Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.

A system includes a pair of chassis, a housing, and a cooling module. Each chassis including multiple rails with adjacent rails defining card slots. The housing connected to the chassis in first card slots on the pair of chassis and formed to contain electronic components including a heat generating component. The cooling module connected to the chassis in second card slots on the pair of chassis and formed to contact the heat generating component through an aperture in the housing.

A two-card assembly includes a first printed wiring board (PWB) on a first side of the two-card assembly, and a first stiffener secured to the first PWB. The two-card assembly also includes a second PWB on a second side of the two-card assembly, and a second stiffener secured to the second PWB. A center stiffener is disposed between the first stiffener and the second stiffener, and one or more electronic modules are secured to the center stiffener. The center stiffener dissipates heat from the one or more electronic modules.

A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

A circuit board separation mechanism may include a separation block positioned within a separation block cut-out of a heatsink. The heatsink may be positioned between a first circuit board including a first component of at least one connector and a second circuit board including a second component of the at least one connector. The circuit board separation mechanism may include a set screw inserted in the separation block. A portion of the set screw may be configured to engage a surface of the heatsink. The separation block may be configured to lift against a surface of the first circuit board when the set screw is rotated. The first component of the at least one connector and the second component of the at least one connector may be configured to separate when the set screw is rotated and the separation block lifts against the surface of the first circuit board.

Embodiments can provide a shutter assembly to improve heat transfer for an electronic component within an enclosure, the shutter assembly including: a shutter body comprising a distal end, a proximal end, a back surface and a flat facing surface extending from the distal end at an angle relative to the back surface, wherein the flat facing surface is configured to contact a surface of a connector body inserted within a base chassis within the enclosure to transfer heat from the connector body to the enclosure; and a spring mechanism coupled to the shutter body to apply rotational force on the shutter body to cause the flat facing surface of the shutter body to contact the surface of the connector body when the connector body is inserted in the enclosure to thereby conduct heat from the connector body to the enclosure.

An electronics enclosure can be a line replaceable unit for installation in a chassis having actively cooled cold plates. The electronics enclosure has a housing, heat spreaders, and moveable heat spreaders. The electronics enclosure can be positioned in the chassis with the moveable heat spreaders close to the housing and thereafter the moveable heat spreaders can be moved away from the housing to press against the cold plates. Heat from electronics within the electronics enclosure can pass from the housing, through the heat spreaders, through the moveable heat spreaders, and into the cold plates.

A two-card assembly includes a first printed wiring board (PWB) on a first side of the two-card assembly, and a first stiffener secured to the first PWB. The two-card assembly also includes a second PWB on a second side of the two-card assembly, and a second stiffener secured to the second PWB. A center stiffener is disposed between the first stiffener and the second stiffener, and one or more electronic modules are secured to the center stiffener. The center stiffener dissipates heat from the one or more electronic modules.

A circuit board separation mechanism may include a separation block positioned within a separation block cut-out of a heatsink. The heatsink may be positioned between a first circuit board including a first component of at least one connector and a second circuit board including a second component of the at least one connector. The circuit board separation mechanism may include a set screw inserted in the separation block. A portion of the set screw may be configured to engage a surface of the heatsink. The separation block may be configured to lift against a surface of the first circuit board when the set screw is rotated. The first component of the at least one connector and the second component of the at least one connector may be configured to separate when the set screw is rotated and the separation block lifts against the surface of the first circuit board.