Disclosed is thermal management device that combines a vapor chamber with a mechanical heat sink to provide improved cooling performance under extreme conditions—the vapor chamber and heat sink combination comprises a single-unit device where the vapor chamber side of the device is in direct contact with the heat source and the opposite side of the vapor chamber is equipped with cooling fins that mate with cooperatively sized fins on the heat sink portion of the device.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more flow controllers is associated with a cold plate and with a thermosyphon condenser that is elevated with respect to a cold plate so that two-phase fluid is enabled for gravity-assisted downflow in a liquid phase to a cold plate for absorption of heat and is enabled for buoyancy-driven upflow through a riser tube into a thermosyphon condenser for dissipation of heat of at least one computing device.

A cooling system for a data center includes an evaporative condenser, a pump cabinet and a heat exchange terminal. The pump cabinet has a first branch and a second branch, the first branch including a liquid storage tank and a fluorine pump. An input end of the liquid storage tank is connected to an output end of the evaporative condenser, an output end of the liquid storage tank is connected to an input end of the fluorine pump, and an output end of the fluorine pump is connected to an input end of the heat exchange terminal. The second branch includes a compressor with an input end connected to an output end of the heat exchange terminal and an output end connected to an input end of the evaporative condenser.

A computing device comprises a heat sink including a base and a multi-dimensional thermal dissipation device disposed adjacent to the base. A thermally-conductive grease layer is disposed between and in direct contact with the multi-dimensional thermal dissipation device and the base. A gasket contains the thermally-conductive grease layer between the multi-dimensional thermal dissipation device and the base.

A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.

A temperature controlling method of a liquid cooling device includes a providing step, a disposing step and a processing and controlling step. In the providing step: a microprocessor and multiple flexible micro sensors are provided. In the disposing step: the microprocessor is disposed on the liquid cooling device (including an evaporator, a condenser, a cold water tube, a hot water tube, a pumping motor and a cooling fan motor), and the micro sensors are separately disposed in the cold water tube and the hot water tube to directly contact with the liquid. In the processing and controlling step: the microprocessor receives data sensed in the cold water tube and the hot water tube by the micro sensors to calculate, and controls the pumping motor and the cooling fan motor to modulate an operating performance according to a calculated result.

This invention describes the use of pre-packaged air shipping containers for delivery of edge data center equipment. The containers are capable of rapid deployment and positioning at the edge data center delivery site to minimize time between the order of equipment and deployment of a functioning edge data center. The containers allow for easy access, and rapid repair/replacement of modular edge data center equipment.

A power electronics assembly includes one or more power electronics devices, and a heat exchanger to which the one or more power electronics devices are mounted. The heat exchanger includes an inlet manifold and an outlet manifold, and one or more fluid pathways extending connecting the inlet manifold and the outlet manifold, the heat exchanger configured to transfer thermal energy from the one or more power electronics devices into a flow of fluid passing through the one or more fluid pathways. Thee one or more fluid pathways include one or more internal enhancements and channel configurations to enhance thermal energy transfer by promoting boiling of the flow of fluid and to reduce the pressure drop in the pathways under a two-phase flow condition. The flow of fluid is a flow of liquid refrigerant diverted from a condenser of a heating, ventilation, and air conditioning (HVAC) system.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, multiple parallel refrigerant paths are associated with one or more flow controllers to cool multiple computing devices associated therewith, so that one or more flow controllers can distribute equal measures of a liquid phase of refrigerant, relative to a vapor phase of a refrigerant, to such parallel refrigerant paths based in part on a cooling requirement from at least one of such multiple computing devices.

A cooling plate for cooling high power density electronics has an internal cavity and an opening for fluid exchange with the cavity. A mounting structure is positioned within the opening. A coaxial port is attached to the mounting structure, the coaxial port having a center conduit and a ring conduit surrounding the central conduit such that rotational axis of the center conduit coincides with rotational axis of the ring conduit. A single coaxial port can serve to deliver cooling liquid to the cooling plate and return warmed fluid from the cooling plate. The coaxial port center conduit connected with a fluid distribution panel. Fluid distribution is regulated by the panel before it exits the port through the ring conduit.