A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.

An electrical connector assembly includes a seat unit and a cover unit. The seat unit defines a receiving cavity for receiving the CPU. The cover unit is pivotably mounted upon one end of the seat unit. The cover unit includes a first cover and a second cover surrounding the first cover. The first cover includes a first frame equipped with therein a floating heat sink which is located above and aligned with the receiving cavity. The heat sink forms a pair of side extensions sandwiched between a pair of pressing blocks and the first frame in a vertical direction and essentially downwardly pressed by the pair of pressing blocks of the first cover in a resilient manner. Resilient mechanism is provided between the pressing block and the heat sink to result in a downward force constantly urge the heat sink downwardly against the first frame.

A display assembly for an imaging device including a display panel, a display, a first control unit, a second control unit and a thermally insulating layer, and a housing. The thermally insulating layer divides the housing in at least a first cavity including the first control unit and a second cavity including the second control unit. The thermally insulating layer preventing heat generated in the first cavity or the second cavity from reaching the other cavity and including an electrically conductive material to at least partially shield electromagnetic radiation generated in the first or the second cavity from reaching the other cavity.

A heat-insulation device and an electronic product, the heat-insulation device is of a closed hollow structure, and includes a first cover body and a second cover body arranged opposite to each other; a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; and a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with an inner wall surface of the first cover body.

A cooling device for a heterogeneous microchip is fabricated such that different cooling profiles can be provided for different chips. A housing is made of thermal conductive material, the housing having a plurality of channels formed therein. Electric contacts are provided inside each of the channels. Each channel can fit either a thermoelectric cooling device or a metallic block to provide different cooling profiles and design requirements. The cooling device is inserted between a liquid cooling plate and the chip to adjust and enhance heat transfer from the chip to the cooling plate. Alternatively, the cooling plate itself can serve as the housing with the channels, in which case the housing is provided with coupling for liquid pipes or hoses.

A composite pin fin heat sink configured to dissipate heat generated by a heating element including a background region and a hot spot region having a higher temperature than the background region while the heating element is generating heat, the heat sink including a base plate having a first surface and a second surface, the first surface being configured to contact the heating element; and an array of pin fins protruding from the second surface and arranged at regular intervals. The base plate and the array of pin fins are divided into a first heat sink region corresponding to the hot spot region of the heating element, and a second heat sink region corresponding to the background region of the heating element. The first heat sink region is made of a material having a higher thermal conductivity than a material of which the second heat sink region is made.

An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Disclosed are a heat sink base and a heat sink. The heat sink base includes a base body. The bottom of the base body is provided with at least one protruded structure, and the bottom of the base body abuts against the top of the CPU. Each of the at least one protruded structure includes a gentle region with a protrusion, and a slope region surrounding the protruded gentle region with the protrusion. The gentle region of the protruded structure abuts against a high heat flux region at the top of the CPU, thus forming a region with relatively high pressure and relatively stable pressure compared with the slope region. Therefore, the heat sink base provided by the present invention has a simple and reasonable structure, and can efficiently dissipate the heat generated by the CPU, thus improving the cooling efficiency and obtaining more stable and more consistent cooling performance.

Embodiments of the disclosure relate generally to thermal control and management in hardware devices. A thermal control system includes a thermal node, a thermal bridge, and a thermal controller. The thermal node is configured to receive heat generated in a device. The thermal controller is configured to in response to an environment temperature of the thermal controller being greater than a first threshold temperature, cause heat transfer from the thermal node to a first heat sink and prevent heat transfer from the thermal node to a second heat sink. The thermal controller is also configured to, in response to the environment temperature of the thermal controller being greater than a second threshold temperature, cause heat transfer from the thermal node to the second heat sink and prevent heat transfer from the thermal node to the first heat sink.

A heat exchanger assembly includes a housing having at least one area of heat flux and a fluid circuit arranged within an interior of the housing. The fluid circuit having an inlet manifold, an outlet manifold, and at least one fluid passage connecting the inlet manifold and the outlet manifold. The at least one fluid passage is positioned relative to the housing to perform localized cooling of the housing at the at least one area of heat flux. A cooling medium circulates through the fluid circuit.