A substrate placement device includes a stage having a substrate placement surface on which a substrate is placed, a cooling head provided to face the stage and configured to be cooled to an extremely low temperature by a refrigerator, a contact/separation mechanism configured to cause the stage and the cooling head to be brought into contact with or separated from each other, a rotation mechanism configured to rotate the stage, and a controller. The controller is configured to: cause, except during the film formation, the stage and the cooling head to be in a state where the stage and the cooling head are brought into contact with each other to place the substrate on the stage in that state; and cause, during the film formation, the stage to rotate in a state where the stage and the cooling head are separated from each other by the contact/separation mechanism.

A heat sink includes a plurality of apertures extending therethrough. The heat sink is arranged substantially parallel to a circuit board and includes at least one aperture transversely aligned with a corresponding IC chip of the circuit board. An underside of the heat sink is structurally connected to the circuit board. A plurality of thermal bridges is provided. Each thermal bridge includes a center bridge pad and at least one footer pad, connected via at least one offset wire. Each thermal bridge is aligned with a corresponding aperture. An underside of each footer pad is attached to the heat sink, with the offset wire extending into the corresponding aperture to suspend the center bridge pad at least partially into the aperture above the IC chip, thus creating a thermal load path. The apparatus separates a thermal load path from a structural load path in a circuit board environment.

An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards, each including first and second subassemblies. Each of the subassemblies is surrounded in a longitudinal-lateral plane by a corresponding first or second perimeter frame. The first and second subassemblies have first and second operating temperatures, respectively. A first temperature tank is formed by first perimeter frames and substantially surrounds the first subassemblies. A second temperature tank is formed by second perimeter frames and substantially surrounds the second circuit card subassemblies. A first temperature cooling supply line selectively introduces the first cooling fluid into the first temperature tank for at least partially inducing the first operating temperature. A second temperature cooling supply line selectively introduces the second cooling fluid into the second temperature tank for at least partially inducing the second operating temperature.

A method and apparatus for cooling a load using liquid nitrogen conveyed in a circuit are provided. Cooled liquid nitrogen is used for cooling the liquid nitrogen conveyed in the circuit. A first proportion of the liquid nitrogen is cooled in an open cooling system and a second proportion is cooled in a closed cooling system using one or more cooling units. The open cooling system and closed cooling system are used for cooling of a power supply having a first end and a second end. The open cooling system is arranged at the first end and the closed cooling system is arranged at the second end. Cooling power is provided in a first time period as a first, smaller amount of total cooling power and in a second time period as a second, higher amount of total cooling power. A first proportion of the amount of total cooling power is provided by means of the open cooling system and a second proportion is provided by means of the closed cooling system. The first proportion in the first time period is set to a lower value than in the second time period.

A data center is cooled by a cryogenic cooling system which is wind driven, and powered by energy stored in the cryogenic liquid. The cooling occurs through downwardly passing cryogenic liquid which is recycled and pushed back to a top of a system in a cyclic manner.

A heat transfer device includes a storage chamber, a coolant housed within the storage chamber, a cooling chamber, one or more heat transfer components, a fluid passage between the storage chamber and the cooling chamber, and a barrier element. The one or more heat transfer components facilitate heat transfer from a heat source outside of the cooling chamber to the cooling chamber. The barrier element may have (i) a closed configuration, and (ii) an open configuration in which the barrier element is configured to allow the coolant in the storage chamber to flow from the storage chamber into the cooling chamber. The barrier element may reconfigure from the closed configuration to the open configuration in response to a trigger condition, such as the coolant housed within the storage chamber reaching a trigger temperature; and/or the initial pressure of the coolant housed within the storage chamber reaching a trigger pressure.

The embodiments herein describe technologies of cryogenic digital systems with a power supply located in an ambient temperature domain and logic located in a cryogenic temperature domain. A pair of conductors is operable to carry current with a voltage difference between the power supply and the logic. The pair of conductors includes a first portion thermally coupled to a temperature-regulated or temperature-controlled intermediate temperature domain. The intermediate temperature domain is less than the ambient temperature domain and greater than the cryogenic temperature domain.

A fluid deployment unit includes an expandable container containing mixed fluids in a gaseous region and a liquid region, where the expandable container includes a gas-out port, a liquid-out port, a gas-in port, and a liquid-in port. The fluid deployment unit includes a first three-way valve having a first port coupled to the liquid-out port, a second port coupled to the gas-out port, and a third port matable to an inlet of an electronic rack. The fluid deployment unit includes a second three-way valve having a first port matable to an input port of a liquid-to-liquid exchange unit of a testing assistant unit, a second port coupled to the gas-in port, and a third port matable to an outlet of the electronic rack, where the liquid-in port of the expandable container is matable to an output port of the liquid-to-liquid exchange unit.

A thermal radiation shield interface for cryogenic systems includes a first element with a distal, free end. Flanges project from the distal, free end of the first element. A second element also includes a distal, free end. Flanges project from the distal, free end of the second element. The flanges of the first element and the flanges of the second element are positioned in an interleaved arrangement to cover an opening between the first element and the second element shielding the opening from radiation leakage.

Separating temperature domains in cooled systems, including: cooling at least one first component of a circuit board using a first cooling system; and conductively coupling the at least one first component to at least one second component using a superconductive portion of a power plane of the circuit board.