H05K7/20245

A Device Comprising Heat Producing Components with Liquid Submersion Cooling
20180343770 · 2018-11-29 ·

A device comprising heat producing electronic components (2), such as server memory boards, processors and/or switches, said device comprising a container (1) wherein said heat producing components are mounted, a liquid in said container in which liquid said components are submerged for extracting heat from said components, at least one heat exchanger (7) having a surface which is in contact with said liquid and arranged to extract heat from said liquid, wherein between said heat exchanger and said components a vertical wall (6) is present for guiding and separating a vertical circulation of said liquid in said container which is caused by a temperature difference in said liquid.

Power conversion device

A power conversion device includes a casing, a structural plate, a converter module, an auxiliary circuit board module and a top cover. The casing includes a base plate and a side wall, and the base plate and the side wall form a chamber. The structural plate is located in the chamber. The converter module is located between the base plate and the structural plate. The auxiliary circuit board module is located at a side of the structural plate in the chamber away from the base plate, and is electrically connected with the converter module. The top cover seals the chamber.

Natural convection cooling for power electronics systems having discrete power dissipation components

A power electronics based system using natural, convection cooling, includes an enclosure housing a plurality of discrete components distributed in a vertical direction from a bottom portion to a top portion of the enclosure and having a heat density weighted average center at a first height along the vertical direction. There is a heat exchanger adjacent to the enclosure, including an inlet port and an outlet port in fluid communication with the enclosure. The heat exchanger has a vertical cooling average center at a second height. There is a cooling fluid disposed in the enclosure and in the heat exchanger to cool the discrete components. The discrete components are positioned in the vertical direction in the enclosure such that the first height of the heat density weighted average center along the vertical direction is below the second height of the vertical cooling average center of the heat exchanger.

AN IMMERSION COOLING SYSTEM
20180288906 · 2018-10-04 ·

A cooling system for cooling of a heat generating electrical component, in particular to reduce the likelihood of overheating of electrical components or chemical breakdown of coolant fluid. The cooling system has a coolant liquid to absorb excess energy from the heat generating electrical component, the coolant liquid having an energy input threshold above which chemical breakdown of the coolant liquid occurs. A cooling module defines a volume containing the coolant liquid, wherein the heat generating electrical component is mounted within the volume and immersed in the coolant liquid. A power input is arranged to supply power into the cooling module to the heat generating electrical component, and a power regulator is provided external to the volume of the cooling module and connected to the power input so as to regulate the power supplied into the cooling module. Cooling systems are also described having coolant liquid comprising dissolved oxygen, having at least one element arranged within the volume comprising aluminium and/or aluminium oxide, and/or having a sealed volume with at least one seal which opens at a predetermined pressure or temperature corresponding to a temperature below the temperature at which the coolant liquid breaks down.

TEMPERATURE STABILIZATION FOR DETECTOR HEADS
20180275293 · 2018-09-27 ·

An imaging system is provided that includes a pixelated detector and a processing unit. The pixelated detector has individually read pixels. The processing unit is configured to count events detected by the detector unit using an energy window for each pixel. The energy window is individually tailored for each pixel, and is defined by an upper energy boundary corresponding to a higher energy level and a lower energy boundary corresponding to a lower energy level. At least one of the upper energy boundary or the lower energy boundary of the energy window is adjusted based on acquired events. The processing unit adjusts the at least one of the upper energy boundary or the lower energy boundary of the energy window for a given pixel before counting the events for the given pixel.

COOLING DEVICE
20240332865 · 2024-10-03 ·

A cooling device includes a first component, a second component, and a shielding portion. The first component cools a heat generating component. The second component is different from the first component. The shielding portion performs shielding between the first component and the second component. The shielding portion includes a conductive material.

Cooling system in electronics cabinet comprising thermally coupled cooling circuits
12096602 · 2024-09-17 · ·

A cooling system, in particular for electronics cabinets, is proposed, comprising a casing, wherein the casing comprises at least a cabinet side partitionment, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, wherein the second cooling circuit is an active cooling circuit, wherein the first cooling circuit and the second cooling circuit are thermally coupled, wherein the second cooling circuit is not disposed in the cabinet side partitionment.

NATURAL CONVECTION COOLING FOR POWER ELECTRONICS SYSTEMS HAVING DISCRETE POWER DISSIPATION COMPONENTS

A power electronics based system using natural, convection cooling, includes an enclosure housing a plurality of discrete components distributed in a vertical direction from a bottom portion to a top portion of the enclosure and having a heat density weighted average center at a first height along the vertical direction. There is a heat exchanger adjacent to the enclosure, including an inlet port and an outlet port in fluid communication with the enclosure. The heat exchanger has a vertical cooling average center at a second height. There is a cooling fluid disposed in the enclosure and in the heat exchanger to cool the discrete components. The discrete components are positioned in the vertical direction in the enclosure such that the first height of the heat density weighted average center along the vertical direction is below the second height of the vertical cooling average center of the heat exchanger.

Temperature stabilization for detector heads
10054698 · 2018-08-21 · ·

An imaging system is provided that includes a gantry, plural radiation detector head assemblies, a cooling unit, and a manifold. The radiation detector head assemblies are disposed about a bore of the gantry. Each radiation detector head assembly includes a detector housing and a rotor assembly. The rotor assembly is configured to be rotated about an axis. The rotor assembly includes a detector unit that in turn includes an absorption member and associated processing circuitry. The cooling unit is mounted to the gantry and is configured to provide an output flow of air at a controlled temperature. The manifold is coupled to the cooling unit and the plural radiation detector head assemblies, and places the cooling unit and radiation detector head assemblies in fluid communication with each other. The output flow of air from the cooling unit is delivered to the plural radiation detector head assemblies.

SELF-PRIMING THERMOSYPHON
20180220554 · 2018-08-02 · ·

A thermosyphon having an evaporator, a condenser having a condenser liquid pool accumulated at the bottom thereof creating a condenser liquid pool surface, a vapor tube fluidly coupling the evaporator to the condenser, and a liquid tube fluidly coupling the condenser to the evaporator, wherein the liquid tube apex is above the condenser liquid pool surface, thereby trapping vapor and preventing liquid from passing from the condenser to the evaporator. The application of heat to the evaporator increases the total system internal temperature and pressure causing condensation of the vapor in the liquid tube. As the liquid level in the liquid tube increases above the lower interior surface of the apex of the liquid tube, the liquid tube is primed thereby creating the pressure head needed to overcome the hydrodynamic losses inside the thermosyphon. Various embodiments allow passive start-up, regardless of the initial distribution of liquid inside the thermosyphon.