A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

A cooling module includes a thermally conductive plate and a heat pipe. The thermally conductive plate includes a groove having two inner walls that are opposite to each other, a first upper protrusion protrusively located on the plate body and the first inner wall, a second upper protrusion protrusively located on the plate body and the second inner wall, a first lower protrusion protrusively located on the first inner wall, and a second lower protrusion protrusively located on the second inner wall. The heat pipe is located in the groove, and cooperatively secured by the first upper protrusion, the second upper protrusion, the first lower protrusion and the second lower protrusion.

A wearable electronic device according to various embodiments of the disclosure includes: a housing including a first housing part in which a processor is received and a second housing part in which a display is received, and a hinge connecting the first housing part and the second housing part and having a hole provided in an area in communication with an outside of the wearable electronic device. At least part of heat generated from the processor is radiated to the outside through the hinge having the hole formed therein.

This present invention pertains to a method and apparatus to improve thermal transfer properties of a protective case for a mobile device such as a smartphone or tablet computer. The protective mobile device case is optimized for temperature regulation and heat transfer by integrating thermal interface materials into key regions of the protective case where heat transfer to or from heat sensitive components within a mobile device are located.

A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.

The disclosure provides a heat dissipation structure and a manufacturing method thereof. The heat dissipation structure includes a heat pipe and multiple heat dissipation fins. The heat pipe has an outer annular wall with multiple conic annular grooves. A slant inner annular wall is disposed in each conic annular groove. Each heat dissipation fin has a through hole and a conic annular wall disposed on an outer edge of the through hole. The heat dissipation fins are adapted to sheathe the heat pipe in a spacedly stacked manner. Each conic annular wall is embedded in each conic annular groove to be adapted to sheathe each slant inner annular wall in a compressive manner. Therefore, efficiency of heat dissipation and structural strength of the heat dissipation structure are improved.

A computing device comprises a heat sink including a base and a multi-dimensional thermal dissipation device disposed adjacent to the base. A thermally-conductive grease layer is disposed between and in direct contact with the multi-dimensional thermal dissipation device and the base. A gasket contains the thermally-conductive grease layer between the multi-dimensional thermal dissipation device and the base.

A thermal module with a heat pipe configured with a first portion configured for contact with an edge of a plurality of fins in a fin stack, a second portion configured for contact with a side of one fin in the fin stack and a sharp angled bend is formed between the first portion and the second portion to fluidly isolate the first portion from the second portion. The first portion comprises a usable length of the heat pipe that efficiently transfers heat based on phase transitioning by the fluid. The second portion is formed from at least some of the unusable length of the heat pipe. By configuring the heat pipe such that more fins contact the usable length of the heat pipe, heat transfer from the heat pipe to the fin stack is increased.

A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.

A thermal module includes a base seat, at least two heat pipes and multiple heat dissipation units. Each heat pipe has a heat absorption end and a heat dissipation end outward extending from the heat absorption end. The heat absorption ends are disposed on the base seat. The heat dissipation ends of the at least two heat pipes are positioned above the base seat at different heights and misaligned from each other. The multiple heat dissipation units are connected with the heat dissipation ends of the heat pipes and arranged at intervals. By means of arranging the multiple heat dissipation unit at intervals as multiple layers, the heat dissipation areas is enlarged to prevent the airflow from being interrupted so as to effectively greatly enhance the heat dissipation efficiency.