Disclosed is a hub including: a main body having a speaker for outputting sound; a communication module for wirelessly communicating with a surround ding device; a base provided below the main body to support the main body; a cover coupled to a top of the main body, the cover having an upper surface for displaying a screen based on information exchanged via the communication module; and a grille having a vertically elongated cylindrical shape and provided with a plurality of through-holes therein, the main body being provided within the grille, the grille being coupled at an upper end thereof to the cover housing and coupled at a lower end thereof to the base.

A medical device includes a housing, a power supply, a thermally conductive mounting clamp, a heat shield, and at least one fastener. The housing includes a handle. The power supply is disposed within the housing. The thermally conductive mounting clamp is attached to an outer surface of the housing. The heat shield is disposed within the housing adjacent to the power supply. The heat shield is disposed against at least one interior surface of the handle. The at least one fastener passes through at least one opening in the housing and is in thermally conductive contact with the thermally conductive mounting clamp. Heat generated by the power supply is configured to dissipate from the power supply, through the heat shield, through the at least one fastener, and into the thermally conductive mounting clamp.

An immersion-type porous heat dissipation structure is provided. The immersion-type porous heat dissipation structure includes a porous heat dissipation material in a form of a sheet. A surface of the porous heat dissipation material has a plurality of open pores that are configured to generate air bubbles. A 1 mm.sup.2 cross-sectional area of the surface of the porous heat dissipation has at least five of the open pores each having a depth greater than 25 μm.

An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.

An electrical connector, comprising a housing, a circuit board, a cable, and a shielding member. The housing comprises an accommodating space and a plurality of through grooves. The plurality of through grooves are disposed on an inner surface of the housing along a first direction at intervals. Each of the through grooves extends in a second direction and penetrates the housing. The second direction is orthogonal to the first direction. The circuit board is disposed in the accommodating space and protrudes from the housing. The cable is disposed in the accommodating space. One end of the cable protrudes from the housing. One end of the cable disposed in the accommodating space is connected to the circuit board. The shielding member is disposed in the accommodating space and covers the plurality of through grooves. The accommodating space and the plurality of through grooves are partitioned by the shielding member.

Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.

A connector, comprises: a cage having a chamber having a top wall; a radiator mounted on the top wall of the chamber; an elastic clip fixing the radiator on the top wall of the chamber and having a first side and a second side opposite to the first side in a lateral direction of the chamber; a first latch on the cage and having a slot; a second latch on the cage and having a slot; a first hook on the first side of the elastic clip engaged into the slot of the first latch from an outer side of the first latch; and a second hook on the second side of the elastic clip engaged into the slot of the second latch from an inner side of the second latch far away from the first latch and facing the first latch.

A pluggable electrical connector includes a thermally conductive housing having an opening and a circuit board having electronic components, at least one plug contact and at least one joining surface. The circuit board is surrounded by the housing. A joining seam connects the housing and the circuit board to each other. The joining seam is located between the at least one joining surface and the housing and is produced on an exterior side of the pluggable connector such that the opening is at least partially closed by the joining seam.

A display device is disclosed. The display device includes a display panel, a rear case positioned in a rear of the display panel, and of which a back surface is exposed to the outside, a backlight unit positioned between the display panel and the rear case and providing the display panel with light, a plurality of ribs extended from a front surface of the rear case and contacting at least a portion of the backlight unit, a boss forwardly extended from the front surface of the rear case, and a controller positioned between the backlight unit and the rear case and coupled with the boss.

An electronic component module assembly includes a printed wiring board, and a stiffener assembly affixed to a first side of the printed wiring board. The stiffener assembly includes an outer stiffener secured to the printed wiring board, an inner stiffener removably located in an opening of the outer stiffener. The inner stiffener has one or more inner stiffener pockets formed therein, and one or more electronic components are installed in one or more inner stiffener pockets, and electrically connected to the printed wiring board.