An electronic apparatus cooling device is provided with a water-cooling cold plate unit that is disposed in contact with a heat-generating element and that cools the heat-generating element directly by means of a liquid refrigerant that circulates in an inner flow path; an air-cooling fin disposed adjacent or in proximity to the water-cooling cold plate unit and having a fin tube through which the liquid refrigerant is circulated; and a refrigerant supply means that supplies the liquid refrigerant to the inner flow path of the water-cooling cold plate unit and to the fin tube in the air-cooling fin in a distributed manner.

An add-in module is provided. The add-in module includes a substrate, a plurality of first heat sources, a plurality of second heat sources, a heat sink and a heat-dissipation plate. The substrate includes a first substrate surface and a second substrate surface. The first substrate surface is opposite the second substrate surface. The first heat sources are disposed on the first substrate surface. The second heat sources are disposed on the second substrate surface. The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources, wherein the heat sink includes a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink sink base. The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources.

An apparatus comprising an ac/dc power supply for providing power to power consumers in an internet data center or to a stand-alone server includes power-handling circuitry and a passive heat-dissipation system that passively dissipates heat generated by the power-handling circuitry. The passive heat-dissipation system comprises a housing that encloses that power-handling circuitry and a thermal network that provides thermal communication between the power-handling circuitry and faces of the housing.

A housing includes a tubular housing and a first lid section. The first lid section is fitted to one end portion of the tubular housing. The tubular housing includes a first protruding section protruding toward a first lid section from a joint surface in contact with the first lid section. The first protruding section has a configuration allowing the tubular housing and a heat conductive member, to conduct heat from a heat generating body disposed inside the tubular housing, to be fixed together.

An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

A support for at least one electrical component includes a heat sink having a heat sink surface and two opposing lateral walls protruding from the heat sink surface. The heat sink includes a base body made of aluminum and a copper layer as a heat spreading layer which forms the heat sink surface. The copper layer is produced together with the base body through continuous casting, or with the copper layer being applied additively through cold gas spraying to a surface of the base body. Two spaced-apart sealing blocks lie on the heat sink surface, with each of the two sealing blocks extending between the two lateral walls and contacting the two lateral walls. A support structure is arranged on the heat sink surface between the two sealing blocks.

The invention relates to a heatsink for transferring heat from one or more electrical devices to a heat transfer medium. The heatsink includes a plurality of fins arranged on a frontside of the heatsink. The plurality of fins includes a first group of fins extending in a first planar direction and a second group of fins extending in a second planar direction angled in relation to the first planar direction. For example, the first group of fins may extend from the bottom to the top of the heatsink, while the second group of fins may extend from the first group of fins to the sides of the heatsink. In this way, the sides of the heatsink can be used as air outlets and the airflow through the heatsink can be increased.

The disclosure relates to a housing comprising at least one composite wall comprising woven or braided carbon fibers covered with a thermoplastic or thermosetting resin, an electronic card carrying electronic components, and a heat transfer device having at least one portion facing an electronic component to be cooled of the electronic card, said heat transfer device being inserted inside the composite wall, the heat transfer device comprising at least one cooling conduit containing a cooling fluid.

An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

A processor cooling system may include a processor, a shell having an interior thermally coupled to the processor to receive heat from the processor and a mass of solid to liquid (STL) phase change material filling the shell.