An electronic device (10) with a liquid cooling mechanism includes an electronic device body (1), a heat dissipation module (2) and a liquid cooling module (3). The electronic device body (1) includes a housing (11) and at least one heat generating element (12) installed in the housing (11). The heat dissipation module (2) is contained in the housing (11) and attached to the heat generating element (12). The liquid cooling module (3) includes a liquid cooling pipe (31) contained in the housing (11) and attached to the heat dissipation module (2), and two ends of the liquid cooling pipe (31) have two interface portions (311) exposed from the housing (11). In this way, the liquid cooling pipe (31) is used for water cooling to achieve a desirable cooling efficiency for the electronic device (10).

A heat dissipating plate includes a casing, a capillary structure layer, a support structure, and heat dissipating liquid. The casing includes a first substrate and a second substrate, which is disposed opposite to the first substrate to form a non-vacuum sealed cavity. The capillary structure layer is disposed in a first region of the non-vacuum sealed cavity and defines a first flow space. The support structure is disposed in a second region of the non-vacuum sealed cavity and defines a second flow space. The heat dissipating liquid is disposed in the non-vacuum sealed cavity, the liquid amount of which is more than 50% of the total capacity of the first flow space and the second flow space, and flows between the first flow space and the second flow space. The invention also provides a method for manufacturing the heat dissipation plate and an electronic device having the heat dissipation plate.

An object of the present invention is to provide a head-up display apparatus further reduced in size, the head-up display apparatus having: an image display apparatus including a light source and a display element; and a virtual image optical system in which light emitted from the image display apparatus is reflected by a windshield or a combiner of the vehicle so that a virtual image is displayed in front of the vehicle, wherein the virtual image optical system has a concave mirror and a distortion correcting lens, and the distortion correcting lens is disposed between the image display apparatus and the concave mirror, the concave mirror is disposed in a housing including an outer case along a shape of an effective light path area of the image light from the image display apparatus, and the image display apparatus is attached to part of an outer periphery of the housing.

A cooling system for an information handling system in a portable chassis comprises a fan housing containing two counterrotating impellers, wherein the axes of rotation of the two impellers are aligned with an axis of orientation relative to a rear surface of the portable chassis. By changing the angle of the axis of orientation, impellers with larger diameters may be positioned in the same fan area for increased volumetric airflow. The shape of the fan housing, the diameter of each impeller and the angle of the axis of orientation may be selected to direct and distribute a greater volumetric airflow for improved cooling of components in the portable chassis.

An outdoor, hardened telecommunications clamshell platform includes a base half and a top cover half. The platform also includes a Printed Circuit Board (PCB) disposed between two cooling plates within the platform, and a heat distributing mechanism surrounding the PCB within the platform and configured to distribute heat substantially evenly between the base half and the top cover half.

An electronics system for an aircraft includes a mounting structure and a plate element mounted to the mounting structure with opposing face surfaces, a central region and side edge regions. A serpentine passage in the plate element contains alternating liquid slugs and vapor plugs along its length. The plate element is configured for gathering heat proximate the central region and moving the heat to the side edge regions. An electronic system is mounted on a face surface of the plate element and a heat dissipating structure is thermally coupled with the plate element and positioned along the side edge regions thereof for dissipating heat moved to the side edge regions. A cover structure covers the plate element and electronic system.

The present invention is related to a laminated thin heat dissipation device mainly comprising an upper plate, at least one first layer plate, at least one second layer plate, a lower plate and a working fluid, the first, second layer plates having at least one first, second hollow slots respectively, wherein the upper plate, the first layer plate, the second layer plate and the lower plate are laminated to form a hollow body, the first hollow slot and the second hollow slot are communicated with each other and form an enclosed chamber, the enclosed chamber includes at least one first fluid channel and at least one second fluid channel, the enclosed chamber of the hollow body is filled with the working fluid, the first fluid channel serves as a vapor flow path, and the second fluid channel serves as a condensed fluid flow path.

A heat dissipating mechanism is for heat dissipation of a display module and a heat generating module of a display apparatus and includes a frame structure, a first airflow generating device, and a conductive cover structure having first, second, and third covers. The first cover is connected to the frame structure for containing the display module. The second cover has an air inlet and an air outlet and is connected to the first cover to form a channel. The third cover is connected to the second cover for containing the heat generating module. The first airflow generating device is disposed in the air inlet to guide air into the channel and out of the air outlet, so as to form an airflow for heat dissipation of the display module and the heat generating module.

There is provided a thermal management apparatus for use with a vehicle comprising: a chassis in thermal contact with one or more first components that require thermal management and one or more second components that require thermal management, wherein the chassis is configured to transfer heat from the one or more first components to the one or more second components.

Disclosed is a heat radiation device including: a heat receiver configured to be in contact with a heat radiation target; a heat radiator that radiates heat into air; and a heat pipe that transfers heat from the heat receiver to the heat radiator. The heat pipe includes a bend that bends in a direction away from the heat radiation target. The heat receiver includes a section that follows at least part of the bend and is in contact with the bend.