A heat-recovery-type refrigerating apparatus includes a compressor, a heat-source-side heat exchanger, and a plurality of usage-side heat exchangers, and refrigerant is sent from the usage-side heat exchanger functioning as a refrigerant radiator to the usage-side heat exchanger functioning as a refrigerant evaporator, whereby heat can be recovered between the usage-side heat exchangers. Here, a portion of the heat-source-side heat exchanger is configured as a precooling heat exchanger for always circulating high-pressure vapor refrigerant discharged from the compressor, and a refrigerant cooler for cooling an electrical equipment item is connected to a downstream side of the precooling heat exchanger.

A cooling device includes a first evaporation unit, a second evaporation unit, a first condensation unit, a second condensation unit, common piping, a compressor, an expansion valve, a first valve, and a second valve. The common piping combines liquid-phase refrigerant flowing from the first condensation unit and liquid-phase refrigerant flowing from the second condensation unit. The first valve adjusts the liquid-phase refrigerant amount flowing into the first evaporation unit. The second valve adjusts the liquid-phase refrigerant amount flowing into the second evaporation unit. In addition, the pressure inside the common pipe is greater than the respective pressures inside the first evaporation unit and the second evaporation unit.

An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.

An integrated type air conditioning device includes a first refrigeration cycle that is an evaporative cooling type, a second refrigeration cycle that is a vapor-compression type, a blower device, and a housing accommodating the first and second cycles. The first refrigeration cycle includes an evaporation heat exchanger, a condensation heat exchanger, and a first refrigerant pipe. The second refrigeration cycle includes a compressor, a condenser, a decompression device, an evaporator, and a second refrigerant pipe. The housing is partitioned into an interior air passage and an exterior air passage. The evaporation heat exchanger and the evaporator are positioned in the interior air passage, the evaporation heat exchanger being located upstream of the evaporator with respect to an interior airflow in the interior air passage. The blower device is disposed in the interior air passage and is driven to generate the interior airflow in the interior air passage.

A cooling system, including a first refrigeration medium, a first evaporator, a first condenser, and an all-condition cooling tower. The first evaporator is installed in a to-be-cooled space, the first evaporator is connected to the first condenser, an installation position of the first condenser is higher than an installation position of the first evaporator; the first condenser is connected to the all-condition cooling tower, and the all-condition cooling tower is disposed outside the to-be-cooled space, the all-condition cooling tower is used for providing the first condenser with a cold source for cooling the first refrigeration medium in a gaseous state.

A power supply system includes a plurality of batteries, a cooling portion through which a refrigerant for cooling the plurality of the batteries flows, a housing that has a bottom plate, a top plate, and side walls, the housing accommodating the plurality of the batteries and the cooling portion, and a compressor configured to pump the refrigerant to the cooling portion. In the housing, a strength member that extends in a direction in which the side walls face each other and reinforces the housing is mounted on the bottom plate or the top plate. The compressor is disposed in a position in which the compressor and the strength member are overlapped in the upright direction of the side walls.

Embodiments are disclosed of a cooling system for use in a data center. The cooling system includes an IT region, a ceiling region, and a cooling air plenum sandwiched between the IT region and the ceiling region. The IT region includes one or more IT plenums that are coupled to the cooling air plenum to supply cooling air to the IT region, which can have house a plurality of IT racks that are clustered around the IT plenums and are adapted to house one or more pieces of liquid-cooled or hybrid-cooled information technology (IT) equipment. The ceiling region includes one or more ceiling plenums and one or more sets of heat exchangers, each heat exchanger being cooled by the cooling air delivered to the ceiling plenums. The cooling air plenum is fluidly coupled by a flow control to the one or more IT plenums and is fluidly coupled by a flow control to the one or more ceiling plenums or to the volume of the ceiling region between ceiling plenums.

An overall efficient heat dissipation system for a high power density cabinet comprises a pump-driven two-phase circulation loop high-power-chip direct heat dissipation system and a cabinet air-cooling system. The cabinet air-cooling system comprises a refrigerant circulation loop and a cabinet internal air circulation loop. The refrigerant circulation loop includes a pump-driven two-phase circulation loop and a vapor compression circulation loop. The pump-driven two-phase circulation loop high-power-chip direct heat dissipation system performs fixed-point heat dissipation for main heating elements, such as CPU and GPU, in a server, and the cabinet air-cooling system performs air-cooling heat dissipation for other heating elements in the server.

A refrigeration cycle apparatus includes: a refrigerant circuit configured to circulate refrigerant; and a controller configured to control the refrigerant circuit. The refrigerant circuit includes a compressor, a first heat exchanger, a first expansion device, a second expansion device, a third expansion device, a second heat exchanger, and a cooler configured to cool a substrate of the controller. In a first path of the refrigerant circuit, the compressor, the first heat exchanger, the first expansion device, the second expansion device, and the second heat exchanger are connected in order of the compressor, the first heat exchanger, the first expansion device, the second expansion device, and the second heat exchanger. In a second path of the refrigerant circuit, the cooler and the third expansion device are connected in order of the cooler and the third expansion device from a first point between the first expansion device and the second expansion device to a second point between the compressor and the second heat exchanger.

Thermal management systems for cooling high-power, low-duty-cycle thermal loads by rejecting heat from the thermal loads to the ambient environment are provided. The thermal management systems include a two-phase pump loop in fluid communication with a vapor compression system loop, evaporators disposed in parallel between the two-phase pump loop and the vapor compression system loop, and a thermal energy storage loop including a cold-temperature tank and a warm-temperature tank thermally coupled to the two-phase pump loop and the vapor-compression system loop. Methods of transferring heat from one or more thermal loads to an ambient environment are also provided.