An immersion system includes an immersion tank configured to store a coolant liquid and contain an electronic device, a heat exchanger coupled to the immersion tank through first piping, a first pump provided in the first piping and configured to circulate the coolant liquid between the immersion tank and the heat exchanger, a tank coupled to the immersion tank through second piping, a second pump provided in the second piping and configured to move the coolant liquid between the immersion tank and the tank, a level sensor provided in the immersion tank and configured to detect a liquid level in the immersion tank, and a controller configured to control the second pump in accordance with a detection signal of the level sensor.

A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.

A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.

Embodiments of coolant guides for use in magnetron assemblies are provided herein. In some embodiments, a coolant guide for use in a magnetron assembly includes: a body having a guide channel extending through the body, wherein an upper opening of the guide channel corresponding with an upper surface of the body has a first size and a lower opening of the guide channel corresponding with a lower surface of the body has a second size greater than the first size, and wherein the body includes a first pair of outer sidewalls that are substantially parallel to each other and a second pair of outer sidewalls that are angled toward each other; and an upper lip extending away from an upper surface of the body.

Liquid-cooled notebook computer and power supply device thereof, includes a power supply line set including AC power supply line, transformer device set in adapter and electrically connected to AC power supply line and DC power supply line electrically connected to the other side of transformer device, a water cooling device installed in adapter, and a notebook computer with infusion inlet and infusion outlet thereof respectively connected to water outlet and water inlet of water cooling device. The infusion inlet and the infusion outlet are connected to the internal chip surface of notebook computer through infusion pipeline, and a heat conduction source is attached to the chip surface. After the water pump in water cooling device is actuated, the heat conduction source transports the heat generated by the chip from the notebook computer to water cooling device for circulating exchange of cold and hot liquids for heat dissipation.

This power conversion device includes an inverter, a DC-DC converter, and a flat plate-shaped base where the inverter and the DC-DC converter are disposed on the front side and the back side. The base includes a cooling flow path having a front side flow path disposed on the front side and a back side flow path connected to the front side flow path and disposed on the back side.

Embodiments are disclosed of a fluid distributor and systems with the fluid distributor. The fluid distributor includes a fluid supply conduit having a main supply inlet and a main supply outlet and a fluid return conduit having a main return inlet and a main return outlet. A thermoelectric assembly is sandwiched between the supply conduit and the return conduit. The thermoelectric assembly including a thermoelectric device sandwiched between a pair of thermally conductive layers, with one thermally conductive layer in thermal contact with the supply conduit and the other thermally conductive layer in thermal contact with the return conduit.

A heat dissipation device includes a fixing bracket and a plurality of heat sinks, where the fixing bracket includes a mounting part, and a plurality of first mounting holes are provided on the mounting part; and a fixing part is disposed on each of the plurality of heat sinks, and the fixing part is inserted into the first mounting hole. A height of the fixing part above a surface of the heat sink along a direction perpendicular to the heat sink is greater than a thickness of the fixing bracket, and the fixing part fits a gap of the first mounting hole. Floating gaps are reserved for the heat sink both in a mounting direction between the heat sink and the fixing bracket and in an aperture direction of the first mounting hole, so as to reduce a risk of a damage to a chip that is not fastened with the heat sink.

A rack system which includes a rack frame and at least one reservoir for housing at least one rack-mounted immersion case is disclosed. The rack frame is configured to slidably accommodate racking and de-racking operations of the at least one rack-mounted immersion case. The at least one collapsible reservoir, which is configured to store a fluid therein, is fluidly connected to the at least one rack-mounted immersion case, has a first portion fixedly connected to the at least one rack-mounted immersion case, and a second portion fixedly connected to the rack frame. The at least one collapsible reservoir is configured to respectively collapse and expand along a racked space and a de-racked space, the racked and de-racked spaces being defined between a backplane of the at least one rack-mounted immersion case and a backplane of the rack frame, the de-racked space being larger than the racked space.

A liquid cooling heat exchange apparatus has a water block set and a liquid pump module. The water block set has a heat transfer surface configured to exchange heat with a cooling liquid. The liquid pump module is securely mounted on the water block set and has a flow-directing containment area and pumps. The flow-directing containment area forms flow-directing containment recesses and the pumps correspond to the flow-directing containment recesses. Therefore, pumps are connected in series or parallel so that the pumps can juxtapose with each other, which lessens the entire thickness and allows the liquid cooling heat exchange apparatus to be utilized in a narrow space. Besides, with the connected pumps, an amount and a speed of the flow may be increased and dissipate more heat. Even if part of the pumps malfunctions, the remaining pump(s) can maintain a basic amount and speed of the flow.