A control-cabinet system has a base module and at least one functional module. The base module has a base housing with a first housing face and a second housing face. The functional module has a functional housing with a housing underside, where a circulation channel is arranged. Air flow may be circulated in the circulation channel, where each base connection element comprises circulation openings which are fluidically connected to the circulation channel. The functional connection element comprises coupling openings fluidically connected to an interior of the functional housing. The coupling openings are coupleable to the circulation openings, in which a fluidic connection exists between the circulation channel and the interior of the functional housing. A fluidically closed circulation circuit comprising the circulation channel and the interior of the functional housing is formed, in which air flow may be circulated.

A panelboard assembly for a harsh and/or hazardous environment is provided. The panelboard assembly includes a core assembly. The core assembly includes a main breaker assembly configured to be electrically connected to a power supply, and a branch breaker assembly electrically connected to the main breaker assembly and configured to be electrically connected to one or more loads, and a power distribution heatsink assembly. The power distribution heatsink assembly includes an electrically-conductive heatsink having a first end and an opposing second end, the first end electrically connected to the core assembly and an electrically-nonconductive isolator electrically insulating the heatsink.

Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.

The invention relates to a cooler or cooler body which in particular is adapted for cooling electronic structural units or assemblies.

An integrated controller can be equipped with an advanced driver assistance system (ADAS) of a vehicle. The integrated controller includes a printed circuit board, a housing of a heat dissipation fin structure positioned to surround the at least one printed circuit board, a thermal grease provided on a surface of the printed circuit board and on a surface of the housing, and a bolt fastening portion connecting the printed circuit board to the housing.

The present invention provides a structure of uniform-temperature heat dissipation device. A thermal plate is disposed on a heat-emitting device on a substrate correspondingly. A thermal assembly is disposed on the thermal plate correspondingly and includes an outer casing and a thermal casing. The outer casing is disposed on the thermal plate. The thermal casing is disposed inside the outer casing. The thermal casing includes a heat dissipation fluid inside. By using the flow of the heat dissipation fluid inside the thermal casing, the heat from the heat-emitting device can be dissipated rapidly. Finally, a first heat dissipation member and a limiting recess clamp the outer casing and the first heat dissipation member can further dissipate the heat from the thermal assembly.

An electronic apparatus includes: a chassis; a substrate housed in the chassis and with a processing device mounted thereon; a speaker device housed in the chassis and having a speaker unit and a speaker box; and a cooling device housed in the chassis and used to cool the processing device. The substrate is placed vertically along the vertical direction of the chassis. The cooling device includes: a fan having air intake ports provided on upper and lower surfaces, exhaust ports provided on side surfaces, and an impeller, and being placed horizontally in the chassis with a rotating shaft of the impeller placed along the vertical direction of the chassis; a fin placed facing the exhaust port of the fan and placed horizontally in the chassis; and a heat pipe with a first end connected to the processing device and a second end connected to the fin.

An apparatus includes: a power converter including a plurality of electronic switches, the electronic switches being controllable to produce a driver signal having a variable amplitude, frequency, and/or phase; and a single-piece base made of a thermally conductive polymer material. The single-piece base includes: a first side configured to hold the power converter; a second side; and one or more heat dissipating elements that extend from the second side. The heat dissipating elements are configured to dissipate heat generated by the electronic switches, and each of the one or more heat dissipating elements is made of the thermally conductive polymer material.

A compact heat dissipation device with an improved means of heat dissipation includes a heat conducting plate, a heat dissipating fin, and a plurality of U-shaped heat transferring tubes. The heat conducting plate defines a first through hole. The heat dissipating fin is fixed on the heat conducting plate. A first end of each of the plurality of heat transferring tubes is connected to the heat dissipating fin, a second end of each of the plurality of heat transferring tubes is arranged in the first through hole so as to be side by side with each other, and side surfaces of the second ends are in surface contact. The present disclosure also provides a heat dissipation device assembling method.

A vehicular camera module includes (i) a lens holder formed of a first material, (ii) a lens barrel accommodating a lens and formed of a second material, (iii) an imager printed circuit board having an imager, and (iv) a processor circuit board having an image processor. The imager printed circuit board is attached at the lens holder with the imager aligned with the lens accommodated in the lens barrel. The processor printed circuit board has circuitry that is electrically connected to circuitry of the imager printed circuit board. The coefficient of thermal expansion of the second material forming the lens barrel is lower than the coefficient of thermal expansion of the first material forming the lens holder. Circuitry of the vehicular camera module includes connecting elements that are configured to electrically connect to a wire harness of a vehicle equipped with the vehicular camera module.