Thermal management systems for cooling high-power, low-duty-cycle thermal loads by rejecting heat from the thermal loads to the ambient environment are provided. The thermal management systems include a two-phase pump loop in fluid communication with a vapor compression system loop, evaporators disposed in parallel between the two-phase pump loop and the vapor compression system loop, and a thermal energy storage loop including a cold-temperature tank and a warm-temperature tank thermally coupled to the two-phase pump loop and the vapor-compression system loop. Methods of transferring heat from one or more thermal loads to an ambient environment are also provided.

A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

A projector includes first and second cooling targets and a cooling device. The cooling device includes a first compressor, a condenser, a first expander configured to decompress a part of the working fluid condensed by the condenser, a first evaporator configured to change the working fluid in a liquid phase flowing from the first expander into the working fluid in a gas phase by using heat from the first cooling target, a second expander configured to decompress the other part of the working fluid condensed by the condenser, a second evaporator configured to change the working fluid in a liquid phase flowing from the second expander into the working fluid in a gas phase by using heat from the second cooling target, and a second compressor configured to compress the working fluid in a gas phase flowing from the second evaporator.

The embodiments of the present application provide a cooling system for data center based on a hyperbola cooling tower. The cooling system includes a compressor, a condenser, a primary fluorine pump, a secondary fluorine pump, a throttling apparatus, an evaporator, and a server. The server is configured to receive data information uploaded from the compressor, the condenser, the primary fluorine pump, the secondary fluorine pump, the throttling apparatus, and the evaporator, calculates the operation frequency of the compressor based on the data information, and control the condenser, the primary fluorine pump, the secondary fluorine pump and the throttling apparatus to transport the refrigerant to the evaporator.

A cooling system for a data center includes an evaporative condenser, a pump cabinet and a heat exchange terminal. The pump cabinet has a first branch and a second branch, the first branch including a liquid storage tank and a fluorine pump. An input end of the liquid storage tank is connected to an output end of the evaporative condenser, an output end of the liquid storage tank is connected to an input end of the fluorine pump, and an output end of the fluorine pump is connected to an input end of the heat exchange terminal. The second branch includes a compressor with an input end connected to an output end of the heat exchange terminal and an output end connected to an input end of the evaporative condenser.

An overall efficient heat dissipation system for a high power density cabinet comprises a pump-driven two-phase circulation loop high-power-chip direct heat dissipation system and a cabinet air-cooling system. The cabinet air-cooling system comprises a refrigerant circulation loop and a cabinet internal air circulation loop. The refrigerant circulation loop includes a pump-driven two-phase circulation loop and a vapor compression circulation loop. The pump-driven two-phase circulation loop high-power-chip direct heat dissipation system performs fixed-point heat dissipation for main heating elements, such as CPU and GPU, in a server, and the cabinet air-cooling system performs air-cooling heat dissipation for other heating elements in the server.

A power supply system includes a plurality of batteries, a cooling portion through which a refrigerant for cooling the plurality of the batteries flows, a housing that has a bottom plate, a top plate, and side walls, the housing accommodating the plurality of the batteries and the cooling portion, and a compressor configured to pump the refrigerant to the cooling portion. In the housing, a strength member that extends in a direction in which the side walls face each other and reinforces the housing is mounted on the bottom plate or the top plate. The compressor is disposed in a position in which the compressor and the strength member are overlapped in the upright direction of the side walls.

A refrigeration circuit device includes a compressor for compressing a refrigerant, As viewed in the refrigerant flow direction, a condenser is connected downstream of the compressor, a first expansion device is connected downstream of the condenser, a heat exchanger is connected downstream of the first expansion device, a second expansion device is connected downstream of the heat exchanger, an evaporator is connected downstream of the second expansion device, and the compressor is connected downstream of the evaporator. The heat exchanger is configured for connection to an electronic device that is to be cooled, is configured as an internal heat exchanger for additional transfer of heat to the refrigerant, and includes a primary side, connected on one side to the first and on the other side to the second expansion device, and a secondary side, connected on one side to the evaporator and on the other side to the compressor.

A cooling system includes: a local cooler that is positioned near a server serving as a heat source and that evaporates a refrigerant by directly receiving heat from the server to generate a gas-phase refrigerant; a compressor that compresses the gas-phase refrigerant; an outdoor unit that condenses the gas-phase refrigerant supplied from the compressor by dissipating heat from the gas-phase refrigerant; an expansion valve that depressurizes the refrigerant supplied from the outdoor unit and sends the refrigerant to the local cooler; a pair of detectors that are respectively provided at an inlet side and an outlet side of the compressor and detect a state of the gas-phase refrigerant supplied from the local cooler; and a proportional control valve and a high-speed on-off valve that are operated based on a refrigerant state ratio calculated from a detection value of the detectors.

A weapons system includes a high-energy beam unit and a power and thermal management system. The high-energy beam unit is configured to discharge high-energy beams. The power and thermal management system is configured to supply power to the high-energy beam unit and to manage the temperature of the high-energy beam unit.