A heat dissipation apparatus or an inverter, includes a main heat sink, an extra heat sink, and a heat conducting element, the main heat sink includes a main substrate and a main fin, one end of the main fin is connected to the main substrate, the extra heat sink is located at an end of the main fin farther from the main substrate, the extra heat sink is detachably connected to the main heat sink, and the heat conducting element extends from the main substrate to the extra heat sink, to transfer heat between the main substrate and the extra heat sink. In this application, the heat dissipation apparatus is designed as a split structure. A dual heat dissipation function of the main heat sink and the extra heat sink improves a heat dissipation capability of the heat dissipation apparatus, and improves heat dissipation efficiency.

An aspect of the present disclosure includes a node housing for use in a broadband distribution network that includes coupling the amplifier to a lid portion and providing an interface plate in a base portion that allows for RF and power signals to be provided to the RF amplifier within the lid portion. The interface plate disposed within the base portion further preferably provides power pass-through to downstream nodes that remains electrically connected even when the amplifier is decoupled from the lid portion. Thus, the amplifier and/or lid portion may be decoupled from the base portion without disrupting power distribution to the down-stream nodes.

A rechargeable wearable electronic device is provided having a device housing with an electronic circuitry module containing a rechargeable power source and a receiver coil for wireless charging of the rechargeable power source as well as a band portion for attaching the wearable electronic device to a user appendage. The band portion includes a heat spreading layer of a thermally conductive material, such that a portion of the heat spreading layer within the device housing is in thermal contact with the electronic circuitry module. An outer skin encapsulates at least a portion of the heat spreading layer. The heat spreading layer is thermally conductive and may contain copper, aluminum, brass or other thermally conductive material.

This converter comprises: a housing having heat dissipation fins formed on the top surface thereof; a printed circuit board disposed in the inner space of the housing; and a bus bar, the bottom surface of which is in surface contact with the top surface of the printed circuit board, wherein the heat dissipation fins and the bus bar can be disposed overlapping each other in a vertical direction to enhance heat dissipation efficiency and can be further reduced in weight.

An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.

An electronic apparatus includes an interface unit including a connection unit, a heat transfer unit, a heat dissipation unit, and a fixation member. The connection unit is attachable to an interface terminal of an external apparatus. The fixation member is couplable to a fixation unit of the external apparatus. When the electronic apparatus is attached to the external apparatus, the heat dissipation unit, the heat transfer unit, and the interface unit are arranged in a layered manner in this order and are thermally coupled, and, along therewith, the fixation member is thermally coupled to the heat dissipation unit and the fixation unit.

The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.

A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.

The present disclosure provides an electrical connection apparatus which includes a receptacle and a plug. The receptacle includes a cage, a heat sink, a thermal interface material layer, and an elastic sheathing member. The heat sink is provided to the cage and has a base portion. The base portion has a lower surface, a first side edge close to the port, and a second side edge spaced apart from the first side edge. The heat sink further has two first convex portions positioned on the lower surface and adjacent to the first side edge and a first concave portion positioned on the lower surface and adjacent to the second side edge. The thermal interface material layer is provided to the lower surface of the base portion. The elastic sheathing member sheathes the heat sink and the cage. The plug includes a second convex portion positioned on an upper surface.

An electronic control device includes a first circuit board having a first mounting surface on which a first electronic component is mounted, a second circuit board having a second mounting surface on which a second electronic component is mounted, and a base member disposed between the first mounting surface and the second mounting surface so as to face the first electronic component and the second electronic component, where a first heat-conducting material is disposed between the base member and the first electronic component, a second heat-conducting material is disposed between the base member and the second electronic component, the base member includes a first region that at least does not overlap the second circuit board when viewed in a line-of-sight direction normal to the first mounting surface and the second mounting surface, and a second region that overlaps both of the first circuit board and the second circuit board when viewed in the line-of-sight direction, a heat dissipation unit including a plurality of heat dissipation fins is provided in the first region of the base member, and a ventilation hole penetrating between the heat dissipation unit and an outside is provided in the second region of the base member.