A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

A system for thermal management of a computing device includes an immersion chamber, a cooling fluid, a plurality of heat-generating components, and a means for removing vapor from a cooling volume of the cooling fluid. The cooling fluid is positioned in the immersion chamber and fills at least a portion of the immersion chamber. The plurality of heat-generating components is positioned in the cooling fluid and arranged in a series. The series defines the cooling volume of the cooling fluid contacting the plurality of heat-generating components to cool the plurality of heat-generating components.

A thermal management system includes a boiler tank and at least one heat-generating component positioned in the boiler tank. The boiler tank is in fluid communication with a vapor return line and a liquid return line. A condenser is in fluid communication with the vapor return line and the liquid return line. The condenser is positioned between vapor return line and the liquid return line in the fluid communication.

A server computer system has one or more node assemblies. A node assembly has two motherboards that are stacked one over another with their component sides facing toward each other. Memory cards that are mounted on one motherboard are interlaced with memory cards that are mounted on the other motherboard. At least processors of the two motherboards are immersed in a coolant fluid in a fluid immersion cooling tank. A processor cooling stack is mounted over a processor. The processor cooling stack includes flow regulation structures with sidewalls that regulate flow of vapor bubbles of the coolant fluid away from the processor.

A two-phase immersion cooling system may include an immersion tank configured to receive a dielectric fluid. The immersion tank may have an interior volume including a lower portion and an upper portion. The immersion tank may have an electronic device region configured to receive one or more electronic devices. The system may include a condenser mounted in the upper portion of the immersion tank. The system may include a liquid deflector located in the upper portion of the immersion tank and at least partially between a top side of the electronic device region and a top side of the condenser. The liquid deflector may be configured to prevent or inhibit dielectric liquid from splashing from the electronic device region onto the condenser. Other examples may be claimed or described.

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

According to one embodiment, an immersion cooling system may include a container to receive one or more server blades, each having electronics, at least partially submerged within a two-phase coolant contained within the container. The immersion cooling system may also include a cover panel to cover the phase change area. This area may include a liquid region defined to contain the two-phase coolant therein, and a vapor region defined between the cover panel and a surface of the two-phase coolant. The cover panel includes a plurality of slots, covered with rotatable panels. At least one of the slots is configured to allow a server blade to be inserted into the liquid region and at least partially submerged into the two-phase coolant. The slots may be configured to allow a condensing unit to be inserted into the vapor region.

Fluid replacement structures used in immersion cooling tanks can include various enhancements to make them functional beyond simply taking up space. For example, the density of fluid replacement structures can be variable to assist with buoyancy control. As another example, fluid replacement structures can be designed to enable vaporized working fluid to be directed to a desired location. As another example, fluid replacement structures can include emergency cooling features, such as different substances that cause an endothermic reaction to occur when they are mixed together. The substances can be separated by a membrane that melts when the temperature reaches a certain point. As another example, a fluid replacement structure can provide structural support for an immersion cooling tank when negative pressure operations are performed. Fluid replacement structures can also include alignment features, lifting features, locking features, mating guides, fiducial markers, or the like.

Embodiments are disclosed of an information technology (IT) cooling system. The system includes an IT container having an internal volume. Inside the internal volume there is an immersion fluid region adapted to submerge one or more servers in a two-phase immersion fluid. An immersion condenser is positioned above the immersion fluid region in the internal volume. The design includes a circulation condenser. The circulation condenser is fluidly coupled to a liquid distribution manifold and a vapor return manifold that are positioned in the internal volume above the immersion tank (i.e., the immersion fluid region) and are adapted to circulate a two-phase circulation fluid. The circulation condenser is also fluidly coupled to the immersion condenser, and an external cooling fluid is pumped from the circulation condenser to the immersion condenser. The distribution manifolds are adapted to be fluidly coupled to the server liquid cooling loops.

Disclosed is a semiconductor module comprising a module substrate having a top surface and a bottom surface that are opposite to each other, a plurality of semiconductor packages on the top surface of the module substrate and arranged in a first direction parallel to the top surface of the module substrate, and a clip structure on the top surface of the module substrate and spaced apart from the plurality of semiconductor packages in the first direction. The clip structure includes a body part on the top surface of the module substrate and spaced apart from the plurality of semiconductor packages in the first direction, and a connection part that extends from the body part across a lateral surface of the module substrate onto the bottom surface of the module substrate.