A cooling system, in particular for electronics cabinets, is proposed, comprising a casing, wherein the casing comprises at least a cabinet side partitionment, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, wherein the second cooling circuit is an active cooling circuit, wherein the first cooling circuit and the second cooling circuit are thermally coupled, wherein the second cooling circuit is not disposed in the cabinet side partitionment.

A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

An imaging system is provided that includes a pixelated detector and a processing unit. The pixelated detector has individually read pixels. The processing unit is configured to count events detected by the detector unit using an energy window for each pixel. The energy window is individually tailored for each pixel, and is defined by an upper energy boundary corresponding to a higher energy level and a lower energy boundary corresponding to a lower energy level. At least one of the upper energy boundary or the lower energy boundary of the energy window is adjusted based on acquired events. The processing unit adjusts the at least one of the upper energy boundary or the lower energy boundary of the energy window for a given pixel before counting the events for the given pixel.

Device (1) for cooling at least one power electronics circuit (4), including: a liquid-cooled heatsink (2); and an interface plate (3) that is in thermal contact with the heatsink (2) and to which the one or more power electronics circuits (4) are attached, the interface plate (3), including at least one thermosiphon (6), being removably mounted on the heatsink (2) so as to be capable of being separated therefrom with the one or more electronic circuits (4) attached thereto.

A cooling device includes: an inner tank configured to store a first coolant which is a liquid; a separation wall that is provided in the inner tank, that faces a side wall portion of the inner tank, that forms an accommodating portion in which an electronic device to be immersed in the first coolant is accommodated, and that forms, at at least part of a periphery of the accommodating portion, a coolant channel through which the first coolant is to flow toward a lower side of the inner tank; an outer tank which is disposed outside the inner tank and through which a second coolant flows; and a heat transfer unit that is provided between the inner tank and the outer tank and that is configured to transfer heat from the first coolant to the second coolant.

A device comprising heat producing electronic components (2), such as server memory boards, processors and/or switches, said device comprising a container (1) wherein said heat producing components are mounted, a liquid in said container in which liquid said components are submerged for extracting heat from said components, at least one heat exchanger (7) having a surface which is in contact with said liquid and arranged to extract heat from said liquid, wherein between said heat exchanger and said components a vertical wall (6) is present for guiding and separating a vertical circulation of said liquid in said container which is caused by a temperature difference in said liquid.

An electronic device includes: a heat generating component; a board disposed in a vertical direction, the heat generating component mounted on a first surface of the board; a first thermally conductive member superposed on a second surface of the board opposite the first surface of the board; a plurality of second thermally conductive members extending in a horizontal direction from a first surface of the first thermally conductive member; a third thermally conductive member facing the first surface of the board, the third thermally conductive member secured to the distal end portions of the plurality of second thermally conductive members; a housing including a first wall portion superposed on a second surface of the first thermally conductive member, and a second wall portion opposite the first wall portion; and a heat sink provided on an outer surface of the second wall portion.

A liquid cooled semiconductor package and method for forming a liquid cooled semiconductor package is described. The device includes at least one semiconductor device mounted on a substrate. An impermeable housing is disposed on the substrate with an internal cavity. A liquid coolant is within the internal cavity such that the coolant immerses at least one semiconductor device.

A thermosyphon having an evaporator, a condenser having a condenser liquid pool accumulated at the bottom thereof creating a condenser liquid pool surface, a vapor tube fluidly coupling the evaporator to the condenser, and a liquid tube fluidly coupling the condenser to the evaporator, wherein the liquid tube apex is above the condenser liquid pool surface, thereby trapping vapor and preventing liquid from passing from the condenser to the evaporator. The application of heat to the evaporator increases the total system internal temperature and pressure causing condensation of the vapor in the liquid tube. As the liquid level in the liquid tube increases above the lower interior surface of the apex of the liquid tube, the liquid tube is primed thereby creating the pressure head needed to overcome the hydrodynamic losses inside the thermosyphon. Various embodiments allow passive start-up, regardless of the initial distribution of liquid inside the thermosyphon.

A liquid cooled semiconductor package and method for forming a liquid cooled semiconductor package is described. The device includes at least one semiconductor device mounted on a substrate. An impermeable housing is disposed on the substrate with an internal cavity. A liquid coolant is within the internal cavity such that the coolant immerses at least one semiconductor device.