H05K7/20554

Cooling Systems for Devices Arranged in Rows

Cooling systems for devices arranged in rows are disclosed. An example cooling system for a datacenter includes a supply air duct to extend lengthwise above a first space between a first row of computers and a second row of computers. The example cooling system further includes a branch air duct attached to the supply air duct to extend downward from the supply air duct into the first space.

Scalable rack-mount air-to-liquid heat exchanger

An Information Handling System (IHS) includes at least one node provisioned with heat-generating components and an air passage that enables air to pass through the node and exit the node as exhaust air. An air-to-liquid heat exchanger (ATLHE) block is placed in a path of the exhaust air. The ATLHE block has an air directing structure, one or more air movers to move the exhaust air through the air directing structure, and an ATLHE. The ATLHE includes a liquid transfer conduit having at least one liquid supply port extending into a heat transfer section, which terminates into at least one liquid return port, the liquid transfer conduit enabling cooling liquid transfer through the ATLHE. A liquid cooling subsystem includes supply and return conduits. The supply conduit is sealably mated to the at least one supply port and the return conduit is sealably mated to the at least one return port.

Cooling Systems for Devices Arranged in Rows

Cooling systems for devices arranged in rows are disclosed. An example cooling system for a datacenter in a building includes a supply air duct to extend lengthwise along a first aisle within the building. The first aisle is defined between a first row of computers and a second row of computers. The first row of computers provides passage of a first current of air from the first aisle to a second aisle on an opposite side of the first row of computers. The supply air duct is to be positioned with an upper section that is higher than a top surface associated with the first and second rows of computers. The cooling system includes a first wing to extend from the supply air duct toward the first row of computers, and a second wing to extend from the supply air duct toward the second row of computers.

SYSTEM AND METHOD OF PROVIDING COMPUTER RESOURCES
20180168074 · 2018-06-14 ·

A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. Other embodiments are disclosed.

METHOD AND APPARATUS FOR HEAT-DISSIPATION IN ELECTRONICS
20180124953 · 2018-05-03 ·

A method and apparatus for heat-dissipation utilizing a fin assembly including one or more fins organized on a wall or base surface. The fins can extend into a flow of fluid passing along the wall or base surface to convectively cool the fins, which can transfer heat from heat-producing components, such as electronics.

COOLING SYSTEMS FOR DEVICES ARRANGED IN ROWS

Cooling systems for devices arranged in rows are disclosed. An example cooling system includes an inflatable air duct to be positioned above a cold aisle defined between two rows of electronic equipment. The inflatable air duct is to be air permeable to deliver conditioned air into the cold aisle. The electronic equipment has fans to force cool air within the cold aisle through the electronic equipment to adjacent hot aisles on opposite sides of the two rows of the electronic equipment. The inflatable air duct to be spaced apart from the rows of computers such that the cold aisle is in unobstructed fluid communication with the adjacent hot aisles over top of the rows of electronic equipment. The conditioned air delivered from the inflatable air duct to substantially prevent a mixing of warm air in the hot aisles with the cool air in the cold aisle.

Bay for removable device

According to some examples, a bay is provided to receive at least a portion of a housing of a removable device, where the bay includes a management controller to communicate a management signal to the removable device received by the bay, and a cooling mechanism to provide airflow to the removable device received by the bay. The removable device may be one that receives an optical cable, receives an electrical cable, converts a first optical signal received through the optical cable to a first electrical signal transmitted through the electrical cable, and converts a second electrical signal received through the electrical cable to a second optical signal transmitted through the optical cable.

Cooling systems for devices arranged in rows

An example cooling system for a datacenter is disclosed. The datacenter includes a plurality of computers arranged in a row within a building. The row of computers separates a cold aisle and a hot aisle. The row of computers defines an air passageway between the cold aisle and the hot aisle. The row of computers is associated with a top surface that is below and spaced apart from an overhead surface of the building to define a gap between the top surface and the overhead surface. The example cooling system includes an inflatable air duct to be disposed within the gap. The inflatable air duct has selectively an inflated state and a deflated state. The inflatable air duct filling more of the gap when the inflatable air duct is in the inflated state than when the inflatable air duct is in the deflated state.

COOLING APPARATUS AND INFORMATION PROCESSING APPARATUS
20180046233 · 2018-02-15 · ·

A cooling apparatus includes an assembly including an electronic device and a potting material that covers a side portion and an upper portion of the electronic device, the assembly having a conical upper portion, and a cooling plate including a conical hole, into which the upper portion of the assembly is fitted, and a flow path, through which a coolant flows.

Data Centre
20180020576 · 2018-01-18 ·

A data centre (100) includes at least one rack room (in for example module 140) having a floor and a plurality of rack storage areas on the floor, each rack storage area being arranged to accommodate a plurality of racks (143) in which a plurality of rack-mountable electronic components may be housed, one or more controllable air circulation systems (in for example module 122), one or more cold aisles (144) in the rack room, each cold aisle being adjacent to a rack storage area, and one or more hot aisles (145) in the rack room, each hot aisle being adjacent to a rack storage area. There may be a large air duct, in the form of a personnel corridor (123), for transporting, under the control of the one or more air circulation systems, cooling air, above the floor, to the one or more cold aisles. The air supply corridor/duct (123) may have a height greater than 1.5 m above the floor and a cross-sectional area of at least 2 m.sup.2 and a maximum dimension in the plane of the cross-section of less than 3 m.