A compartment for a space vehicle includes a pressurized structure having a structural wall, the structural wall having interior surfaces facing an interior of the compartment and exterior surfaces exposed to an external environment. An internal mounting structure for mounting a component is provided within the compartment, and mounting features support the internal mounting structure from the pressurized structure. The internal mounting structure is spaced away from the interior surfaces of the pressurized structure, and a thermal fluid is provided in the pressurized structure. The thermal fluid enables convective heat transfer between the component mounted on the internal mounting structure and the interior surfaces of the pressurized structure.

A liquid cooled semiconductor package and method for forming a liquid cooled semiconductor package is described. The device includes at least one semiconductor device mounted on a substrate. An impermeable housing is disposed on the substrate with an internal cavity. A liquid coolant is within the internal cavity such that the coolant immerses at least one semiconductor device.

The present invention is related to an immersive cooling unit (1), comprising at least one closed heating channel (2), defined by at least one circumferential heating channel wall having a start and an end, accommodating one or more printed circuit boards (10), comprising one or more heat dissipating electronic components (5), at least one closed cooling channel (3), defined by at least one circumferential cooling channel wall (6), wherein a start of the cooling channel (3) is connected to an end of the heating channel (2), and wherein an end of the cooling channel (3) is connected to the start of the heating channel (2) such that a closed circuit is formed between the channels (2,3), a liquid coolant, for cooling the electronic components (5), said coolant at least filling the channels (2, 3) and submerging the printed circuit board (10), wherein the channels (2, 3) each allow a coolant flow having at least a vertical component wherein at least a portion (7) of the cooling channel wall (6) is formed by a heat conducting material, said portion (7) allowing an exchange of heat between a part of the coolant in contact with an interior side of said cooling channel wall portion (7) and a surrounding (8) in contact with an exterior side of said cooling channel wall portion (7). The invention is further related to a cooling unit (1) and a holder (15), and a method for using the cooling unit (1).

An example system includes an enclosure housing electronics that generate heat. The enclosure includes a vent leading to an exterior of the enclosure. The vent is configured to allow the heat generated by the electronics to escape to the exterior. The enclosure includes an inlet configured to direct air into the enclosure. The vent and the inlet are arranged so that the heat escaping from the vent suctions the air through the inlet. The example system also includes a radiator having an input port and an output port. The input port is located exterior to the enclosure and the output port is connected to the inlet so that the air suctioned through the inlet causes air from the exterior to enter the radiator through the input port and to pass to the output port. The radiator is submerged, at least in part, in a coolant.

An example system includes an enclosure housing electronics that generate heat. The enclosure includes a vent leading to an exterior of the enclosure. The vent is configured to allow the heat generated by the electronics to escape to the exterior. The enclosure includes an inlet configured to direct air into the enclosure. The vent and the inlet are arranged so that the heat escaping from the vent suctions the air through the inlet. The example system also includes a radiator having an input port and an output port. The input port is located exterior to the enclosure and the output port is connected to the inlet so that the air suctioned through the inlet causes air from the exterior to enter the radiator through the input port and to pass to the output port. The radiator is submerged, at least in part, in a coolant.

An arrangement for cooling components of a subsea electric system including a tank filled with a dielectric fluid. The tank includes first and second sections. The arrangement includes one first electric component within the first section, and one second electric component within the second section. The arrangement includes a first heat exchanger located outside the tank and in fluid contact with the tank, and arranged during operation to be in thermal contact with sea water. The arrangement includes a pump arranged to force a flow of dielectric fluid through the first heat exchanger. Flow of dielectric fluid in the tank is by both natural and forced convection generated by the pump. The first electric component generates more heat than the second electric component. Within the first section the share of the flow by natural convection is greater than within the second section.

Passive on-board aircraft cooling systems are provided with an evaporator/receiver in heat-exchange relationship with at least one heat source on board the aircraft, the evaporator/receiver containing a liquid phase working fluid which changes state to a vapor phase working fluid in response to heat transfer therefrom from the at least one heat source. First and second condensers are fluid-connected to the evaporator/receiver for receiving vapor phase working fluid from the evaporator/receiver. At least a portion of the vapor phase working fluid transferred to the first and second condensers is condensed by heat transfer between the first and second condensers and aircraft-external unpressurized and aircraft-internal pressurized air supply streams, respectively, to thereby form liquid phase working fluid which returns to the evaporator/receiver by virtue of the fluid connection with the first and second condensers.

Device (1) for cooling at least one power electronics circuit (4), including: a liquid-cooled heatsink (2); and an interface plate (3) that is in thermal contact with the heatsink (2) and to which the one or more power electronics circuits (4) are attached, the interface plate (3), including at least one thermosiphon (6), being removably mounted on the heatsink (2) so as to be capable of being separated therefrom with the one or more electronic circuits (4) attached thereto.

An example automated driving system computer can include a board, one or more processors coupled to the board, a first layer of a first thermal interface material applied on the one or more processors, a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, a second layer of a second thermal interface material applied on the second side of the heat spreader, and a cold plate in contact with the second layer of the second thermal interface material.

A thermosiphon system includes a condenser and an evaporator fluidly coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.