An enclosure and a method for dispersing heat generated by an electrical component within the enclosure is provided and includes associating the electrical component with a conductive via/trace such that the conductive via/trace absorbs the heat generated by the electrical component, wherein the conductive via/trace is constructed from a heat conducting material; directing heat generated by the electrical component away from the electrical component by associating the conductive via/trace with a column having a column wall that defines a column cavity communicated with a column first opening and a column second opening, wherein the column wall is thermally conductive to receive heat flowing into the at least one of the plurality of columns; and allowing an airflow to flow through the column first opening into the column cavity and out of the column second opening, such that the airflow contacts the column wall within the column cavity.

The electronic cabinet for enclosing electronic components generally has a housing having a base and a cover being connected to one another a plurality of lateral walls, one of the plurality of lateral walls having a first opening; a lateral perforated plate being mounted to the housing and extending over the first opening, the lateral perforated plate having a plurality of perforations; and a protector plate being mounted to the housing and extending over the lateral perforated plate to cover the plurality of perforations of the lateral perforated plate, the protector plate defining at least one air inlet between the protector plate and the lateral perforated plate.

The electronic cabinet for enclosing electronic components generally has a housing having a base and a cover being connected to one another a plurality of lateral walls, one of the plurality of lateral walls having a first opening; a lateral perforated plate being mounted to the housing and extending over the first opening, the lateral perforated plate having a plurality of perforations; and a protector plate being mounted to the housing and extending over the lateral perforated plate to cover the plurality of perforations of the lateral perforated plate, the protector plate defining at least one air inlet between the protector plate and the lateral perforated plate.

An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.

An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.

An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.

The present disclosure discloses a cold plate type data center device and a data center, which may at least include a cabinet, a heat transfer component, a circulation branch, a circulation component and a detachable mechanism, where a heat dissipation element is arranged in the cabinet. One end of the heat transfer component is in contact with the heat generating spot of the heat dissipation element, and other end of the heat transfer component passes through the cabinet and is positioned in a circulation cavity in the circulation branch. The circulation branch is communicated with the circulation component, such that a refrigerant in the circulation component flows through the circulation branch. The detachable mechanism connects the circulation component to the cabinet, and hermetically connects the circulation branch to the other end of the heat transfer component.

An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.

A releasable clamping device is provided. The device includes a plurality of wedge members that slidably are disposed upon a carrier, with an input disposed in conjunction with a first wedge member. The input interacts with a projection and when the input is moved the first wedge members slides along the carrier. Motion of the first wedge member causes vertical motion of the second and fourth wedge members, which in combination cause the thickness of the releasable clamping device to increase, which frictionally retains the carrier and associated components thereon (such as a PCB) within a housing. The input may be moved in an opposite direction which causes the first wedge member to slide along the carrier in an opposite direction and causes the second and fourth wedge members to vertically move toward the carrier thereby narrowing the overall thickness of the device to allow removal of the carrier.