The technology of this application relates to a heat dissipation apparatus applicable to a circuit board, where a plurality of heating elements are disposed on the circuit board. The heat dissipation apparatus includes a substrate, at least one heat conductor is disposed on one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end extends toward the circuit board and is close to the heating elements. At least one heat conductor is disposed on the one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end of the heat conductor extends toward the circuit board and is close to the heating elements.

An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.

This power conversion device includes an inverter, a DC-DC converter, and a flat plate-shaped base where the inverter and the DC-DC converter are disposed on the front side and the back side. The base includes a cooling flow path having a front side flow path disposed on the front side and a back side flow path connected to the front side flow path and disposed on the back side.

A connector assembly including a shielding cage and a liquid cooling cabin. The shielding cage has an insertion space and a window in communication with the insertion space. The liquid cooling cabin is configured to allow a cooling liquid to circulate and flow inside, the liquid cooling cabin comprises a shell having an opening, a thermal coupling cover provided at the opening of the shell, and an elastic sealing unit sealing a gap between the thermal coupling cover and the shell, the thermal coupling cover having a thermal coupling plate entering into the insertion space via the window of the shielding cage, the thermal coupling plate being capable of elastically moving in a direction close to the shell and elastically restoring in a direction away from the shell by a function of the elastic sealing unit.

This document describes a thermal-control system that may be integrated into a mesh network device and associated mesh network devices. The thermal-control system, which may include a heat sink, multiple heat spreaders, and a heat shield, is such that heat originating from IC devices populating a printed circuit board of the mesh network device may be transferred to a housing component of the mesh network device for external dissipation to maintain a desired thermal profile of the mesh network device.

A flexible thermal conduit includes a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity, a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity, and a thermally conductive silicone molded over at least a portion of the first material and the second material such that the thermally conductive silicone forms the first end and the second end of the thermal conduit. The thermal conduit may be used in electronic device, such as a wearable device, to transmit heat from a heat source (e.g., a processor) to a thermal ground (e.g., a housing).

A sensing device for a vehicular sensing system includes a housing having a front housing portion and a metallic rear housing portion. A first printed circuit board and a second printed circuit board are disposed in the housing. The second printed circuit board is electrically connected to the first printed circuit board, which has an electrical connector for electrically connecting the sensing device to a vehicle wire harness. The second printed circuit board has circuitry thereat, with the circuitry generating heat when the sensing device is operating. The rear housing portion comprises a thermally conductive element that extends through an aperture of the first printed circuit board and is thermally coupled at the second printed circuit board. The thermally conductive element conducts heat generated by the circuitry of the second printed circuit board to the rear housing portion to dissipate the heat from the sensing device.

According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

A medical device includes a housing, a power supply, a thermally conductive mounting clamp, a heat shield, and at least one fastener. The housing includes a handle. The power supply is disposed within the housing. The thermally conductive mounting clamp is attached to an outer surface of the housing. The heat shield is disposed within the housing adjacent to the power supply. The heat shield is disposed against at least one interior surface of the handle. The at least one fastener passes through at least one opening in the housing and is in thermally conductive contact with the thermally conductive mounting clamp. Heat generated by the power supply is configured to dissipate from the power supply, through the heat shield, through the at least one fastener, and into the thermally conductive mounting clamp.

The present invention includes a plate member having a same sectional shape along a first direction, an opening provided at a part of the plate member, a motherboard installed on the plate member and forming a housing space between the plate member and a second principal surface of the motherboard, and a thermal-conductive electromagnetic-wave absorbing sheet installed on a rear surface of a power semiconductor device that is an electronic component mounted on the second principal surface of the motherboard from the side of the opening. The motherboard has a first principal surface including a unit mount portion on which an electronic device unit is to be mounted, and the second principal surface parallel to the first principal surface, and is installed on the plate member.