A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

A power conditioner is provided that includes a heat dissipating member, multiple circuit boards, and a mounting auxiliary plate. A power conditioner circuit including an electric heat generating element is formed on each of the circuit boards. The circuit boards are mounted on a front surface of the heat dissipating member. Heat dissipating fins are arranged on a back surface of the heat dissipating member. Preferably, the heat dissipating member is formed from a material having high heat dissipation property. The mounting auxiliary plate is fixed to the back surface side of the heat dissipating member and provided with a through hole for mounting to a wall. The mounting auxiliary plate has higher rigidity than the heat dissipating member.

Embodiments of a silicon-based heat dissipation device and a chip module assembly are described. An apparatus may include a silicon-based heat dissipation device, an extended device coupled to the silicon-based heat-dissipation device and heat-generating devices mounted on the silicon-based heat dissipation device. The silicon-based heat dissipation device may include a base portion having a first primary side and a second primary side opposite the first primary side. The silicon-based heat dissipation device may also include a protrusion portion on the first primary side of the base portion and protruding therefrom. The protrusion portion may include multiple fins. The base portion may include a slit opening with a first heat-generating device of the heat-generating devices on a first side of the slit opening and a second heat-generating device of the heat-generating devices on a second side of the slit opening opposite the first side of the slit opening.

An amplifier module having a surface-mounting carrier with a base and lid is disclosed. The base in a top surface thereof provides a die pad on which a transistor is mounted, and a back surface thereof provides a back pad electrically and thermally connected to the die pad. The back pad has an area wider than the area of the die pad. The heat conduction from the transistor to the host board on which the amplifier module is mounted is effectively enhanced.

According to one embodiment, a memory system includes a substrate, a first semiconductor device, a second semiconductor device, and a label. The first semiconductor device is on a first surface side of the substrate. The second semiconductor device is also on the first surface side of the substrate. The label has a first thermal conductive portion proximate to the first semiconductor device, a second thermal conductive portion proximate to the second semiconductor device, and an insulating portion that is between the first and second thermal conductive portions.

Provided are a communication system and a communication apparatus thereof, the communication apparatus includes: a bottom case and a printed circuit board mounted on the bottom case, the communication apparatus further includes a heat-conductive mounting strip, the printed circuit board being mounted on the bottom case by means of the heat-conductive mounting strip, wherein a lower end surface of the heat-conductive mounting strip is connected to the bottom case, and an upper end surface of the heat-conductive mounting strip is connected to the printed circuit board.

A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.

An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

An enclosure and a method for dispersing heat generated by an electrical component within the enclosure is provided and includes associating the electrical component with a conductive via/trace such that the conductive via/trace absorbs the heat generated by the electrical component, wherein the conductive via/trace is constructed from a heat conducting material; directing heat generated by the electrical component away from the electrical component by associating the conductive via/trace with a column having a column wall that defines a column cavity communicated with a column first opening and a column second opening, wherein the column wall is thermally conductive to receive heat flowing into the at least one of the plurality of columns; and allowing an airflow to flow through the column first opening into the column cavity and out of the column second opening, such that the airflow contacts the column wall within the column cavity.

An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.