Patent classifications
H05K7/20354
System for a remote, active phase-transition cooling system utilizing a solid-state modular connector system as a method for heat-transport
An active phase change cooling system and modular connector for heat transportation consisting of: two heat exchangers, a compressor, a flow limiting orifice, a heat source surface transfer component, a heat transfer plate to deliver heat to the heat exchanger and a modular connectors bridging the gap between the heat source and the heat exchanger. Packaged in a mostly sealed environment where heat is delivered to the fluid and via directed air flow, excess heat is exhausted to the external environment.
INTELLIGENT LOW PRESSURE TWO-PHASE COLD PLATE WITH FLOW STABILIZATION FOR DATACENTER COOLING SYSTEMS
Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes an evaporator to remove heat from at least one computing device using a two-phase fluid and using a buffer to perform flow stabilization represented by different volumes or different flow rates of a two-phase fluid that is enabled to flow between an evaporator and a condensing or compressor unit located external to a cold plate.
APPARATUS AND SYSTEM FOR TWO-PHASE SERVER COOLING
Embodiments are disclosed of a cooling device. The cooling device includes a housing enclosing an internal volume, the housing having at least a heat transfer contact surface adapted to be thermally coupled to a heat-generating electronic component. A partition is positioned in the internal volume; the partition divides the internal volume into a liquid compartment and a vapor compartment, and the partition has a gap therein to allow fluid movement between the liquid compartment and the vapor compartment. A liquid inlet is fluidly coupled to the liquid compartment; a liquid outlet is fluidly coupled to the vapor compartment; and a vapor outlet is fluidly coupled to with the vapor compartment. Embodiments of cooling systems including design and operation using the cooling device are also disclosed.
BATTERY CHARGING AND SWAP STATION, THERMAL MANAGEMENT SYSTEM AND CONTROL METHOD THEREFOR, CONTROL DEVICE, AND MEDIUM
The disclosure relates to the technical field of thermal management of a battery charging and swap station, and in particular to a battery charging and swap station, a thermal management system therefor, a control method for a thermal management system, a control device, and a computer-readable storage medium. The thermal management system includes: a heat pump unit including a compressor, a condenser, a throttling component, and an evaporator which form a refrigerant circulation circuit; a first liquid cooling unit including a charging module and the evaporator which form a first coolant circulation circuit; a second liquid cooling unit including a traction battery portion and the evaporator which form a second coolant circulation circuit; and a third liquid cooling unit including a charging terminal and the evaporator which form a third coolant circulation circuit, where the first and/or the third liquid cooling unit can be in communication with the second liquid cooling unit, so as to transfer heat recovered by the first and/or third liquid cooling unit to the traction battery portion. With such a configuration, a thermal management of the battery charging and swap station can be realized through liquid cooling.
Cooling system of a magnetic resonance apparatus and magnetic resonance apparatus
A cooling system of a magnetic resonance apparatus is disclosed. In the cooling system, a first cooling device and a second cooling device are used to realize a secondary step of cooling of a circulating fluid without energy consumption, thereby reducing the operating energy consumption of the cooling system. In addition, a magnetic resonance apparatus comprising the cooling system is further provided.
Data center liquid conduction and carbon dioxide based cooling apparatus and method
Embodiments disclosed include a heat exchange apparatus and method comprising, in an electronic device, a first heat exchanger for exchanging heat with the device wherein the heat exchanger comprises a flow duct for receiving a fluid, and at least a portion of the flow duct is arranged for thermal communication with the device. Preferred embodiments include a pressure reducing unit comprising a pump associated with the flow duct and a Venturi tube configured for reducing the pressure of the fluid in the portion of the flow duct arranged in thermal communication with the device and less than the pressure external to the duct. An embodiment includes a fluid reservoir, and a second heat exchanger for removing heat from the fluid reservoir wherein the second heat exchanger comprises an evaporator in a refrigerant system through which refrigerant is passed in a closed loop via an expansion valve from a gas cooler and back into a compressor.
AIR PIPE ASSEMBLY
A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.
Vapor cycle convective cooling of electronics
A cold plate device and method for cooling electronic systems is provided including a generally flat thermally conductive body having a cooling channel within the thermally conductive body. A first cooling fluid travels through the cooling channel to remove heat from the conductive body. A vapor compression cycle system is coupled to the thermally conductive body such that the first cooling fluid removes heat from a second cooling fluid in a portion of the vapor compression cycle system.
COOLING SYSTEM FOR DATA CENTER BASED ON HYPERBOLA COOLING TOWER
The embodiments of the present application provide a cooling system for data center based on a hyperbola cooling tower. The cooling system includes a compressor, a condenser, a primary fluorine pump, a secondary fluorine pump, a throttling apparatus, an evaporator, and a server. The server is configured to receive data information uploaded from the compressor, the condenser, the primary fluorine pump, the secondary fluorine pump, the throttling apparatus, and the evaporator, calculates the operation frequency of the compressor based on the data information, and control the condenser, the primary fluorine pump, the secondary fluorine pump and the throttling apparatus to transport the refrigerant to the evaporator.
ELECTRIC DEVICE AND ELECTRIC DEVICE MANUFACTURING METHOD
An electric device includes a case, an electric component that is provided in the case and has a main body section and a lead terminal extending from the main body section, the main body section being supported on the case, a circuit board that is provided in the case and has a connecting hole through which the lead terminal is inserted, and a guide member that has a guide hole positioned relative to the connecting hole, the lead terminal being disposed to penetrate through the guide hole.