An immersion cooling system includes a cooling tank and a filtration system. The cooling tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The filtration system includes a pipeline, a pump, a filter and a cooling device. The pipeline is in fluid communication with the cooling tank. The pump is disposed in the pipeline and is configured to drive the liquid coolant to flow through the pipeline. The filter is disposed in the pipeline and is configured to filter the liquid coolant. The cooling device is connected to the pipeline and is configured to cool the liquid coolant. The pipeline has an inlet connected to the cooling tank. The cooling device is located between the pump and the inlet of the pipeline.

Information handling system (IHS) component immersion cooling systems and methods employ an apparatus having an IHS component immersion cooling flow passage housing disposed at (a) IHS component(s) of an IHS disposed in an immersion cooling tank. The IHS component immersion cooling flow passage housing has an immersion fluid inlet open to immersion fluid within tank and an immersion fluid outlet connected to a return line of an immersion fluid pump. The IHS component cooling apparatus flow passage housing may be a cold plate or a ducted heatsink disposed on, or about, the IHS component(s) of the IHS disposed in the immersion cooling tank. The immersion fluid pump may be the pump that also circulates the immersion fluid within the tank. The tank may include a manifold in fluid flow communication with the pump. This manifold may receive a plurality of return lines, each from an IHS component cooling apparatus.

The present invention discloses a thermally insulated, rigid cabinet, which comprises a top cover, four tri-layer side walls and a tri-layer base. The top cover, the four tri-layer side walls and the tri-layer base are connected with and fixed to one another by aluminum extrusion fixing assemblies. The tri-layer structure includes an inner honeycomb panel, a middle strengthening assembly and an outer wall panel. The middle strengthening assembly is formed by a plurality of horizontal tension rods and a plurality of vertical tension rods intersecting. The inner honeycomb panel has a hexagonal-celled hollow geometric structure, which confers the panel with such properties as high pressure-endurable strength, light weight, excellent rigidity and high structural stability. In addition, the hexagonal hollow cells can also make the honeycomb panel capable of better thermal insulation by preventing the air flow.

Information handling system (IHS) component immersion cooling systems and methods may employ a cold plate disposed on one or more IHS components of an IHS disposed in an immersion cooling tank and an immersible immersion fluid pump adapted to be deployed in the immersion cooling tank, the immersible immersion fluid pump in fluid flow communication with the cold plate, directing flow of immersion fluid in the immersion cooling tank to the cold plate. The immersible immersion fluid pump may be disposed on the cold plate or in an equipment bay of the IHS. A manifold may distribute flow from first and/or second immersible immersion fluid pump(s) to first and second cold plates. Power, etc. may be provided to the immersible immersion fluid pump via (a) fan connection(s) provided by the IHS. Tubing may extend from an outlet of the cold plate away from other components of the IHS.

Liquid submersion cooled electronic devices and systems are described that use one or more cooling liquids, for example one or more dielectric cooling liquids, to submersion cool individual electronic devices or an array of electronic devices. A clamshell or sandwich construction of the device housing is used to define a wet zone containing heat producing electronic components of the electronic device to be cooled by the dielectric cooling liquid, and a dry zone where input/output and power connectors are provided.

Thermal regulation device intended for at least one electrical component whose temperature must be regulated, the thermal regulation device including at last a housing, a cover affixed to said housing and a first circuit, configured to allow circulation of a dielectric fluid. The housing includes at least a plurality of lateral walls delimiting an internal volume of the housing in which at least the electrical component extends. The first circuit includes at least one dielectric fluid supply duct formed between the housing and the lid, at least one of the lateral walls and/or the bottom wall having at least one orifice for spraying the dielectric fluid into the internal volume, which is fluidically connected at least to the supply duct.

An energy management unit (EMU) is disclosed. The EMU including: a cold plate sandwiched between a first printed circuit board (PCB) and a second PCB, the cold plate comprising one or more magnetics; wherein the cold plate is configured to cool both the first PCB and the second PCB.

A subsea power module including: a tank having a tank wall provided with an outwardly protruding corrugation, a power device arranged in the tank, a dielectric liquid which fills the tank, for cooling the power device, a pump configured to circulate the dielectric liquid in the tank, wherein the pump has a pump inlet and a pump outlet, a duct arranged in the corrugation such that a chamber is formed between a tip of the corrugation and the duct, wherein the duct has a duct inlet connected to the pump outlet, and wherein the duct is provided with at least one duct outlet opening into the chamber, and a distancing structure configured to space apart an outer surface of the duct facing the tank wall and the tank wall in the corrugation, whereby gaps are formed between the duct and the tank wall in the corrugation, enabling dielectric liquid that has been discharged through the at least one duct outlet into the chamber to be squeezed out from the chamber and the corrugation, and flow towards the pump inlet.

Implementations of a semiconductor package may include one or more power semiconductor die included in a die module; a first heat sink directly coupled to one or more source pads of the die module; a second heat sink directly coupled to one or more drain pads of the die module; a gate contact coupled with one or more gate pads of the die module; and a coating coupled directly to the die module. The gate contact may be configured to extend through an immersion cooling enclosure.

An immersion cooling system includes a first casing, a plurality of fins, a liquid-cooled pipeline, and a liquid-cooled system. The first casing is used for containing a dielectric liquid in which a heat-generating component is immersed. The plurality of fins are disposed on and located outside the first casing. The liquid-cooled pipeline containing a coolant is attached to the first casing. The liquid-cooled system is disposed outside the first casing and connected with the liquid-cooled pipeline to remove heat from the coolant in the liquid-cooled pipeline. The immersion cooling system dissipates heat through two heat exchange mechanisms, that is, natural convection heat loss and heat absorption by liquid cooling.