A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

The technology of this application relates to a heat dissipation apparatus applicable to a circuit board, where a plurality of heating elements are disposed on the circuit board. The heat dissipation apparatus includes a substrate, at least one heat conductor is disposed on one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end extends toward the circuit board and is close to the heating elements. At least one heat conductor is disposed on the one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end of the heat conductor extends toward the circuit board and is close to the heating elements.

An electronic device is provided. The electronic device includes a display including a first area and a second area, a first housing forming a first space positioned on a rear surface of the first area, a second housing forming a second space positioned on a rear surface of the second area, a hinge assembly for causing the first area and the second area to be in a first state of forming substantially the same plane or to be in a second state of facing each other, and a plurality of front heat conduction members forming a heat conduction path between the hinge assembly and the display.

An electronics cooling system includes a printed circuit board (PCB) assembly having a heat generating component connected to a base. A plurality of thermally conductive microtubes are connected to the PCB assembly with a first spatial density. The plurality of thermally conductive microtubes are connected to a heat plate of a cooling system with a second spatial density to evenly spread the heat flux of the PCB assembly over the heat plate.

A vehicular camera module includes (i) a lens holder formed of a first material, (ii) a lens barrel accommodating a lens and formed of a second material, (iii) an imager printed circuit board having an imager, and (iv) a processor circuit board having an image processor. The imager printed circuit board is attached at the lens holder with the imager aligned with the lens accommodated in the lens barrel. The processor printed circuit board has circuitry that is electrically connected to circuitry of the imager printed circuit board. The coefficient of thermal expansion of the second material forming the lens barrel is lower than the coefficient of thermal expansion of the first material forming the lens holder. Circuitry of the vehicular camera module includes connecting elements that are configured to electrically connect to a wire harness of a vehicle equipped with the vehicular camera module.

A mobile terminal includes a main board, a heat dissipation layer, a first support, and a housing that are sequentially stacked. A heat generation element is disposed on the main board, and an orthographic projection of the heat generation element on the housing is located in an orthographic projection of the first support on the housing. The heat dissipation layer is disposed in contact with the heat generation element, and an area of an orthographic projection of the heat dissipation layer on the housing is larger than an area of the orthographic projection of the first support on the housing.

An electronic device may include a housing including a first housing and a second housing to move relative to the first housing, a flexible display supported by at least one of the first housing or the second housing and changeable in form of a display area based on a movement of the second housing relative to the first housing, a board module disposed inside the housing, and a seating portion that forms a seating space receiving the board module and supports the board module.

A sensing device for a vehicular sensing system includes a housing having a front housing portion and a metallic rear housing portion. A first printed circuit board and a second printed circuit board are disposed in the housing. The second printed circuit board is electrically connected to the first printed circuit board, which has an electrical connector for electrically connecting the sensing device to a vehicle wire harness. The second printed circuit board has circuitry thereat, with the circuitry generating heat when the sensing device is operating. The rear housing portion comprises a thermally conductive element that extends through an aperture of the first printed circuit board and is thermally coupled at the second printed circuit board. The thermally conductive element conducts heat generated by the circuitry of the second printed circuit board to the rear housing portion to dissipate the heat from the sensing device.

According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

This application discloses a liquid cooling plate radiator and a computing device adopting the liquid cooling plate radiator. The liquid cooling plate radiator includes: a radiator body; and a cooling liquid flow channel located in the radiator body, wherein a width of the cooling liquid flow channel is not less than a width of at least two chips arranged.