A heat dissipation plate includes a main retaining wall, a left retaining wall, a right retaining wall, and a limiting structure. The main retaining wall has a first side edge, a second side edge, and a third side edge. The left retaining wall and the right retaining wall are respectively connected to the first side edge and the second side edge, and the main retaining wall, the left retaining wall, and the right retaining wall form a U-shaped structure. The limiting structure includes an extension portion and a limiting portion, where the extension portion has a first end and a second end opposite each other, the first end is connected to the third side edge, and the limiting portion is connected to the second end of the extension portion.

According to one embodiment, a memory system includes a substrate, a first semiconductor device, a second semiconductor device, and a label. The first semiconductor device is on a first surface side of the substrate. The second semiconductor device is also on the first surface side of the substrate. The label has a first thermal conductive portion proximate to the first semiconductor device, a second thermal conductive portion proximate to the second semiconductor device, and an insulating portion that is between the first and second thermal conductive portions.

A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

An electronic device including a first shell, a second shell, a circuit board, a heat conductive member and a heat source. The first shell is made of a metal material. The second shell is disposed on a side of the first shell. The circuit board is disposed between the first shell and the second shell, and includes a through hole that passes through both sides. The heat conductive member includes a first contact portion, an extending section and a second contact portion connected in a sequential manner. The first contact portion is located on one side of the circuit board, the second contact portion is located on the other side of the circuit board, the extending section extends through the through hole, and the first contact portion abuts against the first shell. The heat source is connected to the second contact portion.

An electronic device includes a housing and a first heat source, a second heat source, and a heat dissipation module that are disposed in the housing. The heat dissipation module includes a first fan, a second fan, a first heat conduction member, and a second heat conduction member. The first fan and the second fan are disposed on two opposite sides of the housing. One end of the first heat conduction member is disposed at the first fan, and the other end is located at a position on a side of an upper surface of the housing corresponding to the first heat source. One end of the second heat conduction member is disposed at the second fan, and the other end is located on a side of a lower surface of the housing and abuts against the second heat source.

An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.

A vehicular camera module includes a camera housing, an imager printed circuit board and a processor printed circuit board. An imager is disposed at a first side of the imager printed circuit board. A heat transfer element is accommodated in the camera housing and is in thermal conductive contact with an active cooling element and with a second side of the imager printed circuit board or the processor printed circuit board. Circuitry of the camera module is electrically connected to electrical connecting elements that electrically connect to a wire harness of a vehicle when the vehicular camera module is disposed at the vehicle. With the electrical connecting elements electrically connected to the wire harness of the vehicle, heat generated by operation of the vehicular camera module is drawn from the imager printed circuit board to the camera housing via the heat transfer element.

Separating temperature domains in cooled systems, including: cooling at least one first component of a circuit board using a first cooling system; and conductively coupling the at least one first component to at least one second component using a superconductive portion of a power plane of the circuit board.

A vehicular camera module includes (i) a lens holder formed of a first material, (ii) a lens barrel accommodating a lens and formed of a second material, (iii) an imager printed circuit board having an imager, and (iv) a processor circuit board having an image processor. The imager printed circuit board is attached at the lens holder with the imager aligned with the lens accommodated in the lens barrel. The processor printed circuit board has circuitry that is electrically connected to circuitry of the imager printed circuit board. The coefficient of thermal expansion of the second material forming the lens barrel is lower than the coefficient of thermal expansion of the first material forming the lens holder. Circuitry of the vehicular camera module includes connecting elements that are configured to electrically connect to a wire harness of a vehicle equipped with the vehicular camera module.

A method for manufacturing a circuit board includes providing an insulating substrate, defining a through hole in the insulating substrate, forming a first conductive layer on two surfaces of the insulating substrate and on an inner wall of the through hole, forming a phase change material layer on a surface of each first conductive layer, forming a seed layer on a surface of the first conductive layer, forming a second conductive layer on a surface of the seed layer, and etching the seed layer, the first conductive layer, and the second conductive layer, so that a first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite surfaces of the insulating substrate, so that the phase change material layer is embedded in the first conductive circuit layer and in the second conductive circuit layer. The application also provides a circuit board.