A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.

A thermal management module includes a fluid system in fluid communication with a main cooling fluid source; a first cooling fluid manifold, and a second cooling fluid manifold. The first cooling fluid manifold is in fluid communication with the fluid system and provides a cooling fluid between the fluid system and a first server rack adjacent to the thermal management module. The second cooling fluid manifold is in fluid communication with the fluid system and provides the cooling fluid between the fluid system and a second server rack adjacent to the thermal management module. The manifold is in internal position when no rack liquid is needed adjacently, and it is extended to the adjacent rack once fluid distribution is needed from the rack.

The cooling module comprises a main supply connector, a main return connector, an internal cooling loop, a plurality of cooling plates, a base layer and a lid. The base layer includes a plurality of supply sub-connectors and return sub-connectors and a plurality of cooling areas corresponding to a plurality of cooling plates. Each cooling plate has a supply connector, a return connector and a contacting area. The plurality of supply sub-connectors and return sub-connectors are connected with the internal cooling loop. Each cooling area is to contact with a contacting area of a corresponding cooling plate. Each supply sub-connector is to be connected to a supply connector of the corresponding cooling plate, and each return sub-connector is to be connected to a return connector of the corresponding cooling plate. The corresponding cooling plate is to be removably attached with the base layer and to be serviced independently.

The invention relates to a thermal regulation device for at least one electronic and/or electrical component, in particular for a motor vehicle, having a stack of at least two pairs of plates, defining circulation channels for heat-transfer fluid, and at least one heat-transfer fluid manifold, in fluidic communication with the circulation channels for heat-transfer fluid. The at least one heat-transfer fluid manifold has at least two complementary hollow manifolds. Each manifold is joined to an associated pair of plates and includes a distribution zone having at least one slot leading into the circulation channel for heat-transfer fluid. The manifolds joined to two adjacent pairs of plates have a male part and a complementary female part that are fitted one in the other, the male part bearing at least one seal. The invention also relates to a corresponding method for assembling such a device.

The present invention discloses a water-cooled radiator with built-in pump spraying waterway structure. A slot formed in the body bottom shell is separated into a water storage tank and a heat sink; a water inlet is formed in the heat sink, a water outlet is formed in the water storage tank, a through hole is formed in the water-stop plate, the radiating fin fixedly covers an opening of the heat sink; one end of the water inlet pipe is communicated with a water outlet end of the water-cooled box while the other end thereof is communicated with the water inlet, one end of the water outlet pipe is communicated with the water outlet while the other end thereof is communicated with a water inlet end of the water-cooled box, and the water pumping mechanism is arranged in the water storage tank. The present invention improves the water cooling efficiency.

A heat-transfer system includes a cooling circuit configured to convey heated coolant from one or more cooling nodes to one or more heat-rejection devices, and to convey the cooled coolant from the one or more heat-rejection devices to the one or more cooling nodes. Each cooling node facilitates a transfer of heat to the coolant, the heat being from one or more heat-dissipation devices and a corresponding heat load on the respective cooling node. Each heat-rejection device facilitates heat transfer from the coolant to another medium. The heat-transfer system also has a selectively operable flow-control device configured to control a flow rate of the coolant through a segment of the coolant circuit. A control logic selectively operates the flow-control device responsive to an output from one or more sensors to tailor a cooling capacity available to each cooling node to the real-time heat load on the respective cooling node.

A system includes multiple modular hot aisle cooling units (MHACUs) arranged in a series in a data hall, each MHACU configured to cool multiple servers in the data hall, the servers arranged in multiple containment modules within the data hall, each containment module comprising a hot aisle. The system also includes multiple vestibules, each connected to the hot aisles of at least two of the multiple containment modules and configured to allow heated air to flow between the hot aisles. The system also includes a pump package configured to provide cooling fluid to the multiple MHACUs. The system also includes at least one computing device configured to control at least one of air throughput, leaving air temperature, or leaving fluid temperature in each of the multiple MHACUs to customize cooling levels to different ones of the multiple containment modules.

An immersion cooling system includes a cooling tank and a filtration system. The cooling tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The filtration system includes a pipeline, a pump, a filter and a cooling device. The pipeline is in fluid communication with the cooling tank. The pump is disposed in the pipeline and is configured to drive the liquid coolant to flow through the pipeline. The filter is disposed in the pipeline and is configured to filter the liquid coolant. The cooling device is connected to the pipeline and is configured to cool the liquid coolant. The pipeline has an inlet connected to the cooling tank. The cooling device is located between the pump and the inlet of the pipeline.

An actively cooled end-pumped solid-state laser gain device includes a bulk solid-state gain medium. An input-end of the gain medium receives a pump laser beam incident thereon and propagating in the direction toward an opposite output-end. The metal foil is disposed over a face of the gain medium extending between the input- and output-ends. A housing cooperates with the metal foil to form a coolant channel on the face the gain medium. The coolant channel has an inlet and an outlet configured to conduct a flow of coolant along the metal foil from the input-end towards the output-end. The metal foil is secured between the gain medium and portions of the housing running adjacent to the coolant channel. The metal foil provides a reliable thermal contact and imparts little or no stress on the bulk gain medium.

A fluid control device includes a housing having plural surfaces defining a cavity within the housing. The housing includes an inlet to receive a fluid mixture and an outlet to direct the fluid mixture out of the housing. The fluid mixture includes a fluid combined with debris. A structure array is disposed within the cavity and includes plural structures. Each of the plural structures includes a first surface coupled with an internal surface of the housing and a second surface disposed a distance away from the internal surface of the housing. The structure array includes a first portion and a second portion. The first portion is configured to interfere with the fluid mixture to separate at least some of the debris from the fluid, and the second portion is configured to direct the fluid and at least some of the debris toward the outlet.