A heat generating component is mounted on a circuit board housed and fixed in a case including a base and a cover. Heat generated from the circuit board is transferred from a back surface of the circuit board via an insulating sheet to a heat transfer base portion formed on an inner surface of the base. Protruding portions configured to press the circuit board through elastic bodies are formed on an inner surface of the cover. When a peripheral portion of the circuit board is in pressure contact with and sandwiched between base-side and cover-side hold portions, curvature deformation of the peripheral portion of the circuit board occurs in a downward direction. Before start of the curvature deformation, the elastic bodies are brought into abutment against a front surface of the circuit board to suppress a reduction in pressure contact force on the insulating sheet.

A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

Provided are an electric control component, an air conditioner having the same, and an assembly method for the electric control component. The electric control component includes a circuit board, a chip, a radiator and a fixing member. The chip is disposed on the circuit board. The radiator is disposed at a side of the chip away from the circuit board. The fixing member is configured to rigidly connect the radiator to the circuit board. At least one of the circuit board and the radiator has an engagement portion adapted to be engaged with a pre-tightening device for clamping the radiator and the circuit board.

A driver board assembly includes a printed circuit board (PCB) substrate, one or more power devices embedded within the PCB substrate, and a plurality of conductive layers arranged within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.

A vehicular camera module includes a lens barrel having a plurality of optical elements accommodated therein, a front camera housing portion, and a rear camera housing portion mated with the front camera housing to form a housing that encases an imager printed circuit board and a processor printed circuit board. A heat transfer element is disposed between and in thermal conductive contact with the imager printed circuit board and a rear wall of the rear camera housing. The heat transfer element extends through an aperture of the processor printed circuit board. Circuitry of the camera module is electrically connected to electrical connecting elements that electrically connect to a wire harness of a vehicle when the camera module is disposed at the vehicle. Heat generated by operation of the vehicular camera module is drawn from the imager printed circuit board to the rear camera housing portion via the heat transfer element.

This heat dissipation structure includes: a circuit board; an integrated circuit mounted thereon; a first thermal pad disposed on the surface of the integrated circuit; a heat sink having a first surface that applies pressure to the first thermal pad by sandwiching the first thermal pad together with the surface of the integrated circuit and a second surface facing the first surface; a second thermal pad disposed on the second surface; a heat dissipation casing having a surface that applies pressure to the second thermal pad by sandwiching the second thermal pad together with the second surface; and stud components for pulling up the heat sink from the heat dissipation casing side together with the circuit board such that the second thermal pad is sandwiched and pressurized between the heat dissipation casing and the heat sink.

A circuit connection module include a board, an electronic component mounted on the board, and an electrically conductive member connected to the electronic component so as to be thermally conductive. The electronic component includes a heat dissipation portion exposed on an outer surface of the electronic component. The electrically conductive member includes a plate-shaped portion connected to the heat dissipation portion so as to be thermally conductive, and a terminal portion in which one end is connected to the plate-shaped portion so as to be thermally conductive and electrically conductive and the other end is in contact with a mating terminal.

Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier. The fixing device comprises: a first holder including a first cylindrically-shaped rod, wherein the first cylindrically-shaped rod can pass through a first cooling portion of the double-sided heat sink and a mounting hole of the carrier to fix the first cooling portion to a first side of the carrier, and the first cylindrically-shaped rod comprises a through-hole extending along a longitudinal direction; and a second holder including a second cylindrically-shaped rod, wherein the second cylindrically-shaped rod can pass through a mounting hole of a second cooling portion of the double-sided heat sink and the through-hole of the first holder, such that the second holder is coupled with the first holder to fix the second cooling portion to a second side of the carrier opposite to the first side.

The disclosure is directed to an electronic device with an embedded multi-layered heat slug. The electronic device in includes a substrate having a substrate body with a laminate layer. The substrate further includes a heat slug embedded within the substrate body. The heat slug includes a top layer having a first thermal conductivity and a first thermal expansion coefficient, a bottom layer having a second thermal conductivity and a second thermal expansion coefficient, and a core layer having a third thermal conductivity and a third thermal expansion coefficient. The third thermal conductivity is less than the first thermal conductivity and the second thermal conductivity, and the third thermal expansion coefficient is less than the first thermal expansion coefficient and the second thermal expansion coefficient. In certain embodiments, the top layer and the bottom layer comprise copper, and the core layer comprises copper-molybdenum.

The present disclosure provides a connector assembly comprising a cage and a heat sink. The cage has a receiving space and a wall constituting the receiving space, the wall is formed with a window which is communicated with the receiving space and two latching plates which are provided to two sides of the window and extend away from the receiving space, each latching plate is integrally formed with a latching protrusion, the latching protrusion has a guiding portion and a latching portion, a protruding amount of the guiding portion from the latching plate gradually increases as a distance of the guiding portion from the receiving space decreases, the latching portion is positioned to a tip end surface of the guiding portion. The heat sink has a base plate, in a process that the heat sink is assembled to the cage, the base plate pushes against the guiding portions of the latching protrusions of the two latching plates to make the two latching plates elastically move, after the base plate passes over the guiding portions of the latching protrusions of the two latching plates, the latching portions of the latching protrusions of the two latching plates latch with the base plate.