A pumpless liquid-cooling heat dissipator includes a cooling head assembly and a condensing assembly. The cooling head assembly and the condensing assembly are connected through the connecting assembly to form a loop. The cooling head assembly and the condensing assembly both are filled with a liquid refrigerant. The use of refrigerant as a cooling medium is more effective compared with the water cooling, has better overall heat dissipation, and can overcome disadvantages of complex wiring of the water-cooling heat dissipator and poor heat dissipation of the heat pipe, and thus can quickly cool down the temperature of component. Compared with the existing water-cooling heat dissipator, the structure is simpler, the circulating cooling can be realized without mechanical drive e.g., water pump, and there is no extension of excess water pipe, which is more convenient for installation and makes the computer case cleaner.

Liquid submersion cooled electronic devices and systems are described that use one or more cooling liquids, for example one or more dielectric cooling liquids, to submersion cool individual electronic devices or an array of electronic devices. A clamshell or sandwich construction of the device housing is used to define a wet zone containing heat producing electronic components of the electronic device to be cooled by the dielectric cooling liquid, and a dry zone where input/output and power connectors are provided.

A water cooling radiator includes a water pump assembly and a water drain assembly. The water pump assembly includes a base and a housing spliced with the base to form an accommodating cavity. A water inlet portion and a water outlet portion in the accommodating cavity are formed on the base. The water inlet portion includes a water inlet tank provided on the base, a water inlet pump arranged in the water inlet tank and connected with the base, and a water inlet nozzle connected to the base and communicated with the water inlet tank, The water inlet tank is communicated with the water drain assembly. The water outlet portion includes a water outlet tank provided on the base, a water outlet pump arranged in the water outlet tank and connected with the base, and a water outlet nozzle connected to the base and communicated with the water outlet tank.

According to one embodiment, a battery backup unit (BBU) with a louver design includes a container, a battery module having one or more battery cells, a first louver at a frontend of the container, a second louver at a backend of the container, and a control mechanism that is coupled to both the first and second louvers and is configured to open and close the louvers. Also, the battery module and the control mechanism are disposed within the container. In another embodiment, a BBU shelf with a similar louver design that includes one or more battery modules may be implemented within an electronic rack.

The present invention relates to an improved thermal management system for a heat source, such as a high-powered electronic device. Thermal management systems work to maintain the optimal operational temperature of a device to maximise reliability, operational lifespan and/or efficiency, for example by using a fluid coolant to transfer thermal energy from the device to a heat exchanger. The present invention seeks to provide an improved thermal management system by incorporating a phase change material into a heat exchanger.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

An electric circuit device includes: a first electric component; a first case that accommodates the first electric component and has a cooling channel for cooling the first electric component and a discharge port of the cooling channel; a second case that accommodates a second electric component and has a communication channel that communicates with a discharge port of the cooling channel; a first seal portion that is provided in a peripheral edge part of a discharge port of the cooling channel and seals the first case and the first electric component; a second seal portion that is provided outside the first seal portion with respect to a discharge port of the cooling channel and seals the first case and the first electric component; a through hole that is provided in the first case between the first seal portion and the second seal portion of and penetrates the first case from the first electric component side to the second case side; and a wall that is provided on one of the first case and the second case to surround a periphery of a discharge port of the cooling channel, and the through hole is provided outside the wall.

This application discloses a leakage detection apparatus and method, and a cabinet system, and relates to the server field. The apparatus is applied to a cabinet system, the cabinet system includes a plurality of nodes, with each node using a liquid cooling apparatus for heat dissipation. The apparatus includes: a detection circuit, coupled to the plurality of nodes, comprises a plurality of branch circuits for leakage detection of a plurality of liquid cooling apparatuses in the plurality of nodes; and a monitoring device, coupled to the detection circuit and configured to monitor a leakage status of the liquid cooling apparatus in each node, and determine, when leakage occurs in a faulty liquid cooling apparatus, a faulty node where the faulty liquid cooling apparatus resides.

A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.

An immersion cooling system includes a first casing, a plurality of fins, a liquid-cooled pipeline, and a liquid-cooled system. The first casing is used for containing a dielectric liquid in which a heat-generating component is immersed. The plurality of fins are disposed on and located outside the first casing. The liquid-cooled pipeline containing a coolant is attached to the first casing. The liquid-cooled system is disposed outside the first casing and connected with the liquid-cooled pipeline to remove heat from the coolant in the liquid-cooled pipeline. The immersion cooling system dissipates heat through two heat exchange mechanisms, that is, natural convection heat loss and heat absorption by liquid cooling.