A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways. The plurality of accumulator channels extends transversely relative to and are fluidly coupled with the plurality of boiling channels. The vapor manifold is configured to collect vapor from one or more of the plurality of boiling channels, one or more of the plurality of accumulator channels, or both. The first heat-transfer component further defines an outlet fluidly coupling the vapor manifold with the second conduit. Electrical devices incorporating such a heat-transfer device also are disclosed, as well as associated methods.

Cooling devices for cooling electronic components with liquid cooling and associated methods thereof are disclosed. According to an aspect, a device includes a housing that defines an interior space. The device also includes an electronic component positioned in the interior space. The device also includes a liquid cooling component configured to engage the housing and the electronic component for cooling the electronic component and the interior space.

A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways. The plurality of accumulator channels extends transversely relative to and are fluidly coupled with the plurality of boiling channels. The vapor manifold is configured to collect vapor from one or more of the plurality of boiling channels, one or more of the plurality of accumulator channels, or both. The first heat-transfer component further defines an outlet fluidly coupling the vapor manifold with the second conduit. Electrical devices incorporating such a heat-transfer device also are disclosed, as well as associated methods.

A power converter comprises: a housing which has an inner space part formed therein; an electronic component which is disposed in the space part and generates heat due to the operation thereof; and a heat dissipating member a part of which is disposed on the electronic component and the other part of which is disposed at the inner surface of the housing, wherein the heat dissipating member comprises: a frame; a heat dissipating pipe disposed at one surface of the frame; and a thermal pad disposed between the heat dissipating pipe and the electronic component or between the heat dissipating pipe and the inner surface of the housing.

Heat transfer systems and methods are provided. The heat transfer system includes an evaporator section integrated with or thermally joined to a heat dissipating system. The evaporator section is connected to a condenser section by a conduit. Together, portions of the evaporator section, the condenser section, and the conduit form a closed volume containing a heat transfer fluid. A superhydrophobic surface is present on at least a portion of the condenser section forming a part of the closed volume. The superhydrophobic surface can include a plurality of carbon nanotubes. The carbon nanotubes can be provided as a forest of carbon nanotubes extending from a rough surface.

An example automated driving system computer can include a board, one or more processors coupled to the board, a first layer of a first thermal interface material applied on the one or more processors, a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, a second layer of a second thermal interface material applied on the second side of the heat spreader, and a cold plate in contact with the second layer of the second thermal interface material.

A pumpless liquid-cooling heat dissipator includes a cooling head assembly and a condensing assembly. The cooling head assembly and the condensing assembly are connected through the connecting assembly to form a loop. The cooling head assembly and the condensing assembly both are filled with a liquid refrigerant. The use of refrigerant as a cooling medium is more effective compared with the water cooling, has better overall heat dissipation, and can overcome disadvantages of complex wiring of the water-cooling heat dissipator and poor heat dissipation of the heat pipe, and thus can quickly cool down the temperature of component. Compared with the existing water-cooling heat dissipator, the structure is simpler, the circulating cooling can be realized without mechanical drive e.g., water pump, and there is no extension of excess water pipe, which is more convenient for installation and makes the computer case cleaner.

A method and an extraction system for extracting an electronic device from a container filled with an immersion cooling liquid are disclosed. The extraction system includes a lifting device for lifting the electronic device from an open end of the container, a liquid dispersing device for dispersing immersion cooling liquid from the electronic device by generating an air flow, and a nozzle configured to be positioned above the open end of the container to limit a spread of immersion cooling liquid caused by the liquid dispersing device.

A heat sink for collecting thermal energy from a heat generating component. The heat sink comprises a base comprising a thermal transfer surface configured to be placed in thermal contact with the heat-generating component, an external surface opposite from the thermal transfer surface and an inlet side of the base extending between an edge of the thermal transfer surface and an edge of the external surface and a plurality of fins extending from the external surface. The fins define a plurality of fin passages therebetween, at least one fin of the plurality of fins having non-straight longitudinal edges extending along the external surface and defining at least in part at least one non-straight fin passage.