A crimping power module includes a shell (10), a cover (12), and an electric insulation substrate (13) crimped to a heat dissipation device. The cover and the substrate are respectively mounted to a first surface (111) and a second surface (112) of the shell. The second surface defines an annular slot (113) in a position facing sides of the substrate. The slot is embedded with a first elastic member (15) elastically abutted against the substrate. The elastic member is higher than the second surface, allowing the shell to adjust a pressure flexibly applied on the heat dissipation device by the substrate. An elastic buffer is provided through defining the slot embedded with the elastic member, to prevent the substrate from fracturing, and adjust the pressure to ensure tight crimping between the substrate and the heat dissipation device, which decreases thermal resistance, and increases heat dissipation efficiency.

Electrical power is provided to power consuming, heat-exhausting devices by multiple gas-fueled electrical power sources located near such devices. Exhaust heat from such devices is utilized as intake cooling air for the gas-fueled power sources, thereby excluding them from cooling capacity requirements. The gas piping delivering gas to gas-fueled power sources is positioned so as to be within hot aisles comprising exhaust heat. The gas piping is located up high for lighter than air gasses and near the floor for heavier than air gasses, with leak detection located nearby. Additionally, gas piping is externally coated with material that visually indicates a leak. By locating gas piping in the hot aisle, exhausted heat increases temperature and, thereby, pressure of the gas, resulting in more efficient gas distribution through the piping and preventing valve freezing. Furthermore, the gas piping is located after potential ignition sources in the airstream.

A housing for an electricity charging station includes a base frame having a mounting rack, a cover connected to the base frame, two doors hinged on the base frame, a base connected to the base frame, two faceplates inserted into the base and two cable panels embedded in the base. A corresponding electricity charging station and a corresponding method for producing or assembling such a housing are disclosed.

A server cabinet, including: a cabinet body having a plurality of regions including a first region to store a server, a power supply region to store a power supply, a second region to store the server and a switch; and a cabinet backboard positioned at a back side of the cabinet body, and including a plurality of management backboards and a plurality of fans, in which each of the plurality of management backboards is respectively connected with the server and a central management module of the server cabinet, the server is connected with the corresponding management backboard via a connector and controlled by the central management module via the cabinet backboard. The server cabinet according to embodiments of the present disclosure can achieve a replacement of the management backboard and the server without powering off, thus greatly improving an operation and maintenance of the server cabinet.

An electronic equipment chassis assembly includes a housing, and a plurality of openings defined in the housing that allow airflow there-through. The openings include at least one intake opening defined in the front surface of the housing and at least one exit opening defined in the rear surface of the housing. The chassis also includes an air filter, and one or more rails disposed within the housing defining receiving slots that releasably secure a first plurality of circuit boards, and a second plurality of circuit boards, which second plurality of circuit boards are orthogonally oriented relative to the first plurality of circuit boards. The chassis includes an airflow assembly proximate the top surface of the housing, and one or more output fans proximate the rear surface of the housing. The airflow assembly and the output fans balance airflow throughout the chassis.

A cooling apparatus includes an assembly including an electronic device and a potting material that covers a side portion and an upper portion of the electronic device, the assembly having a conical upper portion, and a cooling plate including a conical hole, into which the upper portion of the assembly is fitted, and a flow path, through which a coolant flows.

A configurable housing includes a top surface having a closed configuration and an opened configuration in which a first plurality of perforations provide a first air flow path. The housing further includes a plurality of sidewalls connected to the top surface. The plurality of sidewalls including a first sidewall having a closed configuration and an opened configuration in which a second plurality of perforations provide a second air flow path. The housing also includes a bottom surface connected to the plurality of sidewalls.

A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. Other embodiments are disclosed.

The disclosure discloses an air deflection plug-in box for a forced air-cooled cabinet. The air deflection plug-in box includes a front vertical plate with one or more vent holes, a rear vertical plate with one or more vent holes, two side vertical plates with hangers and an air deflection diaphragm arranged to isolate air areas, wherein the front vertical plate, the rear vertical plate, the two side vertical plates and the air deflection diaphragm are fixedly connected into a whole to distinctively guide cold airflow on one side of the air deflection diaphragm and guide hot airflow on the other side of the air deflection diaphragm. One or more thermal barriers are also arranged on at least one surface of the air deflection diaphragm, and each thermal barrier is made from thermal insulation material.

A circuit board and fan frame connection structure includes a fan frame, a circuit board and an adhesive member having multiple through holes. The fan frame includes a bottom board, a bearing cup disposed at the center of the bottom board and multiple perforations formed through the bottom board. The bottom board has an upper surface and a lower surface. The circuit board is adhered to the lower surface of the bottom board via the adhesive member. The electronic components arranged on the circuit board pass through the aligned through holes and perforations.