A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

An airflow guiding mechanism includes a housing and a shielding assembly. The housing includes an airflow guiding portion and a guiding track. The shielding assembly is movably connected to the guiding track. The shielding assembly is able to move within the airflow guiding portion along the guiding track. In an embodiment, the shielding assembly may include a first shielding plate and at least one second shielding plate. The first shielding plate is connected to the housing. The at least one second shielding plate and the first shielding plate are movably connected to each other. The at least one second shielding plate are able to move with respect to each other to be folded and unfolded, so as to open and shield the airflow guiding portion.

A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.

A thermal module for cooling a plurality of component and cooling a bottom cover of a sealed chassis. A pair of fans are positioned in the chassis, wherein each fan has a first fan outlet directing a first portion of the airflow toward a first fin stack near a vent in the back cover, a second fan outlet for directing a second portion of the airflow to a second fin stack near a vent in a side cover, and a third fan outlet for directing a third portion of the airflow to a set of components in the chassis or a surface of the chassis. The size of each fan outlet and the size and impedance of the first fin stack and the second fin stack are configured to ensure the airflow is distributed according to a ratio based on cooling a set of components in the chassis and a bottom cover of the chassis.

An air mover assembly may include an air mover comprising a body and a cable extending from the body and one or more air mover holders mechanically coupled to the body. The one or more air mover holders may comprise a plurality of cable maintenance features and a keying feature. The plurality of cable maintenance features may include a first cable maintenance feature configured to maintain the cable in a first configuration of the air mover in a first airflow direction and a second cable maintenance feature configured to maintain the cable in a second configuration of the air mover in a second airflow direction. The keying feature may be configured to mechanically interface with an interfering feature of a chassis when an attempt is made to improperly insert the air mover into the chassis in accordance with a proper airflow direction configuration of the chassis, in order to prevent improper insertion of the air mover into the chassis in accordance with the proper airflow direction configuration of the chassis.

The invention concerns a helicopter ventilation architecture, said helicopter comprising at least two avionics bays (112a, 112b) comprising electronic equipment (116a, 116b) to be ventilated, said architecture comprising, for each avionics bay, an air inlet (120a, 120b) allowing outside air to enter the avionics bay in order to ventilate said avionics bay, and an air outlet (124a, 124b), allowing the air ventilating the avionics bay to exit the avionics bay, characterised in that the ventilation architecture further comprises a mixing chamber (134), connected to the air outlets, configured to receive the air originating from all the avionics bays, at least one air duct (138a, 138b), connected to the mixing chamber and to an outlet (130a, 130b) for discharging the air to the outside, and at least two fans (128a, 128b), arranged and distributed in the air duct or ducts.

A modular data center includes a base electrical module having a casing, a controller supported by the casing, and a power distribution unit coupled to the controller. The modular data center further includes an equipment rack having a frame coupled to the base electrical module, with the frame of the equipment rack being configured to receive electronic equipment. The electronic equipment receives power from the base electrical module. The base electrical module is external to the equipment rack.

A housing for an electricity charging station includes a base frame having a mounting rack, a cover connected to the base frame, two doors hinged on the base frame, a base connected to the base frame, two faceplates inserted into the base and two cable panels embedded in the base. A corresponding electricity charging station and a corresponding method for producing or assembling such a housing.

A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.