Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly are disclosed. According to an aspect, a system includes an electronic device including one or more electronic components. Further, the electronic device includes a heat-transfer conduit including a first end and a second end. The first end of the heat-transfer conduit is positioned to receive heat from the electronic component(s). The heat-transfer conduit is configured to conduct heat from the first end to the second end. Further, the system includes a cold plate assembly including a cold plate and a mechanism configured to permit movement of the cold plate. At the first position, the cold plate may contact the second end for receipt of heat from the heat-transfer conduit at the second end. At the second position, the cold plate is apart from the second end.

An electronic apparatus cooling device is provided with a water-cooling cold plate unit that is disposed in contact with a heat-generating element and that cools the heat-generating element directly by means of a liquid refrigerant that circulates in an inner flow path; an air-cooling fin disposed adjacent or in proximity to the water-cooling cold plate unit and having a fin tube through which the liquid refrigerant is circulated; and a refrigerant supply means that supplies the liquid refrigerant to the inner flow path of the water-cooling cold plate unit and to the fin tube in the air-cooling fin in a distributed manner.

A cooling device includes a cooling plate and a buffer portion, a flow passage is formed in the cooling plate, and the buffer portion is arranged on the cooling plate. An inlet buffer zone and an outlet buffer portion are defined in the buffer portion, liquid flows into the flow passage through the inlet buffer zone and flows out of the flow passage through the outlet buffer portion. The liquid flows into the flow passage through the buffer portion, and the buffer portion can reduce the flow resistance of the liquid flowing into the flow passage. The liquid in the flow passage also flows out through the buffer portion, and the buffer portion can also reduce the flow resistance of the liquid flowing out of the flow passage.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, flow controllers are associated with cold plates and have direct and bypass ports, so that when direct ports are disabled for removal of a first cold plate, bypass ports are enabled to bypass a first cold plate and to enable a second cold plate to be continuously cooled by a datacenter cooling system.

A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.

A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.

Some embodiments include a thermal management system for a nanosecond pulser. In some embodiments, the thermal management system may include a switch cold plates coupled with switches, a core cold plate coupled with one or more transformers, resistor cold plates coupled with resistors, or tubing coupled with the switch cold plates, the core cold plates, and the resistor cold plates. The thermal management system may include a heat exchanger coupled with the resistor cold plates, the core cold plate, the switch cold plate, and the tubing. The heat exchanger may also be coupled with a facility fluid supply.

An electronic equipment includes: a housing; a cold plate fixed to the housing, a cooling liquid flowing at an interior of the cold plate; a cage that is supported at the housing so as to be movable toward and away from the cold plate, an object of cooling being inserted into the cage; and an elastic member that pushes the cage toward a cold plate side, wherein the cold plate has a contact that is provided at a position of contacting the object of cooling in a state in which the object of cooling is inserted in the cage.

Methods and systems for creating cold plates are disclosed. For example, in one example method for manufacturing a cold plate made of a thermally-conductive plastic includes performing a first injection-molding process using the thermally-conductive plastic to produce a first unitary body, the first unitary body including one or more elongated sections forming a unitary body, performing a second injection-molding process using the thermally-conductive plastic to produce a second unitary body, the second unitary body incorporating the first unitary body so as to cover a majority of the first unitary body and form a respective coolant pipe body corresponding to each elongated section, and performing a machining process on the second unitary body so as to create a conduit in each respective coolant pipe body suitable for a fluid to pass through to create respective coolant pipes.

A method of manufacturing a cold plate includes forming a fluid circuit on a build surface in a layer-by-layer fashion from a build material. The fluid circuit includes a plurality of peripheral walls, each of the plurality of peripheral walls at least partially defining a primary channel, a longitudinally one of the peripheral walls being formed to include apertures configured to permit excess build material to pass therethrough. A central wall of the fluid circuit at least partially defines the primary channel and a plurality of secondary channels fluidly connected to the primary channel. The method further includes removing excess build material through the apertures.