Embodiments are disclosed of a cooling device. The cooling device includes a housing enclosing an internal volume, the housing having at least a heat transfer contact surface adapted to be thermally coupled to a heat-generating electronic component. A partition is positioned in the internal volume; the partition divides the internal volume into a liquid compartment and a vapor compartment, and the partition has a gap therein to allow fluid movement between the liquid compartment and the vapor compartment. A liquid inlet is fluidly coupled to the liquid compartment; a liquid outlet is fluidly coupled to the vapor compartment; and a vapor outlet is fluidly coupled to with the vapor compartment. Embodiments of cooling systems including design and operation using the cooling device are also disclosed.

Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

A heat exchanger includes a core defining a first passageway and a second passageway. The core includes a plurality of unit cells coupled together. Each unit cell of the plurality of unit cells includes a first wall and a second wall. The second wall is spaced from the first wall. The first wall at least partially defines a first passageway portion and a second passageway portion. The second wall at least partially defines the second passageway portion. The second wall extends about the first wall such that the first passageway portion is nested within the second passageway portion.

A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

The disclosure relates to the technical field of thermal management of a battery charging and swap station, and in particular to a battery charging and swap station, a thermal management system therefor, a control method for a thermal management system, a control device, and a computer-readable storage medium. The thermal management system includes: a heat pump unit including a compressor, a condenser, a throttling component, and an evaporator which form a refrigerant circulation circuit; a first liquid cooling unit including a charging module and the evaporator which form a first coolant circulation circuit; a second liquid cooling unit including a traction battery portion and the evaporator which form a second coolant circulation circuit; and a third liquid cooling unit including a charging terminal and the evaporator which form a third coolant circulation circuit, where the first and/or the third liquid cooling unit can be in communication with the second liquid cooling unit, so as to transfer heat recovered by the first and/or third liquid cooling unit to the traction battery portion. With such a configuration, a thermal management of the battery charging and swap station can be realized through liquid cooling.

A cooling module includes: a fan having a fan housing with an intake port and an exhaust port; a fin that faces the exhaust port of the fan; a heat pipe connected to a surface of the fin; and a plate-shaped vapor chamber having a first surface and a second surface, the heat pipe being connected to the first surface while straddling one edge of the vapor chamber, the second surface at the one edge being connected to the surface of the fin to be parallel with the heat pipe, so that the one edge is disposed between the heat pipe and the fin.

The present invention is notably directed to a cooling device, e.g., for computer hardware. The device comprises a deformable, outer chamber, having at least one thermally conducting section, the latter suited for thermally contacting a heat source of a computer hardware. The outer chamber is deformable upon a pressure increase therein. The cooling device further comprises at least one inner chamber nested in the outer chamber, the inner chamber expandable in volume upon a pressure increase therein. The invention is further directed to a computer hardware apparatus comprising such a cooling device, or stacks of such cooling devices paired with respective set of electronic components.

A cooling plate includes a fluid inlet port, a cooling enclosure, and an inlet channel coupled between the fluid inlet port and the cooling enclosure to channel a two-phase fluid entering from the inlet port to the cooling enclosure. The cooling enclosure includes a number of heat spreading structures coupled to an inner surface of the cooling enclosure to form spacings, where the two-phase fluid in contact with the heat spreading structures causes portions of the two-phase fluid to change into a vapor phase. The cooling plate includes an extended vapor channel coupled to the cooling enclosure to collect the two-phase fluid in vapor phase. The cooling plate includes a vapor outlet port coupled to the extended vapor channel for the two-phase fluid in vapor phase to exit the vapor outlet port, where the cooling plate is submersible in an immersion tank containing a single-phase immersion fluid.

A server system is described. The server system includes a vapor chamber in thermal communication with a plurality of heat sources and an array of microelectromechanical system (MEMS) jets arranged to cause a fluid to impinge on a surface of the vapor chamber.

An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel. First and second tube parts are in fluid communication with evaporation portion.