A modular electronic device is formed from a plurality of stackable hexagonal or rectangular-shaped modules. Each module is locked to another adjacent unit with an indented groove inserted through their sidewalls. Each hexagonal or rectangular module can be made of one or four extrusion elements which then can be stacked in a honeycomb or brick wall configuration.

Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprise at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy include transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.

Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.

An electronics system for an aircraft includes a mounting structure and a plate element mounted to the mounting structure with opposing face surfaces, a central region and side edge regions. A serpentine passage in the plate element contains alternating liquid slugs and vapor plugs along its length. The plate element is configured for gathering heat proximate the central region and moving the heat to the side edge regions. An electronic system is mounted on a face surface of the plate element and a heat dissipating structure is thermally coupled with the plate element and positioned along the side edge regions thereof for dissipating heat moved to the side edge regions. A cover structure covers the plate element and electronic system.

Disclosed is thermal management device that combines a vapor chamber with a mechanical heat sink to provide improved cooling performance under extreme conditions—the vapor chamber and heat sink combination comprises a single-unit device where the vapor chamber side of the device is in direct contact with the heat source and the opposite side of the vapor chamber is equipped with cooling fins that mate with cooperatively sized fins on the heat sink portion of the device.

An image capture module configured for improved heat dissipation includes an image sensor, a first heat spreading element positioned to direct heat from the image sensor along a first heat dissipation path toward a first portion of the image capture module, a processing board in data communication with the image sensor, and a second heat spreading element positioned to dissipate heat from the processing board along a second heat dissipation path toward a second portion of the image capture module. Thermal isolation is used to isolate the different heat paths. The first heat dissipation path does not overlap the second heat dissipation path, the first portion of the image capture module is separate from the second portion of the image capture module.

An efficient, high density, inline converter module includes a power conversion circuit and an input wiring harness for connecting the input of the power circuit to a unipolar source. A second wiring harness or electrical connectors may be provided for connecting the output of the power conversion circuit to a load. Connections between a wiring harness and the power conversion circuit may comprise conductive contacts, configured to distribute heat. The power circuit may be over molded to provide electrical insulation and efficient heat transfer to external ambient air. A DC transformer based inline converter module may be used in AC adapter, vehicular, and power system architectures. An input connector for connecting the input wiring harness to the input source may be provided. In some embodiments the input source may be an AC source and the input connector may comprise a rectifier for delivering a rectified, unipolar, voltage to the input of the power conversion assembly via an input wiring harness. By separating the rectifier from the power conversion assembly, the power conversion assembly may be packaged into a smaller volume than would be required if the rectifier, and its associated heat loss, were included in the power conversion assembly.

An inlet module is adapted to be disposed on a housing of an electronic device, and includes an insert board and at least one adjusting plate. The insert board has a plurality of first air passages, at least one second air passage, and at least one positioning unit. The second air passage is located between two of the first air passages, and has an area larger than that of each first air passage. The adjusting plate has an opening having an area smaller than that of the second air passage. The adjusting plate is operable to be positioned at a position where the opening and the second air passage are overlapped with each other, thereby reducing an area of the airflow passing through the second air passage.

An electronic control device (ECU) is provided for an electric power and/or steer by wire steering system (EPS). The ECU includes a printed circuit board (PCB) carrying electronic components, electronic components on a lower side and on an upper side of the PCB, a heat sink element on the lower side of the PCB, and a cover on the upper side of the PCB. At least one cooling track element is provided as an at least partly over-molded insert within the cover in order to conduct heat from at least one electronic component on the upper side of the PCB to the heat sink element on the lower side of the PCB and/or to the air outside of the ECU.

Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.