Various technologies described herein pertain to a heat spreader for an autonomous vehicle computing device. The heat spreader includes a top surface, a bottom surface, and a side surface. The top surface of the heat spreader is thermally conductive. The top surface of the heat spreader includes a section that is sized and shaped to align with a heat generating component (e.g., on a printed circuit board assembly). The top surface of the heat spreader is configured to receive heat from the heat generating component. The bottom surface of the heat spreader includes externally integrated fins. The heat spreader is configured to dissipate the heat from the heat generating component such that the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface.

A cold plate for cooling microchip. Fluid channels are formed in a semiconductor plate, each channel being defined by sidewalls. The sidewalls are doped with series of interchanging n-type and p-type regions, thereby generating a plurality of p-n junction in each sidewall. Electrical contacts are provided across the p-n junctions, thereby creating a plurality of thermoelectric cooling (TEC) devices within the sidewalls. Upon application of current to the contacts, the TEC devices transport and draw heat flux away from the microchip. The heat is then fully or partially collected by the cooling fluid flowing inside the channels.

Embodiments include semiconductor packages and cooling semiconductor packaging systems. A semiconductor package includes a second die on a package substrate, first dies on the second die, conductive bumps between the first dies and the second die, a cold plate and a manifold over the first dies, second die, and package substrate, and first openings in the manifold. The first openings are fluidly coupled through the conductive bumps. The semiconductor package may include a first fluid path through the first openings of the manifold, where a first fluid flows through the first fluid path. The semiconductor package may further include a second fluid path through second openings of the cold plate, where a second fluid flows through the second fluid path, and where the first and second fluids of the first and second fluid paths cool heat providing surfaces of the first dies, the second die, or the package substrate.

A cooling apparatus includes: a first member including a first surface in contact with a cooling target, a second surface opposite to the first surface, and radiating fins protruding from the second surface; and a second member including a third surface facing the second surface, a refrigerant flows between the first member and the second member, the second member includes a first protrusion protruding from the third surface toward a space, the space existing between the radiating fins in a flow direction of the refrigerant, the first protrusion includes a first slope inclined to the third surface, the first slope includes a first end and a second end, the first end is closer to the second surface than the second end, the second end is closer to the third surface than the first end, the first end is positioned downstream in the flow direction from the second end.

A liquid cooled plate and an electronic computing device are provided. The liquid cooled plate includes multiple channels communicated in sequence, and adjacent channels are communicated via a communicating portion. Multiple partitions divide each of the channels to multiple flow passages, and a part of each of the partitions extends into the communicating portion, and lengths of the multiple partitions extending into the communicating portion gradually increases or decreases according to a preset rule. With this arrangement, the coolant can be collected and redistributed before entering the next channel, which is more conducive to the uniform distribution of the coolant, thereby improving the overall heat exchange capacity of the liquid cooled plate, and thus can better meet the actual usage requirements.

A computing system includes a chassis, a circuit board including at least one electronic component, a mounting bracket secured to the chassis, a support bracket pivotably coupled to the mounting bracket, and a cold plate coupled to the support bracket. The support bracket is pivotable between a first configuration and a second configuration. The cold plate is in contact with the at least one electronic component in the first configuration, and the cold plate is removed from contact with the at least one electronic component in the second configuration.

A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.

A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.

A heat dissipator includes a plate-shaped base portion that extends in a first direction along a direction where a refrigerant flows and in a second direction orthogonal to the first direction and has a thickness in a third direction, and fins that protrude from the base portion to one side in the third direction, extend in the first direction, are arranged in the second direction, and guide the refrigerant. A second of the fins is provided continuously on one side in the first direction that is a downstream side of a first of the fins, and a third fin that is provided continuously on another side in the first direction of the first fin, and includes an end on the one side in the third direction on the other side in the third direction.

A modular heat exchange assembly includes a cold plate defining a finned surface and a corresponding plurality of microchannels. Selected ones of the plurality of microchannel extend from a first end to an opposed second end. A fluid receiver unit defines an inlet port and a first fluid connector fluidically coupled with the inlet port. A fluid transfer unit defines an outlet port and a second fluid connector matingly engageable with and disengageable from the first fluid connector to fluidly couple the fluid receiver unit and the fluid transfer unit together. The fluid transfer unit defines a distribution manifold configured to distribute coolant among the selected microchannels at a position between the first ends and the second ends of the selected microchannels. The fluid transfer unit further defines a collection manifold configured to receive coolant from the selected microchannels. The collection manifold and the outlet port are fluidically coupled together.