A protective shroud includes a top plate, a first side plate that is adapted to be disposed proximate a first edge region of a plurality of cooling fins of a heat exchanger for an integrated circuit, and a second side plate that is adapted to be disposed proximate a second edge region of the plurality of cooling fins.

A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.

A general purpose enclosure is provided. A general purpose enclosure for housing an internal unit and providing complete protection against an ingress of dust and water, comprising a first housing and a second housing. A plurality of cooling fins and one or more pressure ports along an exterior surface of the first housing and the second housing. One or more pressure ports comprising a pneumatic valve, pressure sensor cap and a vent membrane such that pressure venting, and pressure testing may be performed by the one or more pressure ports. A method of assembling a general purpose enclosure to an internal unit, comprising applying the first housing and the second housing to the internal unit such that the first housing and the second housing encompass the internal unit and fastening the first housing to the second house.

An electronic device includes a housing, a heat conductive portion, a circuit board, a fin set, and a fan. The housing has an accommodating space. The heat conductive portion is disposed in the accommodating space, and divides the accommodating space into a first space and a second space. The circuit board is disposed in the first space and includes a heat source. The heat source generates heat and is thermally coupled to the heat conductive portion. The fin set is disposed in the second space and thermally coupled to the heat conductive portion. The fan is disposed in the second space and located on one side of the fin set. The fan is adapted to guide an airflow through the fin set to discharge the heat generated by the heat source from the housing.

Various examples are provided for high voltage isolation. The isolation can be provided for discrete non-isolated devices using an electrically isolating substrate that is thermally conductive. In one example, a module includes a plurality of switching devices connected in series; one or more rubber buffer disposed between switching device pairs of the plurality of switching devices; and thermal interfaces disposed between switching devices of the switching device pairs and cooling surfaces of the module, the thermal interfaces electrically isolating the switching devices from the cooling surface. In another example, an extreme fast charger (EFC) station includes an active front end (AFE) module that includes at least one module, where the module is a half-bridge power module. The EFC station can include a dual-active-bridge (DAB) high voltage (HV) module that includes at least one module, where the module is a half-bridge power module.

A heat sink comprising a body non-adjustably mountable on a support provided with at least one element to be cooled, characterized in that said body comprises at least one insert that is adjustably fitted therein so that an insert contact surface comes into contact with the element to be cooled.

A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.

A heat sink structure that is used for audio equipment includes a base and a plurality of heat dissipation fins. The heat dissipation fins extend from a predetermined surface of the base in a first direction orthogonal to the predetermined surface. The heat dissipation fins are arranged side by side in a second direction orthogonal to the first direction. In a cross-section in a plane parallel to the first and second directions, (i) each of the heat dissipation fins has a first side surface and a second side surface, the first and second surfaces facing oppositely from each other in the second direction, and (ii) inclinations, relative to the predetermined surface, of the first and second side surfaces of adjacent ones of the heat dissipation fins are different from each other.

An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.

A thermal module with a heat pipe configured with a first portion configured for contact with an edge of a plurality of fins in a fin stack, a second portion configured for contact with a side of one fin in the fin stack and a sharp angled bend is formed between the first portion and the second portion to fluidly isolate the first portion from the second portion. The first portion comprises a usable length of the heat pipe that efficiently transfers heat based on phase transitioning by the fluid. The second portion is formed from at least some of the unusable length of the heat pipe. By configuring the heat pipe such that more fins contact the usable length of the heat pipe, heat transfer from the heat pipe to the fin stack is increased.