an electric motor drive or a general power converter, said device comprising a heatsink, electronic components connected to the heatsink, a heat pipe connected to the heatsink, an inlet air temperature measuring device and a cooling fan. According to the method, the drive establishes whether the inlet air temperature is below a first temperature threshold value and operates the cooling fan at a low inlet air temperature speed regime if the inlet air temperature is below the first temperature threshold value. The invention is also directed at a device such as an electric motor drive or a general power converter for performing the cooling method.

A rack cooling system includes a primary cooling condenser and a secondary cooling condenser. The primary cooling condenser is positioned above servers of a server rack and the secondary cooling condenser is position above the primary cooling condenser. Each of the severs, the primary cooling condenser, and the secondary cooling condenser is connected to a liquid manifold via one of a plurality of liquid ports on the liquid manifold, and to the vapor manifold via one of a plurality of vapor ports on the vapor manifold. A cooling capacity of the rack cooling system can be extended by switching on a vapor flow between the secondary cooling condenser and the primary cooling condenser using a first valve on the vapor manifold. Further, a second valve on a primary cooling loop can be used to control cooling fluid flowing into the secondary cooling condenser after the first valve is trigged open.

A method includes measuring a plurality of temperatures corresponding to a plurality of servers located in a data center, determining a subset of the plurality of servers as high-temperature servers based on the plurality of temperatures, and reassigning tasks from at least a portion of the subset of the plurality of servers to one or more other servers of the plurality of servers.

A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).

A method for cooling a display assembly includes forcibly circulating gas about an airflow pathway extending within a housing and extending along opposing sides of an image assembly is provided. Ambient air is ingested into the housing through an intake, passed within the housing in a manner which provides thermal interaction with the circulating gas in said airflow pathway, and exhausted from the housing through an exhaust to change a temperature of the circulating gas.

An electronic device (10) with a liquid cooling mechanism includes an electronic device body (1), a heat dissipation module (2) and a liquid cooling module (3). The electronic device body (1) includes a housing (11) and at least one heat generating element (12) installed in the housing (11). The heat dissipation module (2) is contained in the housing (11) and attached to the heat generating element (12). The liquid cooling module (3) includes a liquid cooling pipe (31) contained in the housing (11) and attached to the heat dissipation module (2), and two ends of the liquid cooling pipe (31) have two interface portions (311) exposed from the housing (11). In this way, the liquid cooling pipe (31) is used for water cooling to achieve a desirable cooling efficiency for the electronic device (10).

Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprise at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy include transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.

A mobile image pickup device includes an imaging unit (20), an acceleration and angular velocity detecting unit, a processing unit that processes acceleration and angular velocity information which is detected by the acceleration and angular velocity detecting unit, a reaction wheel that rotates based on a command value which is calculated by the processing unit, and a housing (10) that accommodates the imaging unit (20), the acceleration and angular velocity detecting unit, the processing unit, and the reaction wheel therein.

A chassis includes a chassis body and an installation frame, and the chassis body has a channel that passes through a first end and a second end that are of the chassis body. The installation frame is slidably disposed in the channel of the chassis body. The installation frame has a first part facing the first end of the chassis body and a second part facing the second end of the chassis body; and the first part is capable of sliding out from the first end of the chassis body, and the second part is capable of sliding out from the second end of the chassis body.