Connectors for a networking device may be provided. A networking device may comprise a first plurality of switch bars each comprising a first switch type arranged parallel to one another, a second plurality of switch bars each comprising a second switch type arranged parallel to one another, and a third plurality of switch bars each comprising a third switch type arranged parallel to one another. The first plurality of switch bars, the second plurality of switch bars, and the third plurality of switch bars may be arranged orthogonally. A first one of the first plurality of switch bars may be connected to a first one of the second plurality of switch bars via a retractable mechanical connector mechanism.

A water cooling radiator includes a water pump assembly and a water drain assembly. The water pump assembly includes a base and a housing spliced with the base to form an accommodating cavity. A water inlet portion and a water outlet portion in the accommodating cavity are formed on the base. The water inlet portion includes a water inlet tank provided on the base, a water inlet pump arranged in the water inlet tank and connected with the base, and a water inlet nozzle connected to the base and communicated with the water inlet tank, The water inlet tank is communicated with the water drain assembly. The water outlet portion includes a water outlet tank provided on the base, a water outlet pump arranged in the water outlet tank and connected with the base, and a water outlet nozzle connected to the base and communicated with the water outlet tank.

The present invention relates to an improved thermal management system for a heat source, such as a high-powered electronic device. Thermal management systems work to maintain the optimal operational temperature of a device to maximise reliability, operational lifespan and/or efficiency, for example by using a fluid coolant to transfer thermal energy from the device to a heat exchanger. The present invention seeks to provide an improved thermal management system by incorporating a phase change material into a heat exchanger.

A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.

An immersion cooling system includes a first casing, a plurality of fins, a liquid-cooled pipeline, and a liquid-cooled system. The first casing is used for containing a dielectric liquid in which a heat-generating component is immersed. The plurality of fins are disposed on and located outside the first casing. The liquid-cooled pipeline containing a coolant is attached to the first casing. The liquid-cooled system is disposed outside the first casing and connected with the liquid-cooled pipeline to remove heat from the coolant in the liquid-cooled pipeline. The immersion cooling system dissipates heat through two heat exchange mechanisms, that is, natural convection heat loss and heat absorption by liquid cooling.

A self-contained mobile high performance computing platform for cryptocurrency mining is disclosed. The self-contained mobile high performance computing platform includes a mobile cabinet, which includes wheels for easy movement and placement within, for example, a warehouse facility, a garage, a basement, an office tower, or a vehicle such as a truck or van. The cabinet is configured to enclose at least one computing apparatus, which includes computing blades immersed in an oil or other dielectric fluid for immersion cooling. The computing blades are configured to be connected to respective interface boards via connectors that are located within a tank of the dielectric fluid. Each computing blade may be individually removed or replaced, thereby enabling an inoperable or low performance computing blade to be disconnected without affecting the operations of the other computing blades.

An electronic equipment chassis comprises a chassis housing and two or more cooling compartments in the chassis housing. At least a first one of the two or more cooling compartments in the chassis housing utilizes a first type of cooling for a first set of electronic equipment housed therein, and at least a second one of the two or more cooling compartments in the chassis housing utilizes a second type of cooling for a second set of electronic equipment housed therein. The first type of cooling comprises liquid immersion cooling and the second type of cooling comprises non-liquid immersion cooling.

A heat dissipation structure for the reactor includes a housing, a reactor body, and one or more heat dissipation pipes. Each of the one or more heat dissipation pipes is disposed in a cavity of the housing and is connected to the housing in a leak-tight manner, a closed cavity is formed between the one or more heat dissipation pipes and the housing, and the reactor body is disposed in the closed cavity. The above heat dissipation structure for the reactor allows to improve the heat dissipation effect of the reactor under the premise that protection requirements are met. The current carrying density of the coil of the reactor body can be increased and the diameter of copper wires can be reduced under the same conditions, thereby reducing the usage of copper and effectively reducing the cost and weight.

A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is disposed in the cavity and is configured to deform based on a temperature of the cooling liquid in the cavity, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.