An electronic device includes an interposer substrate including a substrate body that includes a first principal surface and a second principal surface, a first surface terminal electrode that is provided on the first principal surface and includes a terminal electrode for heat dissipation and a terminal electrode for external connection, a second surface terminal electrode that is provided on the second principal surface, a conductor for signal transmission that is provided on the substrate body and connects the terminal electrode for external connection and the second surface terminal electrode, and a conductor for heat conduction that is provided on the substrate body and connects the terminal electrode for external connection or the second surface terminal electrode to the terminal electrode for heat dissipation.

Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.

In an embodiment, an integrated vapor chamber and heatsink includes a heatsink portion and a vapor chamber portion. The vapor chamber portion is configured to interface with a heat source to be cooled, where the vapor chamber portion includes, on an internal surface of the vapor chamber portion, a wicking structure configured to transfer a working fluid within the vapor chamber portion. The heatsink portion, the vapor chamber portion, and the wicking structure are portions of a same single printed monobody structure.

A new approach is proposed to support fan-less thermal mitigation for an industrial-grade appliance. The industrial-grade appliance may comprise a plurality of hardware components that are major sources/regions of heat production in the industrial-grade appliance. Under the proposed approach, a heatsink is included in the industrial-grade appliance to address heat dissipation for all of the major sources/regions of heat production positioned on a main board of the industrial-grade appliance. The heatsink is specifically designed to have a plurality of surfaces that are in contact with all of the major heat-producing components of the industrial-grade appliance, wherein each of the plurality of surfaces of the heatsink has a maximum overlapping surface area with at least one of the major heat-producing components in order to transfer maximum amount of heat through conduction. Under the proposed approach, the heatsink is fan-less wherein no fan is used for heat dissipation.

A heat dissipation module comprises: a heating element; a heat dissipation member disposed on one side of the heating element and including a first plate and a second plate; a third plate disposed on one side of the heating element; and a heat transfer path for transferring the heat generated from the heating element to the heat dissipation member. The heat transfer path comprises: a first path disposed between the first plate and the second plate; a third path disposed within the third plate; and a plurality of unit heat transfer paths having a second path connecting the first path and the third path, wherein the respective second paths of the plurality of unit heat transfer paths are spaced apart from each other.

Provided are a photosensitive assembly, a camera module, and an electronic device. The electronic device includes an electronic device body and a camera module mounted on the electronic device body. The camera module includes a lens and a photosensitive assembly. The photosensitive assembly includes a circuit board, a photosensitive element, a base, and an adhesive. The circuit board is provided with an accommodation cavity that extends through the circuit board. The photosensitive element is accommodated in the accommodation cavity and electrically connected to the circuit board. The base is disposed on the circuit board. The lens is located in the photosensitive path of the photosensitive element. The adhesive includes a first adhesive portion and a second adhesive portion. The first adhesive portion is located in the accommodation cavity. The second adhesive portion is located outside the accommodation cavity.

A heat dissipation structure adapted to dissipate heat from a heat-generating structure includes a heat dissipation unit and a liquid metal layer. The heat dissipation unit includes a heat dissipation body and an anti-corrosion metal layer formed on the heat dissipation body. The liquid metal layer is disposed between the heat-generating structure and the anti-corrosion metal layer, and is opposite to the heat dissipation body. An electronic device that adopts the heat dissipation structure is also disclosed.

An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.

The invention relates to the field of techniques for manufacturing electronic devices having surface-mounted components, and can be used in avionics, telecommunication, lighting technology, and other fields, and can be configured as a power source, a converter, sensors, etc. The technical result consists in improved weight and dimension characteristics, improved heat dispersion, and increased electromagnetic screening. The present electronic module comprises a printed circuit board in the form of a three-dimensional structure, faces of which are formed by flat sections of the printed circuit board, and edges of which are formed by fold lines between the sections of the printed circuit board, wherein the mounting surface of the printed circuit board faces the inside of the three-dimensional structure, and electronic components and assemblies are grouped on the mounting surface of at least two sections of the printed circuit board such that the electronic components and assemblies of one section are disposed in the empty space between the components and assemblies of another section of the printed circuit board.

A circuit card assembly comprising at least one electronic component that generates heat and a thermal management system the at least one electronic component is disclosed. The thermal management system comprises one or more phase change modules for distributing and storing heat; a metal frame in thermal contact with the at least one electronic component and having at least one opening for receiving the one or more phase change modules; and a heat transfer apparatus in thermal contact with one or more of the at least one electronic component and the metal frame. The heat transfer apparatus comprises at least one heat pipe and/or at least one heat spreader. The heat transfer apparatus provides a first heat transfer path during a period of reduced heat dissipation or cooling. The one or more phase change modules distributes and stores heat during the period of reduced heat dissipation or cooling.