This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

A heat dissipation module is provided. The heat dissipation module includes a heat dissipating sheet and a heat conduction member. The heat dissipating sheet has a first surface and a second surface. The heat conduction member is disposed on the first surface of the heat dissipating sheet, and the second surface of the heat dissipating sheet is configured to be arranged adjacent to a periphery of a heating source. At least a part of a surface of the heat conduction member that is adjacent to the first surface has an uneven surface.

Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. The computing device of the disclosure includes a device housing enclosing an enclosed heat-dissipation air duct, and the computational heat dissipation structure; the computational heat dissipation structure is located in the enclosed heat-dissipation air duct. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies of the heating components are balanced, and load of a fan is reduced. Therefore, the mine provided by the disclosure avoids the problem of overheating damage of the heating components even if a large number of computing devices are gathered in the same space.

A heat radiation structure (10) includes a casing (4) configured to accommodate a heating element (1), and a heat-sink type component (2) configured to directly or indirectly absorb heat from the heating element (1), contactlessly face the casing (4), and conduct the heat to the casing (4) via air existing in an internal space of the casing (4), wherein at least either the heat-sink type component (2) or the casing (4) is configured in such a way that, when heat is generated from the heating element (1), a distance between the heat-sink type component (2) and the casing (4) becomes nearer in a region of the internal space (3) in which temperature does not rise relatively easily than in a region of the internal space (3) in which temperature rises relatively easily.

Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.

An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.

This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (ΔT) between the electronic devices.