A data processing device and a data processing system are provided. The data processing device includes a housing, which is thermally conductive and defines a sealed accommodating cavity; a hashboard, which is arranged in the accommodating cavity and is in fixed connection to the housing; a control board, which is in communicative connection to the hashboard; and a power supply module, which is in electrical connection to the hashboard.

A cooling case provides cooling of electronic cards. The cooling case provides efficient cooling of electronic cards found in military electronics packaging, and includes a cold plate having a fin structure.

An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

A system having a shell with a shell interior for housing a heat exchanger that is configured to be operable for heat transfer between a first fluid and a second fluid; a refrigerant inlet, wherein the first fluid passes from the refrigerant inlet to the shell interior for heat transfer; a refrigerant inlet manifold, wherein the refrigerant inlet manifold is configured to collect the first fluid from the refrigerant inlet for the heat transfer; a refrigerant outlet, the refrigerant outlet is configured to be operable for supplying the first fluid for electronic device cooling; a coolant inlet, wherein the second fluid flows from the coolant inlet and into the shell interior for the heat transfer; and a coolant outlet for discharging the second fluid out of the shell interior.

A reverse-return parallel loop system is provided, including a cooling cycle comprised of a plurality of heat sinks, at least one heat exchanger, and at least one liquid pump to carry liquid coolant through the system. Each heat sink has a vapor inlet, a liquid inlet, a vapor outlet, and a liquid outlet. The liquid coolant is pumped into the heat sink through the liquid inlet where the coolant splits in to two streams, where one stream flows out of the liquid outlet towards the next heat sink downstream, and the other stream flows through the heat sink, and through the heat exchanger core to absorb heat from the heat sources and become at least partially vaporized by the heat. This stream then merges with vapor from other heat sinks upstream and flows out through the vapor outlet back towards the heat exchanger of the system.

A device for disinfecting surfaces is provided. One embodiment has a plurality of UV light (energy) emitting LEDs residing in an enclosure, wherein emitted UV energy passes through a lens onto a surface being disinfected; a heat dissipator that receives heat generated by the UV emitting LEDs; and a fluid moving device. The enclosure has a fluid heating passageway that is in fluid contact with the heat dissipator, has a transfer passageway with a distal end that is fluidly coupled to a proximal end of the fluid heating passageway, and has a return passageway that is fluidly coupled to a proximal end of the transfer passageway and that is fluidly coupled to a distal end of the fluid heating passageway. During operation, the fluid moving device operates to circulate a cooling fluid through the fluid heating passageway, the transfer passageway, and the return passageway. Heat transfers to the ambient environment.

A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position tank, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.

A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.

A water cooling system includes a water block, a heat radiator, a pump, a circulating conduit and a water storage assembly. The pump is disposed between the water block and the heat radiator. The circulating conduit communicates with the water block, the heat radiator and the pump. The water storage assembly is configured to be a part of an integrated element. The integrated element includes one of the water block, the heat radiator and the pump. The water storage assembly includes a liquid storage chamber and a liquid guide. The liquid storage chamber has an inner wall. An end of the liquid guide has a protrusive tube end reaching to the liquid storage chamber. The protrusive tube end protrudes from the inner wall. An angular space is formed between the protrusive tube end and the inner wall.