A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.

A cooling system for an equipment closet in a building has a direct expansion cooling circuit. The cooling system has two basic modes of operation. A first mode where the direct expansion cooling circuit is off and transfer air from an area of the building outside the equipment closet is used to cool the interior of the equipment closet without any cooling provided by the direct expansion cooling circuit and a second mode where the direct expansion cooling circuit is on and provides direct expansion cooling that is used to cool the interior of the equipment closet.

Heat-and-cold recovery system based on liquid cooling data center (energy storage power station) includes high-temperature heat pump, pressure-less heat-storage tank, pressurized heat-storage tank, absorption-type water chiller group, compression-type water chiller group, water cold-storage tank, and PCM cold-storage tank. High-temperature heat pump forms circulating heat-exchange loops with CDU and with pressure-less heat-storage tank; hot-water output interface of pressure-less heat-storage tank connects to pressurized heat-storage tank through first circulating pump set and pipeline heater sequentially; pressurized heat-storage tank stores and outputs hot water/steam; pressurized heat-storage tank connects to absorption-type water chiller group through second circulating pump set and forms circulating heat-exchange loop with pressure-less heat-storage tank through absorption-type water chiller group; absorption-type water chiller group forms circulating heat-exchange loop with computer-room air-cooling region; compression-type water chiller group connects to water/PCM cold-storage tank, which stores cooling water of compression-type water chiller group for heat exchange to CDU and/or computer-room air-cooling region.

A refrigerant circuit for a variable frequency drive (VFD) heat sink is disclosed. The refrigerant circuit comprises one or more channels machined in a predefined profile and positioned in thermal contact with a VFD. The channels are adapted to allow the flow of a cooling fluid therethrough to facilitate the dissipation of heat generated by the VFD. The channels are machined in the predefined profile such that each of the machined flow path comprises a predefined number of turns or a predefined number of passes.

The present disclosure discloses a container data center and a refrigeration control method thereof. The container data center at least includes a box body, a server unit and a refrigeration device, where the box body is internally provided with an accommodating space. The server unit is installed in the accommodating space, and a reserved space is reserved between two sides and a top of the server unit and an inner wall of the box body. The refrigeration device includes an indoor unit and an outdoor unit, where the indoor unit is installed in the reserved space, and the indoor unit is positioned above the server unit to divide the reserved space into a cold runner and a hot runner.

The invention relates to a regulation method for an electrical enclosure cooling device, which has a refrigerating machine and a heat pipe arrangement, wherein the method comprises measuring a current internal electrical enclosure temperature and determining a target temperature for the internal electrical enclosure temperature, wherein said internal electrical enclosure temperature and target temperature form input signals of a regulator for actuating the electrical enclosure cooling device, and wherein said regulator outputs a control signal for determining manipulated variables of the refrigerating machine; determining the regulator control signal as a measured variable which is proportional to the respective current required cooling power; measuring the ambient electrical enclosure temperature and determining a respective energy efficiency for the refrigerating machine and the heat pipe arrangement either in the event that the required cooling power is to be provided by the refrigerating machine or in the event that the required cooling power is to be provided by the heat pipe arrangement; and selecting and activating that one of the two coolant circuits that can provide the required cooling power with greater energy efficiency.

A refrigeration system, including: an electronic control unit, including a housing and an electronic device arranged in the housing; a refrigeration loop, including a compressor, a condenser, a primary throttling element, and an evaporator sequentially connected through a pipeline and forming a closed loop; and an electronic device cooling branch connected into the refrigeration loop from the condenser, and connected back to the refrigeration loop from the evaporator; the electronic device cooling branch including an electronic device cooling unit, a secondary throttling element, and an electromagnetic valve; and the electronic device cooling unit being arranged in the housing and spaced apart from the electronic device, for reducing the temperature and humidity of the electronic device and an environment in the housing.

A modular cooling system configured to treat IT air generated by a data center includes a frame and a plurality of cooling sub-system modules supported by the frame. The plurality of cooling sub-system modules are configured to operate in parallel to achieve total cooling effect or a lesser cooling effect with some level of redundancy within the data center. Each cooling sub-system module includes a housing configured to support cooling equipment, an air-to-air heat exchanger supported by the housing to cool IT air generated by the data center, the air-to-air heat exchanger having at least one tube configured to direct IT from one end of the air-to-air heat exchanger to an opposite end of the air-to-air heat exchanger and configured so that outdoor air circulates around the at least one tube, and a mechanical cooling system supported by the housing. The mechanical cooling system is configured to receive IT air treated by the air-to-air heat exchanger and to provide further cooling to the treated IT air. Other embodiments of the cooling system and methods of cooling are further disclosed.

A flow control cartridge is used with a cold plate to form a cold plate assembly within which a refrigerant circulates for cooling at least one heat generating device. The cartridge includes a thermal expansion valve and a sensing portion that with a bellows-type actuator within the cartridge. The bellows-type actuator is located directly in a stream of the refrigerant exiting the cold plate. The thermal expansion valve is comprised of a main body having an inlet orifice arranged to receive refrigerant that has been subcooled from a condenser of a vapor compression system or a recuperative heat exchanger, and a needle arranged in an expanded section of the main body in association with discharge ports in the expanded section for discharging the refrigerant in a two-phase state into the cold plate.

A method for removing moisture from an airflow via a cooling system includes identifying a plurality of active cooling circuits in the cooling system. The method also includes lowering a first temperature set point of a first cooling circuit of the multiple cooling circuits. In addition, the method includes raising a second temperature set point of a second cooling circuit of the multiple cooling circuits.