A heat dissipation assembly and an electronic assembly, wherein the heat dissipation assembly includes condensers and fan, the condensers each include first chamber body, second chamber body, and pipes. Two opposite ends of each pipe are respectively in fluid communication with the first and second chamber bodies, every two of the pipes located adjacent to each other define a heat dissipation gap therebetween. The first and second chamber bodies and the pipes together define a heat dissipation channel which is in air communication with the heat dissipation gaps. The fan is disposed on the condensers and in air communication with the heat dissipation channel and configured to guide an airflow flowing through the heat dissipation channel and the heat dissipation gaps so as to cool the working fluid flowing through the pipes.

An ultraviolet air sterilizer for disinfecting bacterium and virus includes a shell, a sandwich activated carbon cloth filter element, a nanometer titanium dioxide screen filter, an ultraviolet light source, a heat sinking kit, and a fan. The shell includes a shell body and a cover plate. The shell body is provided with an air inlet and an opening. The cover plate is provided with an air outlet. The sandwich activated carbon cloth filter element, the nanometer titanium dioxide screen filter, the heat sinking kit and the fan are arranged sequentially along an air path from the air inlet to the air outlet. The ultraviolet light source is configured for emitting ultraviolet light to the nanometer titanium dioxide screen filter. The air sterilizer has a compact small-sized structure and effectively removes ambient gaseous as well as particulate pollutants and kills micro-organisms harmful to health and well being.

An image capturing apparatus, including an image capturing element and having an optical axis, includes a control circuit to control the image capturing apparatus, a display panel arranged on a rear surface side of an exterior member, and a heat dissipation fan arranged on a bottom surface side of the exterior member. An image capturing element board, a control circuit board, and the display panel are arranged in a direction of the optical axis. A duct, extending from a first ventilation hole to a second ventilation hole formed to face the first ventilation hole across the optical axis, passes through an area among the image capturing element board, the control circuit board, and the bottom surface side of the exterior member. The heat dissipation fan is arranged inside the duct arranged in the area, the control circuit board, and the bottom surface side of the exterior member.

An electronic control device (ECU) is provided for an electric power and/or steer by wire steering system (EPS). The ECU includes a printed circuit board (PCB) carrying electronic components, electronic components on a lower side and on an upper side of the PCB, a heat sink element on the lower side of the PCB, and a cover on the upper side of the PCB. At least one cooling track element is provided as an at least partly over-molded insert within the cover in order to conduct heat from at least one electronic component on the upper side of the PCB to the heat sink element on the lower side of the PCB and/or to the air outside of the ECU.

A heat sink for a solid-state drive (SSD) storage device for use as an extended memory in an expansion slot of a gaming console has a metal top plate of sufficient width and length to cover the exterior opening of the expansion slot. The top plate has fins on its upper surface that extend at a diagonal across the longitudinal extent of the top plate. The heat sink further includes a metal bulk body connected to the bottom of the top plate and having a sufficient width and length to nearly fill the interior of the expansion slot and a thickness so that when the heat sink is mounted on the SSD storage device, the top plate is positioned above the upper edge of the expansion slot. A thermal adhesive is provided on the bottom of the bulk body for fastening the heat sink to the top of the SSD storage device.

An electronic control device includes an enclosure including a first enclosure having an assembly opening and a second enclosure covering the entire assembly opening, the enclosure having a communication opening communicating with the assembly opening; a circuit board accommodated in the enclosure; an integrated circuit element mounted on the circuit board; and a heat dissipating shield member thermally coupled to the integrated circuit element and grounded, wherein the heat dissipating shield member includes an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and an outer portion extending to an outside of the enclosure via the communication opening.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a peripheral cooling unit (PCU) is to be located at a periphery of a datacenter, so that it can suction air from a hot aisle that is between at least two rows of racks and can cool at least one part of such air using a primary coolant, with at least one part of cooled air to be circulated to such racks, and with a primary coolant to cool secondary coolant that is to be distributed to at least one cold plate.

The invention relates to a module (1) in which voltages greater than 1,000 V and currents greater than 100 A are applied via supply lines, with an electrically insulating carrier (2), with a connection means (3) which has a material thickness greater than 0.3 mm and is connected to the carrier (2) via a metallization area (4) which is delimited by a first end (23) and a second end (24), with electronic components (19, 20) which are connected to the connection means (3) as required, and with cooling means (14). In order that the power is supplied from the outside via the connection means (3) directly to the module and thus the bonding processes that are customary in the prior art are omitted and parasitic inductances on the power supply are avoided, the invention proposes that the connection means (3) protrudes beyond one end (23, 24) of the metallization area (4) at least at one point, is not fixed to the carrier (2) in this area (9) and has contact means (22).

An add-in module is provided. The add-in module includes a substrate, a plurality of first heat sources, a plurality of second heat sources, a heat sink and a heat-dissipation plate. The substrate includes a first substrate surface and a second substrate surface. The first substrate surface is opposite the second substrate surface. The first heat sources are disposed on the first substrate surface. The second heat sources are disposed on the second substrate surface. The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources, wherein the heat sink includes a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink sink base. The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources.

A sensor assembly for a vehicle includes a base, a sensor body mounted to the base and rotatable relative to the base around an axis in a direction of rotation, and a cover. The sensor body includes a sensor window and a wall having heat fins elongated circumferentially relative to the axis. The cover is positioned to cover the heat fins. The cover includes an inlet open in the direction of rotation. The cover defines an airflow path from the inlet through the heat fins. The cover includes an outlet positioned to direct air across the sensor window.