A composite refrigeration system includes a refrigeration part, a heat dissipation part, a first pipeline, a second pipeline, and a refrigerant. The refrigeration part uses the refrigerant to cool air sent into indoor space, and the heat dissipation part is configured to perform heat dissipation on the refrigerant. In addition, in two heat dissipation modes, the heat exchanger may exchange heat between the refrigerant and a heat carrier in an external pipeline network to implement heat dissipation. The composite refrigeration system implements, by using the heat exchanger, a function of exchanging heat with the external pipeline network, so that heat generated during operation of the composite refrigeration system can be at least partially transferred to the heat carrier in the external pipeline network, to implement the energy recycle and reuse.

An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel. First and second tube parts are in fluid communication with evaporation portion.

A heat exchanger comprising a pair of metal plates joined along corresponding mating surfaces, wherein at least one of the metal plates comprises a plurality of connected recesses which form a fluid circuit between the plates when the plates are joined, wherein the fluid circuit comprises an inlet, an inlet manifold, an outlet, an outlet manifold, and a plurality of flowpaths extending between and fluidly connecting the inlet manifold and outlet manifold, and wherein one or more of the plurality of flowpaths comprise a fluid passage and a flow constriction and wherein a ratio of the hydraulic diameter of the flow constriction to the hydraulic diameter of the fluid passage increases with increasing distance from the inlet.

A multi-channel cold plate for cooling chip wherein a first set of cooling channels function as main cooling channels and a second set of cooling channels function as a secondary and/or backup cooling channels. The two sets of cooling channels are fluidly isolated from each other, such that cooling fluid from one sent of channels cannot flow or intermix with the cooling fluid of the other cooling channel. The secondary cooling channels can be operated when demand for heat removal is increased or when the main cooling channels is unable to manage the thermal condition of the chip properly.

A heat dissipation device and a robot using the same are provided. The heat dissipation device comprises a porous material layer, a transporting tube and a liquid. The at least one porous material layer is disposed on a housing surface of a robot. The porous material layer has an evaporation surface and an accommodation space. The evaporation surface is disposed through and exposed from the housing surface. The evaporation surface and the accommodation space are in fluid communication with each other. The transporting tube is connected to the at least one porous material layer and in fluid communication with the accommodation space. The liquid is transported into the at least one accommodation space through the transporting tube and exposed from the evaporation surface. Thus, the liquid evaporates at the evaporation surface to reduce a temperature of the housing surface of the robot via convection and evaporation.

A cooling device comprising a cooling circuit comprising a compressor, which is adapted to compress cooling agent in the cooling circuit during an active cooling mode, wherein the compressed cooling agent contains lubricant oil from the compressor; a condensing unit, which is connected to the compressor by a first fluid line of the cooling circuit; an evaporator, which comprises a top part, a bottom part, and a plurality of evaporating tubes connecting the top part with the bottom part, wherein the top part is connected to the condensing unit by a second fluid line of the cooling circuit, and wherein the bottom part is connected to the compressor by a third fluid line of the cooling circuit.

A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.

A method for environmentally managing a computing device of an information handling system includes monitoring an environmental corrosion risk associated with a component of the computing device, a corrosion management component that reduces a rate of corrosion of the component due to an ambient environment in which the component resides by removing condensation from the component is associated with the component; making a determination that the component is associated with the corrosion management component; in response to the determination: estimating a corrosion risk of the component based on: the environmental corrosion risk, and a risk reduction factor associated with the corrosion management component; making a second determination that the corrosion risk of the component indicates a premature failure of the component; and remediating, in response to the second determination, the corrosion risk of the component.

Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.