A method includes coating, via chemical vapor deposition, electronics disposed on a printed circuit board (PCB) with an electrical insulation coating of between one micron to 25 microns. The method further include depositing, on the electrical insulation coating, a metallic nano-layer comprising a porous metallic nano-structure. The method further includes, after the coating and the depositing, immersing the PCB in a water-based fluid to cool the electronics while the electronics are powered on.

A two phase coolant immersion system includes a top section and an immersion section, where the top section and the immersion section are separated by one or more panels. The immersion section includes at least a number of server slots to receive a number of servers, where each of the servers is at least partially submerged within two phase liquid coolant within the immersion section, where, when the servers operate, the servers generate heat that is transferred to the two phase liquid coolant causing some of the two phase liquid coolant to turn into a vapor. The two phase coolant immersion system includes a condensing section interfaced with the immersion section, where the condensing section includes a vapor collection compartment to collect two phase liquid coolant in vapor phase and a liquid collection compartment situated beneath the vapor collection compartment. The one or more panels prevent vapor loss to the environment.

A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.

An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment, the IT equipment is configured to provide IT services and is at least partially submerged within a first phase change liquid within the immersion tank, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the first phase change liquid thereby causing at least some of the first phase change liquid to turn into vapor phase. The cooling system includes a condenser unit having a second phase change liquid circulating at the condenser unit. The condenser unit includes a vacuum port, a sealing valve at the vacuum port. The cooling system includes a heat exchange core, coupling within the immersion tank connecting with the condenser unit to carry heat from the first phase change liquid to the second phase change liquid.

In one embodiment, a cooling system comprises an information technology (IT) cluster layer with multiple immersion tanks, each immersion tanks including electronic components submerged in a two-phase liquid coolant; and a cooling capacity layer that includes a vapor subsystem, a liquid subsystem, and a condensing cooler. The system further includes a distribution layer that include vapor lines for transmitting vapor from each of the immersion tanks to the vapor subsystem, and liquid lines for distributing liquid from the liquid subsystem to each immersion tank in the IT cluster layer. The two subsystems operate independently to maintain proper fluid level in the immersion tanks efficiently.

In one embodiment, an immersion cooling system comprising one or more electronic devices submerged in a two-phase liquid coolant, a first cooling loop to provide cooling liquid to the immersion system, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line, and a second cooling loop to provide cooling liquid to the immersion system, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line. The apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line and at least one main cooling source comprising a fluid control valve controlled based on the first pressure sensor and the second pressure sensor.

An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment situated within the immersion tank. The IT equipment is configured to provide IT services and is at least partially submerged within a phase change liquid, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the phase change liquid thereby causing at least some of the phase change liquid to turn into vapor phase. The immersion cooling system includes a primary condenser unit positioned above the immersion tank and a secondary condenser unit, where, either a single, or both the primary and secondary condenser units are configured to receive cooling liquid from an external cooling unit to condense the phase change liquid in vapor phase back into liquid phase.

The disclosure provides a system, for designing and developing immersion cooling in data centers. The system includes an internet technology (IT) tank that houses a computing device immersed in a two phase coolant; an aisle, in which the immersion tank is disposed, that captures a first vaporized portion of the two phase coolant escaped from the immersion tank; a condenser that transforms the first vaporized portion of the two phase coolant that escaped from the immersion tank into a first liquid portion of the two phase coolant; a second condenser captures and condenses a second portion of vapor; and a liquid distributor manages the cooling fluid and coolant fluid for the IT tank and two condensers.

In one embodiment, a liquid cooling apparatus includes a first cooling loop to provide cooling liquid to a heat load, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line and a second cooling loop to provide cooling liquid to the heat load, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line, wherein the first vapor return line and the second vapor return line are coupled by an interconnection loop. The liquid cooling apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line, and at least one main cooling source controlled based on the first pressure sensor and the second pressure sensor.

A thermal management system includes a server computer and a shell defining an immersion chamber. The shell contacts the server computer along a bottom side and lateral walls of the chamber, and the immersion chamber has an opening on a top side. The shell is connected to the server computer and a portion of the server computer defines at least a portion of the immersion chamber.