Embodiments are disclosed of a cooling apparatus with one or more cold plates, each adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment. A fluid control module is mounted to the substrate and fluidly coupled to the cold plates. The fluid control module includes a fluid inlet with an inlet mechanism adapted to enable and disable the fluid inlet; the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized. The fluid control module also includes a fluid outlet with an outlet mechanism adapted to enable and disable the fluid outlet; the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized. A dedicated power supply is electrically coupled to the inlet mechanism and the outlet mechanism, and when the inlet mechanism is de-energized, the outlet mechanism is also de-energized after a delay.

A cold plate is configured to use isolated primary and secondary liquid coolants and comprises: a thermally conductive body defining an internal volume and arranged for mounting with respect to an electronic device, so as to transfer heat from the electronic device to the internal volume; a coolant inlet for receiving the secondary liquid coolant into the internal volume to receive the transferred heat; and a coolant outlet for the secondary liquid coolant to flow out of the internal volume. The thermally conductive body is configured to define an external receptacle having a volume arranged to receive and retain the primary liquid coolant for heat transfer between the primary and secondary liquid coolants. The cold plate may form part of a system for cooling electronic devices.

A cooling system includes a first circulation pipeline unit and a second circulation pipeline unit that are configured to circulate a cooling medium. The first circulation pipeline unit includes a first water supply pipe group and a first water return pipe group that are connected to each other. The second circulation pipeline unit includes a second water supply pipe group and a second water return pipe group that are connected to each other. A first end of the first water supply pipe group and a first end of the first water return pipe group each are provided with a first expansion interface.

A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

A coupling member for a blind mate fluid coupling includes a housing and a fluid connector fixed in position relative to the housing for connecting to a fluid conduit of the system. A valve body extends through the housing and is movable relative to the housing. The valve body includes an internal fluid passage that is fluidly connected to the connector, and a valve member opens or closes the internal fluid passage. A carrier is at least partially disposed in the housing and is radially movable relative to the housing. The carrier is configured to cooperate with the valve body to facilitate alignment of the valve body when coupling to another coupling member. The carrier may form a portion of the fluid passage between the connector and valve body, and includes a sealing arrangement that permits radial and/or angular misalignment compensation of the design. Varying diameters of the insertion part or receiving part of the coupling member may be provided for further enhancing misalignment compensation of the design.

A system for managing liquid leakage comprises a fluid module, which includes a supply fluid connector to receive cooling fluid from a rack manifold coupled to an external fluid source and to supply the cooling fluid to an information technology (IT) load of the server chassis, and a return fluid connector to receive cooling fluid from the IT load of the server chassis and to return the cooling fluid to the rack manifold and then to the external fluid source, forming a fluid loop, packaged with different energy storage units. When a liquid leakage is detected by a sensor in the server chassis, an electromagnetic unit coupled to the supply and return fluid connectors causes the first fluid connector to be pushed away from the rack manifold to disconnect the fluid loop on a supply side, and causes the return fluid connector to be disconnected from the rack manifold on a return side after a predetermined period of time after the supply fluid connector has been disconnected.

A thermal management plate includes two cooling devices. A first cooling device includes a fluid inlet, a fluid outlet, a distribution manifold, and a number of fluid channels extending from the distribution manifold. The second cooling device also includes a fluid inlet, a fluid outlet, a distribution manifold, and a number of fluid channels extending from the distribution manifold. The channels of the first cooling device and the channels of the second cooling device are in thermal communication with one another, and the two channels are designed jointly.

A system having a shell with a shell interior for housing a heat exchanger that is configured to be operable for heat transfer between a first fluid and a second fluid; a refrigerant inlet, wherein the first fluid passes from the refrigerant inlet to the shell interior for heat transfer; a refrigerant inlet manifold, wherein the refrigerant inlet manifold is configured to collect the first fluid from the refrigerant inlet for the heat transfer; a refrigerant outlet, the refrigerant outlet is configured to be operable for supplying the first fluid for electronic device cooling; a coolant inlet, wherein the second fluid flows from the coolant inlet and into the shell interior for the heat transfer; and a coolant outlet for discharging the second fluid out of the shell interior.

An electronic rack cooling system is disclosed that includes both a two-phase cooling system having a first cooling loop and a single-phase system comprising a second cooling loop. A main coolant source, such as a facility cooling fluid is coupled to a condenser unit of the two-phase cooling system. A branch off of the facility cooling fluid is directed to the single-phase cooling loop. The coolant flow to the single-phase cooling loop is controlled by a flow control value and a coolant pump. The facility cooling fluid is managed between the single-phase loop and phase change loop. A rack management unit in the electronic rack controls facility cooling fluid flow rate using the flow control device and pump.

A design for servers and racks, includes a supply connector module including a supply connector connected to a first holder to connect a supply line connector, and a supply switch to engage the first holder when in a first position and to disengage with the second holder when in a second position, the second holder has a shape to disengage the supply switch and disconnect the supply connector from the supply line after a first time interval. The design further includes a return connector module a return connector connected to a second holder to connect a return line connector, and a return switch to engage the second holder when in a first position and to disengage when in a second position, the fourth holder has a shape to disengage the return switch and disconnect the return connector from the return line after a second time interval.