A method, system, and arrangement for resetting qubits are disclosed. An example system includes one or more quantum circuit refrigerators for resetting qubits. Each of the quantum circuit refrigerators includes a tunneling junction and a control input for receiving a control signal. Photon-assisted single-electron tunneling takes place across the respective tunneling junction in response to a control signal. Capacitive or inductive coupling elements between the qubits and the quantum circuit refrigerators couple each qubit to the quantum circuit refrigerator(s). The qubits, quantum circuit refrigerators, and coupling elements are located in a cryogenically cooled environment. A common control signal line to the control inputs crosses into the cryogenically cooled environment from a room temperature environment.

A thermal management system includes an immersion tank, a cooling fluid, and an air-cooled condenser. The immersion tank devices an immersion chamber, and the cooling fluid is at least partially located in the immersion chamber. The air-cooled condenser is in fluid communication with the immersion chamber to cool the cooling fluid.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate has microchannels and a heat pipe to support a first fluid in an active mode of operation of a cold plate that uses microchannels, and to support a second fluid in a passive mode of operation of a cold plate that uses a heat pipe.

A heat pipe is provided for cooling an electronic component of a printed circuit board. The heat pipe includes a tube having an inner diameter surface defining a bore, with the tube having first and second ends along the bore. The heat pipe further includes a sorbent material coated onto the inner diameter surface of the tube, a first liquid contained within the bore, and a second liquid adsorbed by the sorbent material. The second liquid has a second boiling temperature that is higher than a first boiling temperature of the first liquid. The first liquid vaporizes into a first vapor, in response to the tube receiving heat from the electronic component and the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material and vaporizes into a second vapor in response to the second liquid reaching the second boiling temperature.

A cooling system, including a first refrigeration medium, a first evaporator, a first condenser, and an all-condition cooling tower. The first evaporator is installed in a to-be-cooled space, the first evaporator is connected to the first condenser, an installation position of the first condenser is higher than an installation position of the first evaporator; the first condenser is connected to the all-condition cooling tower, and the all-condition cooling tower is disposed outside the to-be-cooled space, the all-condition cooling tower is used for providing the first condenser with a cold source for cooling the first refrigeration medium in a gaseous state.

Disclosed are row cooling units and connecting units with a network of integrated fluid distribution piping that may be interconnected to construct a liquid cooling system to carry way heat generated by servers housed within the server racks used in data centers. The assembly of row cooling units and connecting units may be connected to the supply and return loops of the data center facility to distribute cooling liquid to the electronic components of the servers and to return heated liquid for heat removal. The network of fluid distribution piping integrated into the row cooling units and connecting units enables the configuration of the liquid cooling system to be independent of the fixed infrastructure of the facility, affording ease of scalability, serviceability, maintenance, while increasing efficiency, resiliency, availability and reliability of the liquid cooling system critical to the operation and performance of the data center.

Apparatuses, systems, devices, and methods for variable temperature heat exchange switch are disclosed. An apparatus includes a heat exchanger coupled to an electronic component to dissipate heat from the electronic component. The apparatus includes a heat pipe connected to the heat exchanger and configured to dissipate heat. An apparatus includes a thermal-activated switch located at the connection between the heat exchanger and the heat pipe. The thermal-activated switch may be configured to allow heat transfer from the heat exchanger to the heat pipe in response to a temperature satisfying a threshold temperature.

A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously, a pH indicator is employed to monitor the dielectric fluid.

A refrigeration cycle apparatus includes: a refrigerant circuit configured to circulate refrigerant; and a controller configured to control the refrigerant circuit. The refrigerant circuit includes a compressor, a first heat exchanger, a first expansion device, a second expansion device, a third expansion device, a second heat exchanger, and a cooler configured to cool a substrate of the controller. In a first path of the refrigerant circuit, the compressor, the first heat exchanger, the first expansion device, the second expansion device, and the second heat exchanger are connected in order of the compressor, the first heat exchanger, the first expansion device, the second expansion device, and the second heat exchanger. In a second path of the refrigerant circuit, the cooler and the third expansion device are connected in order of the cooler and the third expansion device from a first point between the first expansion device and the second expansion device to a second point between the compressor and the second heat exchanger.

A cooling system including a vaporizer configured to absorb heat due to a liquid-phase refrigerant being vaporized, a condenser configured to discharge heat due to a refrigerant in a gaseous phase state being liquefied, a resistance body provided in a middle of a pipe passage ranging from the vaporizer to the condenser and applying a resistance to the refrigerant, state detection sensors provided in the pipe passage on an upstream and downstream sides of the resistance body and detecting a state of the refrigerant flowing through each side inside the pipe passage, and a flow rate controller configured to detect droplets in the refrigerant flowing through the pipe passage on the basis of a difference between detection values of the state detection sensors which are detected on the upstream and downstream sides of the resistance body, and controls a flow rate of the refrigerant on the basis of detection results.