Systems (300) and methods (1200) for inserting an electronic module in a structure. The methods comprise: sliding at least one glide mechanism on a rail of the structure or a surface of the electronic module as the electronic module is being inserted into the structure; actuating a coupler to secure the electronic module to the rail and compress a thermal interface material between the electronic module and the rail; thus causing the glide mechanism to be retracted into the electronic module or rail while the coupler is being actuated. The thermal interface material first comes in contact with the rail while the coupler is being actuated. The glide mechanism is integrated with the electronic module or the rail and is resiliently biased in a direction away from the electronic module or rail so as to partially extend out from the electronic module in a direction towards the electronic module or rail.

An aircraft includes an enclosure positioned in a crown of the aircraft and extending in a direction parallel to a longitudinal axis of the aircraft. The crown is above a passenger cabin of the aircraft. The aircraft includes an equipment rack coupled to a first side of the enclosure. The equipment rack is configured to hold at least one electronic component. The aircraft further includes an entryway on a second side of the enclosure that is opposite to the first side. The entryway provides access to the enclosure from the passenger cabin.

A cooling system for cooling circuit boards. The cooling system includes a casing, which includes at least two board slots and at least one cooling plate between the two board slots; at least one cover, which is placed on a circuit board to be secured to one of the board slots; and at least one wedge placed on the cover. The wedge provides thermal conductivity between the circuit board and the cooling plate when the circuit board is placed into the board slot; and at least one wedgelock that secures the circuit board to the board slot.

Various embodiments of the present disclosure provide a heat sink for a plug-in card and a plug-in card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.

The disclosed information technology rack may include (1) a frame with a group of vertical support bars that together define an equipment bay for housing information technology modules, where each vertical support bar is oriented substantially perpendicular relative to a floor on which the information technology rack stands and (2) a mounting structure, coupled to the vertical support bars of the frame, that is configured to mount at least one information technology module to the frame within the equipment bay in a substantially non-horizontal orientation relative to the floor on which the information technology rack stands.

An example system includes an enclosure housing electronics that generate heat. The enclosure includes a vent leading to an exterior of the enclosure. The vent is configured to allow the heat generated by the electronics to escape to the exterior. The enclosure includes an inlet configured to direct air into the enclosure. The vent and the inlet are arranged so that the heat escaping from the vent suctions the air through the inlet. The example system also includes a radiator having an input port and an output port. The input port is located exterior to the enclosure and the output port is connected to the inlet so that the air suctioned through the inlet causes air from the exterior to enter the radiator through the input port and to pass to the output port. The radiator is submerged, at least in part, in a coolant.

Aspects of the disclosure generally relate to at least one device for heat transfer or dissipation. The at least one device for heat transfer or dissipation can include an air-to-air heat exchanger. The air-to-air heat exchanger can include an air flow inlet and various slots to establish a flow-through air path.

A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

An integrated adapter configured to hold two first circuit card assemblies in a larger second circuit card assembly space includes a thermally-conductive frame and two vertical thermally-conductive guide rails in the inboard region of the frame front. A channel is formed in each of the two guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail, each configured to receive and support an edge of a first circuit card assembly, and the frame is configured to be attached to a second circuit card assembly, thereby forming an integrated adapter circuit card. Various circuit card sizes can be adapted for use, including supporting two 3U circuit cards in a 6U circuit card space. A method of making the integrated adapter is also disclosed.

An example system includes an enclosure housing electronics that generate heat. The enclosure includes a vent leading to an exterior of the enclosure. The vent is configured to allow the heat generated by the electronics to escape to the exterior. The enclosure includes an inlet configured to direct air into the enclosure. The vent and the inlet are arranged so that the heat escaping from the vent suctions the air through the inlet. The example system also includes a radiator having an input port and an output port. The input port is located exterior to the enclosure and the output port is connected to the inlet so that the air suctioned through the inlet causes air from the exterior to enter the radiator through the input port and to pass to the output port. The radiator is submerged, at least in part, in a coolant.